On the singularity of temperature gradient near an inclined crack terminating at bimaterial interface

This paper deals with the singularity of temperature gradient near an inclined crack terminating at a bimaterial interface. The temperature field is solved by considering the continuity of temperature and heat flux at the interface and appropriate thermal boundary conditions on crack surfaces. The singularity of temperature gradient around the crack tip is then studied for the cases for which the temperature on crack surfaces is prescribed or crack surfaces are insulated. It is found that, unlike the oscillatory singularity of the stress field, no oscillatory character near the crack tip is observed for these problems. The dependence of the singularity of temperature gradient on the inclined angle of crack and thermal conductivity ratio of two dissimilar media is also shown.     

Ant colony optimization based sensor deployment protocol for wireless sensor networks

Sensor deployment is one of the most important issues in wireless sensor networks, because an efficient deployment scheme can reduce the deployment cost and enhance the detection capability of the wireless sensor networks. In addition, it can enhance the quality of monitoring in wireless sensor networks by increasing the coverage area. Ant colony optimization (ACO) algorithm provides a natural and intrinsic way of exploration of search space for multiple knapsack problem (MKP). In this work, we consider the problem of sensor deployment to achieve complete coverage of the service region and maximize the lifetime of the network. We model the deployment problem as the multiple knapsack problem. Based on ACO algorithm, we proposed a deployment scheme to prolong the network lifetime, while ensuring complete coverage of the service region. The simulations show that our algorithm can prolong the lifetime of the network.     

A Force-Directed-Based Optimization Scheme for Thermal Placement Design of MCMs

Thermal management becomes exceptionally critical to both the reliability and operation performance of electronic packages, particularly for multichip modules (MCMs), as packaging and power densities continue increase while packaging dimension continues decrease. The underlying goal of the study is to pursue the minimum system temperature design of MCMs containing a number of chips of equal and/or unequal power through the optimal chip placement design. To deal with the thermal design problems, an effective indirect optimization approach that integrates a modified force-directed (FD) thermal model, a finite-element (FE) technique and an exterior penalty method (EPM) is proposed. In the modified FD thermal model, a novel representation of the repulsive and attractive forces is proposed, and the sum of these forces in the design system, representing the total system chip junction temperature, constructs the objective of the optimization problems. Together with some geometry constraints, the constrained optimization problems are formed, and furthermore, transformed into unconstrained optimization problems using an EPM. The solution of the optimization problems is sought through a direct, iterative search scheme with two proposed placement strategies. The alternative goal of the study is to address the feature and feasibility of these two proposed placement strategies for the current problems. The applicability of the proposed optimization approach is demonstrated through several design applications, and their results are extensively compared against the published data. It turns out that the current optimization approach can be very effective and robust in providing thermal optimal design of MCMs with a minimal total chip junction temperature through optimal chip placement     

Effect of angular speed on behavior of a V-belt drive system

For a V-belt drive system, the effect of angular speed on the three-dimensional frictional contact behaviors on the contact surfaces between the V-belt and pulley flange is studied in this work. To deal with the frictional contact phenomena for the V-belt drive system, an effective three-dimensional finite element procedure is developed herein. By this procedure, the deformation of the V-belt and the normal/tangential contact forces occurring on the contact surfaces can be estimated accurately. The friction angles of contact points along the edge of the V-belt cross section are also presented for various dynamic friction coefficients. From the computed results, it is found that smaller friction angles are obtained as dynamic friction coefficients get larger. The results achieved are very helpful for the estimation of operation efficiency of the V-belt drive system.     

Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing

In this study, the printing mechanism and performance of gravure-offset fine-line circuitry printing technology are investigated in terms of key printing parameters through experimental and theoretical analyses. First, the contact angles of the ink deposited on different substrates, blankets, and gravure metal plates are experimentally determined; moreover, their temperature and solvent content dependences are analyzed. Next, the ink solvent absorption and evaporation behaviors of the blankets at different temperatures, times, and numbers of printing repetitions are characterized by conducting experiments. In addition, while printing repeatedly, the surface characteristics of the blankets, such as the contact angle, vary with the amount of absorbed ink solvent, further affecting the ink transfer performance (ratio) and printing quality. Accordingly, the surface effect of the blanket due to ink solvent absorption on the ink contact angle is analyzed. Furthermore, the amount of ink transferred from the gravure plate to the blanket in the “off process” and from the blanket to the substrate in the “set process” is evaluated by conducting a simplified plate-to-plate experiment. The influences of loading rate (printing velocity), temperature, and solvent content on the ink transfer performance are addressed. Finally, the ink transfer mechanism is theoretically analyzed for different solvent contents using Surface Evolver. The calculation results are compared with those of the experiment.     

