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1.
Co-browsing is an activity in which a group of users navigate their way through of a set of Web pages together for a shared
purpose. Effective co-browsing among users with different device capabilities requires a shared understanding of those Web
pages. This paper demonstrates the concept of shared viewpoints (SVPs), and personal viewpoints (PVPs), for co-browsing, before
detailing a framework for implementing these concepts. Finally, the effectiveness of the framework is presented through a
perceptual experiment. 相似文献
2.
Baeyens Y. Georgiou G. Weiner J.S. Leven A. Houtsma V. Paschke P. Lee Q. Kopf R.F. Yang Yang Chua L. Chen C. Liu C.T. Young-Kai Chen 《Solid-State Circuits, IEEE Journal of》2002,37(9):1152-1159
The combination of device speed (f/sub T/, f/sub max/ > 150 GHz) and breakdown voltage (V/sub bceo/ > 8 V) makes the double heterojunction bipolar InP-based transistor (D-HBT) an attractive technology to implement the most demanding analog functions of 40-Gb/s transceivers. This is illustrated by the performance of a number of analog circuits realized in an InP D-HBT technology with an 1.2- or 1.6-/spl mu/m-wide emitter finger: a low phase noise push-push voltage-controlled oscillator with -7-dBm output power at 146 GHz, a 40-GHz bandwidth and low-jitter 40-Gb/s limiting amplifier, a lumped 40-Gb/s limiting driver amplifier with 4.5-V/sub pp/ differential output swing, a distributed 40-Gb/s driver amplifier with 6-V/sub pp/ differential output swing, and a number of distributed preamplifiers with up to 1.3-THz gain-bandwidth product. 相似文献
3.
The continuous reduction of chip size driven by the market demand has a significant impact on circuit design and assembly process of IC packages. Shrinking chip size and increasing I/O counts require finer bond pad pitch and bond pad size for circuitry layout. As a result, serious wire deflection during transfer molding process could make adjacent wires short, and this issue becomes more critical as a smaller wire diameter has to be applied for the finer pitch wire bonded IC devices.This paper presents a new encapsulation process development for 50 μm fine pitch plastic ball grid array package. Since reduced wire diameter decreases the bending strength of bonded wires significantly, wire deflection during molding process becomes quite serious and critical. Experiments on conventional transfer molding were conducted to evaluate wire span threshold with 23.0 μm diameter gold wire. The results show that the wire span threshold is about 4.1 mm, which is much shorter than the wire span threshold of over 5.0 mm for wire with 25.4 μm diameter. Finite element analysis shows there is a significant difference in the wire deflection between 23.0 μm gold wire and 25.4 μm gold wire diameter under the same action of mold flow. A novel encapsulation method is introduced using non-sweep solution. The wire span could be extended to over 5.0 mm with wire sweep less than 1%. Reliability tests conducted showed that all the units passed 1000 temperature cycles (−55 to 125 °C) with JEDEC moisture sensitivity level 2a (60 °C/60% relative humidity for 120 h) and 3 times reflow (peak temperature at 220–225 °C). It is believed that this solution could efficiently overcome the risk of wire short issues and improve the yield of ultra fine pitch wire bonds in high-volume production. 相似文献
4.
The Asia-Pacific region is one of the fastest growing regional economies in the world today. The region is home to over half of the global population and is one of the most important markets for multinational corporations to penetrate. The wind power sector is no exception. Wind resources remain untapped and the demand for electricity continues to grow as a result of expanding and modernizing economies. Godfrey Chua, Emerging Energy Research USA reports on the current status and development of the wind industry in the region. 相似文献
5.
Pull-out experiments have been carried out on single production fibres under carefully controlled conditions. Four parameters were determined. The interfacial yield stresses, of about 9–14 MPa, were very much smaller than the shear strengths of the bulk polymers in the case of an epoxy, whether post-cured or not, and a non-post-cured polyester. Values for the work of fracture of the interface varied from 140 to 300 Jm?2, and again were less than those of the polymer. Interface failure sometimes took place in the epoxy rather than at the fibre surface, whereas with the polyester it always took place at the fibre surface. After interface failure, pull-out was governed by friction, with maximum shear stresses of 7–10 MPa for polyester, and 21–34 MPa for epoxy, the higher values being obtained for the post-cured resins. Average frictional shear stresses were sometimes less than a half of the maximum shear stress, indicating that the fibre Poisson's shrinkage was playing an important role in the pull-out process. A silicone release agent reduced the frictional shear stresses to 2·5 MPa, with both resins. 相似文献
6.
H.W. Wan T.C. Chong S.J. Chua 《Photonics Technology Letters, IEEE》1991,3(8):730-732
It is shown that In/sub 1-x/Ga/sub x/As/In/sub 0.52/Al/sub 0.48/As MQW structures with the wells under tensile strain obtained by the appropriate selection of the Ga mole fraction and well size can achieve polarization-insensitive optical switching and modulation for a wide range of wavelengths between 1.0 and 1.6 mu m. For example, a change in refractive index of -0.5% at about 1.55 mu m will facilitate an intersectional angle of more than 10 degrees in a total internal reflection switch which can be readily fabricated. Hence, this material system is promising for long-wavelength polarization-insensitive semiconductor optoelectronic devices.<> 相似文献
7.
The cellular neural network (CNN) architecture combines the best features from traditional fully-connected analog neural networks and digital cellular automata. The network can rapidly process continuous-valued (gray-scale) input signals (such as images) and perform many computation functions which traditionally were implemented in digital form. Here, we briefly introduce the the theory of CNN circuits, provide some examples of CNN applications to image processing, and discuss work toward a CNN implementation in custom CMOS VLSI. The role of analog computer-aided design (CAD) will be briefly presented as it relates to analog neural network implementation.This work is supported in part by the Office of Naval Research under Contract N00014-89-J1402, and the National Science Foundation under grant MIP-8912639. 相似文献
8.
9.
Tams Roska Leon O. Chua 《International Journal of Circuit Theory and Applications》1992,20(5):469-481
The cellular neural network (CNN) paradigm is a powerful framework for analogue non-linear processing arrays placed on a regular grid. In this paper we extend the current repertoire of CNN cloning template elements (atoms) by introducing additional non-linear and delay-type characteristics. In addition, architectures with non-uniform processors and neighbourhoods (grid sizes) are introduced. With this generalization, several well-known and powerful analogue array-computing structures can be interpreted as special cases of the CNN. Moreover, we show that the CNN with these generalized cloning templates has a general programmable circuit structure (a prototype machine) with analogue macros and algorithms. the relations with the cellular automaton (CA) and the systolic array (SA) are analysed. Finally, some robust stability results and the state space structure of the dynamics are presented. 相似文献
10.
C. S. Lim P. Eng S. C. Lin C. K. Chua Y. T. Lee 《The International Journal of Advanced Manufacturing Technology》2002,20(1):44-49
Rapid prototyping (RP) and rapid tooling (RT) techniques can be applied to the field of medicine primarily because of their
ability to produce customised profiles and geometries in relatively short lead times. In this paper, the process by which
these techniques can be applied for the production of customised tracheobronchial stents for the purpose of maintaining patency
in an occluded respiratory tract is described. A comparison of RP systems was carried out to establish the preferred RP method
to produce the master model. The vacuum casting RT process was then used to produce the stent. 相似文献