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1.
针对流体输送埋地管道泄漏问题,设计了一种利用管道机器人携带封堵气囊进行快速应急封堵修复的埋地管道泄漏内封堵装置。采用矩阵变换方法建立了牵引系统驱动轮过弯方程,利用MATLAB软件对过弯方程进行了验证,同时利用ADAMS软件仿真分析过弯路径与驱动轮转角对牵引系统行走速度的影响。研究结果表明:由两个串联封堵器组成的应急封堵系统可满足复杂工况下的管道泄漏封堵要求;牵引系统驱动轮在弯管内部行走时,单轮速度呈周期性变化,但三个驱动轮整体周期运动特性一致;驱动轮转角在25°~40°时,牵引系统行走速度与驱动轮转角成正比,且转角为30°时驱动效果最好。该内封堵装置的结构设计可为管道泄漏应急封堵领域装备的研发提供重要参考。 相似文献
2.
In this paper, we study scheduling games under mixed coordination mechanisms on hierarchical machines. The two scheduling policies involved are ‐ and ‐, where ‐ (resp., ‐) policy sequences jobs in nondecreasing order of their hierarchies, and jobs of the same hierarchy in nonincreasing (resp., nondecreasing) order of their processing times. We first show the existence of a Nash equilibrium. Then we present the price of anarchy and the price of stability for the games with social costs of minimizing the makespan and maximizing the minimum machine load. All the bounds given in this paper are tight. 相似文献
3.
Ye Wan Jun Tan Guangling Song Chuanwei Yan 《Metallurgical and Materials Transactions A》2006,37(7):2313-2316
The focused ion beam technique was employed to investigate the atmospheric corrosion morphology of AZ91D. It was found that
the α matrix of the alloy was preferentially corroded in the areas adjacent to intermetallic phases. The most interesting
finding was that the corrosion products in corrosion cavities were pelletlike, which has never been reported before. 相似文献
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5.
Xue‐Yong Liu Xiao‐Bin Ding Zhao‐Hui Zheng Yu‐Xing Peng Albert S
C Chan C
W Yip Xin‐Ping Long 《Polymer International》2003,52(2):235-240
Amphiphilic magnetic microspheres ranging in diameter from 5 to 100 µm were prepared by dispersion copolymerization of styrene and poly(ethylene oxide) vinylbenzyl (PEO‐VB) macromonomer (MPEO) in the presence of Fe3O4 magnetic fluid. The effects of various polymerization parameters on the average particle size were systematically investigated. The average particle size was found to increase with increasing styrene concentration and initiator concentration. It also increased with decreasing stabilizer concentration and molecular weight of MPEO. The content of the hydroxyl groups localized in the microspheres ranged from 0.01 to 0.2 mmol g?1. © 2003 Society of Chemical Industry 相似文献
6.
P(DBF-VA)型柴油低温流动性改进剂的研制 总被引:1,自引:1,他引:0
针对新疆地产柴油蜡含量较高的特点,以游离基聚合法合成了富马酸双链混合酯和醋酸乙烯酯共聚物型[P(DBF-VA)]柴油低温流动改进剂,利用正交实验研究了单体配比,引发剂用量,溶剂用量,聚合温度对聚合物降冷滤效果的影响。共聚物用IR进行表征,利用XRD初步探讨了该降凝剂的降凝机理。结果表明:该剂能使吐哈—10~#、0~#柴油冷滤点降低10℃和7℃;使独山子0~#柴油冷滤点下降12℃;使石化0~#柴油冷滤点下降8℃;使克拉玛依0~#柴油的冷滤点下降8℃。 相似文献
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8.
A decision support system for interactive decision making - Part II: analysis and output interpretation 总被引:2,自引:0,他引:2
Liping Fang K.W. Hipel D.M. Kilgour Xiaoyong Peng 《IEEE transactions on systems, man and cybernetics. Part C, Applications and reviews》2003,33(1):56-66
For pt.I see ibid., p.42-55 (2003). The development of a comprehensive decision support system, GMCR II, for the systematic study of real-world interactive decision problems is presented. The companion paper (Part I), discusses how GMCR II elicits, stores, and manages conflict models; here (Part II), the focus is on GMCR IIs analysis and output interpretation subsystems. Specifically, this paper describes the powerful and efficient analysis engine contained in GMCR II, its informative output presentation and interpretation facilities, and a number of follow-up analyses. Furthermore, an illustrative case study is used to demonstrate how GMCR II can be conveniently applied in practice. 相似文献
9.
10.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献