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1.
2.
Energy transfer from photo-excited electrons in a metal thin film to the dielectric substrate is important for understanding the ultrafast heat transfer process across the two materials. Substantial research has been conducted to investigate heat transfer in a metal-dielectric structure. In this work, a two-temperature model in metal was used to analyze the interface electron and dielectric substrate coupling. An improved temperature and wavelength-dependent Drude–Lorentz model was implemented to interpret the signals obtained in optical measurements. Ultrafast pump-and-probe measurements on Au-Si samples were carried out, where the probe photon energy was chosen to be close to the interband transition threshold of gold to minimize the influence of non-equilibrium electrons on the optical response and maximize the thermal modulation to the optical reflectance. Electron-substrate interface thermal conductance at different pump laser fluences was obtained, and was found to increase with the interface temperature. 相似文献
3.
A key performance parameter of a manufacturing network or supply chain is its cycle time; the time that a typical item spends in the network. A previous simulation study on a semiconductor assembly and test facility showed that cycle times could be reduced by having smooth input and service rates. This suggested that there is a “cycle time principle” that, for a system with a specified throughput or input rate, the shortest cycle times are obtained when the input and service rates do not vary over time. We prove that this principle is true for the M/G/1 and M/M/s queueing systems and Jackson networks. The analysis involves establishing several results on the concavity of waiting time probabilities and the convexity of expected waiting times and queue lengths, as functions of input and service rates. These results also have natural uses in other optimization problems. 相似文献
4.
Rajoo R. Lim S.S. Wong E.H. Hnin W.Y. Seah S.K.W. Tay A.A.O. Iyer M. Tummala R.R. 《Advanced Packaging, IEEE Transactions on》2008,31(2):377-385
A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps. 相似文献
5.
Disasters may strike at any moment in any location. When they do, no distinction is made about the type of firm that is being affected, whether it is a bank or a manufacturing plant. Most firms do not plan for possible disasters, and those that do have typically focused on computer and data contingency planning. In this paper, the focus is shifted to incorporate disaster recovery planning for manufacturing enterprises, especially those that are automated. Automated manufacturing enterprises have characteristics that put them at an increased risk to disasters. The methodological framework proposed in this paper will aid manufacturing organizations and their managers in reducing the risks associated with unanticipated disasters. The framework is termed the “Manufacturing Operations Recovery and Resumption” model. Recommended activities and tools for effective management of this methodology are identified 相似文献
6.
Kaushik A. Iyer 《International Journal of Fracture》2007,146(1-2):1-18
Internal fracture patterns developed in silicon carbide cylindrical targets as a result of dynamic indentation (63–500 m/s)
by tungsten carbide spheres are defined. Microscopy of recovered and sectioned targets delineate into three regions, each
associated with distinct cracking modes, i.e., shallow cone macrocracking at and near the impact surface, steep interior cone
macrocracks that radiate into the target from the impact region and local grain-scale microcracking directly underneath the
impact region. The observed fracture patterns are found to maintain a noticeable degree of self-similarity upto the impact
velocity of 500 m/s. Linear elastic analysis of the full (surface and interior) stress field developed under static (Hertz)
contact loading delineate the target into four regions, based on the number of principal stresses that are tensile (none,
1, 2 or all 3). A strong correlation is found between the principal stress conditions within each region and the forms of
cracking, their locations and orientations present therein. This correlation has a number of implications, including non-interaction
of crack systems, which are discussed. Illustrative linear elastic fracture mechanics analyses are performed for three regions,
and calculated and observed macrocrack lengths are found to be in reasonable agreement. 相似文献
7.
N Iyer MS Reagan KJ Wu B Canagarajah EC Friedberg 《Canadian Metallurgical Quarterly》1996,35(7):2157-2167
8.
Xiang Lu S. Sundar Kumar Iyer Jin Lee Brian Doyle Zhineng Fan Paul K. Chu Chenming Hu Nathan W. Cheung 《Journal of Electronic Materials》1998,27(9):1059-1066
We have demonstrated feasibility to form silicon-on-insulator (SOI) substrates using plasma immersion ion implantation (PIII)
for both separation by implantation of oxygen and ion-cut. This high throughput technique can substantially lower the high
cost of SOI substrates due to the simpler implanter design as well as ease of maintenance. For separation by plasma implantation
of oxygen wafers, secondary ion mass spectrometry analysis and cross-sectional transmission electron micrographs show continuous
buried oxide formation under a single-crystal silicon overlayer with sharp Si/SiO2 interfaces after oxygen plasma implantation and high-temperature (1300°C) annealing. Ion-cut SOI wafer fabrication technique
is implemented for the first time using PIII. The hydrogen plasma can be optimized so that only one ion species is dominant
in concentration and there are minimal effects by other residual ions on the ion-cut process. The physical mechanism of hydrogen
induced silicon surface layer cleavage has been investigated. An ideal gas law model of the microcavity internal pressure
combined with a two-dimensional finite element fracture mechanics model is used to approximate the fracture driving force
which is sufficient to overcome the silicon fracture resistance. 相似文献
9.
A. N. Iyer U. Balachandran L. R. Motowidlo J. G. Hoehn P. Haldar 《Journal of Electronic Materials》1994,23(11):1087-1091
Pb0.4Bi1.8Sr2Ca2.2Cu3Ox (Bi-2223) precursor powder was prepared by a solid-state reaction of carbonates and oxides of lead, bismuth, strontium, calcium,
and copper, and the powder was then used to fabricate silver-clad tapes by the powder-in-tube technique. Transport critical
current density (Jc) values>4×104 A/cm2 at 77K and 2×105 A/cm2 at 4.2 and 27K have been achieved in short tape samples. Long lengths of tape were tested by winding them into pancake coils.
Recently, we fabricated a test magnet by stacking ten pancake coils, each containing three 16m lengths of rolled tape, and
tested it at 4.2, 27 and 77K. A maximum generated field of 2.6 T was measured in zero applied field at 4.2K and the test magnet
generated significant self-field in background fields up to 20 T. The results are discussed in this paper. 相似文献
10.
Instrumental characterization of clay by XRF,XRD and FTIR 总被引:2,自引:0,他引:2
Instrumental characterizations of the clay were performed by different techniques such as XRF, XRD and FTIR. XRF shows the
chemical compositions of the clay where Al-oxide and silica oxide are present in major quantity whereas XRD confirms the presence
of these minerals in clay. FTIR studies show the presence of quartz, alumina, haematite and different mineral matters. 相似文献