Dynamic analysis of viscoelastic structures using incremental finite element method

This paper presents an efficient and accurate incremental finite element procedure, without involving any integral transformations, to deal with practical viscoelastic structures with complicated geometries subjected to dynamic loadings. The numerical error induced from the approximate inversion technique used is thus avoided. Based on the Hamilton's variational principle, an incremental functional is derived for each time increment and the inertia terms are retained in the analysis to estimate the transient viscoelastic behaviours. To model the specific stress-strain-time constitutive behaviours of viscoelastic materials, the Norton type time hardening rule is employed. In the present computation procedure, the change of creep strains is regarded as increments of fictitious body forces at the nodal points for the next time increment.

To evaluate the accuracy and the versatility of the solution technique developed in this work, several examples are given.     

On the Contact Characteristics between Droplet and Microchip/Binding Site for Self-Alignment

The contact characteristics between a droplet and a microchip/binding site strongly affect the accuracy of self-alignment in the self-assembly of micro-electronic-mechanical systems. This study is mainly to implement the Surface Evolver Program, which is commonly adopted for studying surface shaped by surface tension and other energies, to investigate comprehensively the contact characteristics between the small droplet and the microchip/binding site. The details of changes in the contact line and the contact area when the microchip is subjected to translation, compression, yawing and rolling are drawn. The three-dimensional deformation of the droplet between the microchip and the binding site is also presented. The restoring force and restoring torque that are induced on the microchip under those motions are calculated accurately. The critical value that the microchip can return to its aligned position under respective motion is therefore predicted. Lastly, under the effects of the droplet surface tension and the contact angle for the droplet on the microchip/binding site, the regions of overflow and no wet area on different microchip shapes are demonstrated. The computed results agree excellently with those by experiments. Based on the simulation techniques developed, the self-alignment of the microchip with the binding site can be estimated accurately.     

A varistor–polymer composite with nonlinear electrical-thermal switching properties

We studied the dependence of the E–J characteristics on the sintering conditions in varistor fillers, the filler content in the polymer matrix and for different polymers and suggest a possible nonlinear electrical-thermal switching mechanism. The nonlinear coefficient and breakdown field of a sample with 100 vol.% varistor fillers sintered at 950 °C for 5 h were 12.24 and 135 V/mm, separately. A decrease in the amount of filler content in polymeric matrix or using a fortified polymer improved the electrical properties by increasing the breakdown field to the 263–964 V/mm range and decreasing the leakage current density in the 1.06 × 10⁻⁵ to 1.13 × 10⁻¹⁰ A/cm² range. This varistor–polymer composite can exhibit two nonlinearities in electrical conductivity. In the conducting state above the varistor filler breakdown, the polymer matrix reduces the conductivity, if a critical temperature is reached. Thereby the over voltage is limited by the fillers (i.e. varistor effect) and the over current is limited by the polymer matrix (i.e. positive temperature coefficient effect).     

The Influence of Structural Defect on Mechanical Properties and Fracture Behaviors of Carbon Nanotubes

Due to the limitation of fabrication technologies nowadays, structural or atomistic defects are often perceived in carbon nanotubes (CNTs) during the manufacturing process. The main goal of the study aims at providing a systematic investigation of the effects of atomistic defects on the nanomechanical properties and fracture behaviors of single-walled CNTs (SWCNTs) using molecular dynamics (MD) simulation. Furthermore, the correlation between local stress distribution and fracture evolution is studied. Key parameters and factors under investigation include the number, type (namely the vacancy and Stone-Wales defects), location and distribution of defects. Results show that the nanomechanical properties of the CNTs, such as the elastic modulus, ultimate strength and ultimate strain, are greatly affected by the defects and also their percentage and type. It is also found that the CNTs present a brittle fracture as the strain attains a critical value, and in addition, the fracture crack tends to propagate along the high tensile stress concentration area. Moreover, the distribution pattern of defects is another driving factor affecting the nanomechanical properties of the CNTs and the associated fracture evolutions.     

Stability of Solder Bridging for Area Array Type Packaging

As ultra-fine-pitch technologies are adopted to enhance the performance of electronic packaging, solder bridging becomes an urgently serious defect. This work presents a computational model using the Surface Evolver program to analyze the stability of solder bridging for area array type packaging. Several factors that affect the stability of solder bridging spanning two identical circular pads are considered herein, including the pad size, the total volume of solder bumps, the pitch between adjacent pads, the contact angle between the molten solder alloy and the pad, the contact angle between the molten solder alloy and the solder mask and the surface tension of the molten solder alloy, respectively. The critical total volume of solder bumps and the critical pitch between adjacent pads are defined as the corresponding critical values to determine the solder bridging from a stable state to an unstable (vanishing) state. The stability of solder bridging spanning three and four identical circular pads is also discussed. Good agreement between the computed critical total volume of solder bumps for solder bridging and that available in the literature exhibits that the model developed in this work can be practically applied to predict the stability of solder bridging.