A Stable Low Power Dissipating 9 T SRAM for Implementation of 4 × 4 Memory Array with High Frequency Analysis

Wireless Personal Communications - Today’s high speed data processing and memory storage operations demand immediate data write and retrieval to meet up to benchmark. To act as a volatile or...     

Coding approaches to fault tolerance in linear dynamic systems

This paper discusses fault tolerance in discrete-time dynamic systems, such as finite-state controllers or computer simulations, with focus on the use of coding techniques to efficiently provide fault tolerance to linear finite-state machines (LFSMs). Unlike traditional fault tolerance schemes, which rely heavily-particularly for dynamic systems operating over extended time horizons-on the assumption that the error-correcting mechanism is fault free, we are interested in the case when all components of the implementation are fault prone. The paper starts with a paradigmatic fault tolerance scheme that systematically adds redundancy into a discrete-time dynamic system in a way that achieves tolerance to transient faults in both the state transition and the error-correcting mechanisms. By combining this methodology with low-complexity error-correcting coding, we then obtain an efficient way of providing fault tolerance to k identical unreliable LFSMs that operate in parallel on distinct input sequences. The overall construction requires only a constant amount of redundant hardware per machine (but sufficiently large k) to achieve an arbitrarily small probability of overall failure for any prespecified (finite) time interval, leading in this way to a lower bound on the computational capacity of unreliable LFSMs.     

Addressing substrate coupling in mixed-mode ICs: simulation andpower distribution synthesis

This paper describes new techniques for the simulation and power distribution synthesis of mixed analog/digital integrated circuits considering the parasitic coupling of noise through the common substrate. By spatially discretizing a simplified form of Maxwell's equations, a three-dimensional linear mesh model of the substrate is developed. For simulation, a macromodel of the fine substrate mesh is formulated and a modified version of SPICE3 is used to simulate the electrical circuit coupled with the macromodel. For synthesis, a coarse substrate mesh, and interconnect models are used to couple linear macromodels of circuit functional blocks. Asymptotic Waveform Evaluation (AWE) is used to evaluate the electrical behavior of the network at every iteration in the synthesis process. Macromodel simulations are significantly faster than device level simulations and compare accurately to measured results. Synthesis results demonstrate the critical need to constrain substrate noise and simultaneously optimize power bus geometry and pad assignment to meet performance targets     

Forward-bias conduction of Schottky diodes on polysilicon thinfilms

An analysis of forward I-V characteristics for Al Schottky contacts to polycrystalline thin films is presented. Experimental results for lateral structures with various n^- doping levels show the expected twofold exponential characteristics representing a transition from electrode-limited to bulk-limited conduction. At higher doping levels the bulk-limited characteristic is not a perfect exponential. The thermionic emission theory has been modified to include crystallite resistivity between grain boundaries and successfully matches experimental data     

Lyapunov-based control for switched power converters

Beginning with fundamental properties such as passivity or incremental passivity of the network elements comprised by a switched power converter, the nominal open-loop operation of a broad class of such converters is shown to be stable in the large via a Lyapunov argument. The obtained Lyapunov function is then shown to be useful for designing globally stabilizing controls that include adaptive schemes for handling uncertain nominal parameters. Numerical simulations illustrate the application of this control approach in DC-DC converters     

Recent Advances in Boron Nitride Based Hybrid Polymer Nanocomposites

Boron nitride (BN) is an eminent inorganic compound having many interesting characteristics such as improved oxidation resistance, mechanical strength, good thermal conductivity (TC), higher bandgap, high chemical stability, thermal stability, high hydrophobicity, and electrical insulation. The use of BN as a filler in polymers is a well-established strategy to tailor the properties of polymer composites. Recent studies depict an interesting urge to reap the synergistic effect of various nanofillers with BN in the form of hybrids. Hence the consolidation of the works on BN based hybrid fillers would definitely attract researchers so that these new filler systems could be transformed into useful polymer nanocomposites in future. This review article focuses on the synthesis and characterization of various boron nitride based hybrids in detail. Moreover, the review also throws light on different BN hybrid reinforced polymer nanocomposites (PNCs) and their thermal, electrical, electronic as well as biomedical applications in a detailed manner. Thus the review anticipates serving as a tool toward understanding the recent trends in the field of boron nitride hybrid based ternary polymer composites.     

Effect of layering pattern on dynamic mechanical properties of randomly oriented short banana/sisal hybrid fiber–reinforced polyester composites

Dynamic mechanical test methods have been widely employed for investigating the structures and viscoelastic behavior of polymeric materials to determine their relevant stiffness and damping characteristics for various applications. Randomly oriented short banana/sisal hybrid fiber–reinforced polyester composites were prepared by keeping the volume ratio of banana and sisal 1 : 1 and the total fiber loading 0.40 volume fraction. Bilayer (banana/sisal), trilayer (banana/sisal/banana and sisal/banana/sisal), and intimate mix composites were prepared. The effect of layering pattern on storage modulus (E′), damping behavior (tan δ), and loss modulus (E″) was studied as a function of temperature and frequency. Bilayer composite showed high damping property while intimately mixed and banana/sisal/banana composites showed increased stiffness compared to the other pattern. The Arrhenius relationship has been used to calculate the activation energy of the glass transition of the composites. The activation energy of the intimately mixed composite was found to be the highest. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 2168–2174, 2005     

Fungal endocarditis following cardiac surgery

This study examines the long-term prognosis of patients with an abnormal exercise radionuclide angiogram in the absence of significant angiographic coronary artery disease (CAD). In general, patients without significant CAD have an excellent prognosis, but the long-term outcome for the subset of patients with an "ischemic" exercise test is not known. In this study, 161 patients with normal coronary arteries or insignificant CAD (< 50% left main and < 70% left anterior descending, left circumflex, or right), resting left ventricular (LV) ejection fraction > or = 0.50, and an abnormal exercise radionuclide angiogram (LV ejection fraction that decreased with exercise or peak exercise LV ejection fraction < 0.60) were followed for a median duration of 11.3 years. The mean delta LV ejection fraction was -0.07, 98 patients (61%) had a decrease in LV ejection fraction of > or = 5 units, and 40 patients (25%) had peak exercise LV ejection fraction < 0.50. During follow-up there were 19 deaths (only 1 of which was cardiac), 7 nonfatal myocardial infarctions, and 9 revascularization procedures. At 12 years, overall survival was 88%, better than the expected survival for the age- and sex-matched general population. Survival free of cardiac death or myocardial infarction was 94% and survival free of any cardiac event including revascularization was 88%. Thus, patients with an abnormal exercise radionuclide angiogram but without significant CAD have an excellent long-term prognosis.     

Failure Analysis of Modern Silicon Dice

Although the utilization of silicon dice in electronic devices has been in place for approximately 50 years, its widespread application has occurred more recently with the rapid expansion of the consumer markets for digital devices such as cameras, personal computers, video players, and smart phones. In particular, due to the recent market drive in the miniaturization and cost reduction of electronic products, silicon dice are often utilized without encapsulation and mounted directly to the substrate by means of conductive adhesives or BGA mounting. Silicon die often need to be thinned to a few hundred micrometers thickness to fit into compact devices and to reduce parasitics. The intrinsic brittle nature of silicon in combination with the lack of mechanical protection such as encapsulation has made fracture of bare dice a typical failure mechanism in handheld electronic devices. In the current work, we tested to failure {100} silicon dice and obtained mirror–mist boundary measurements for correlation to the fracture strengths of the parts. This work will also present various practical examples of how to reliably conduct failure analysis of fractured silicon dice. The intrinsic brittle nature of silicon in combination with the lack of mechanical protection such as encapsulation has made fracture of bare dice a typical failure mechanism in handheld electronic devices such as cameras, portable computers, tablets, media players, and smart phones. In these products, silicon dice are often utilized without encapsulation and are attached directly to the substrate by means of conductive adhesives or ball grid array mounting. Modern silicon dice used in these products typically have small dimensions and higher flexural strength compared to their predecessors. Prior silicon fractographic findings have investigated low strength failures. In the current work, we extend the quantitative fractography of silicon to the high failure stress regime. We have mechanically tested modern silicon dice to failure by four‐point bending and obtained mirror–mist boundary measurements for correlation to the fracture strengths of the specimens. Two key areas are addressed which improve the practical application of quantitative fractography to modern silicon dice: (1) application of silicon fractography to high flexural strength regimes and (2) development of a systematic means of reliably measuring fracture surface features.     

Effect of blend ratio on the dynamic mechanical and thermal degradation behavior of polymer–polymer composites from low density polyethylene and polyethylene terephthalate

Microfibrillar polymer–polymer composites (MFCs) based on low-density polyethylene (LDPE) and polyethylene terephthalate (PET) were prepared by cold drawing-isotropization technique. The weight percentage of PET was varied from 5 to 45 %. Microfibrils with uniform diameter distribution were obtained at 15 to 25 wt% of PET as evident from the scanning electron microscopy (SEM) results. Dynamic mechanical properties such as storage modulus (E′), loss modulus (E″) damping behavior (tan δ) were examined as a function of blend composition. The E′ values were found to be increasing up to 25 wt% of PET. An effort was made to model the storage modulus and damping characteristics of the MFCs using the classical equations used for short-fiber reinforced composites. The presence of PET microfibrils influenced the damping characteristics of the composite. The peak height at the β-transitions of loss modulus was lower for MFCs with 25 % PET, showing that they had superior damping characteristics. This phenomenon could be correlated with the PET microfibrils morphology. The thermal degradation characteristics of LDPE, neat blends and microfibrillar blends (MFBs) were compared. The determination of activation energy for thermal degradation was carried out using the Horowitz and Metzger method. The activation energy for thermal degradation of microfibrillar blends was found to be higher than that for the corresponding neat blends and MFCs. The long PET microfibrils present in MFBs could prevent the degradation and enhance the activation energy.