GOS+MU:一种查询对象选择新方法

在分析单一MU(Most Uncertainty)采样缺陷的基础上,提出一种"全局最优搜寻"方法 GOS(Global Optimal Search),并结合MU共同完成查询选择。GOS+MU方法中,GOS着眼全局寻找目标,在应用环境能提供的训练样本数量有限、分类器受训不充分时,该方法选择的对象学习价值高,能快速推进分类器学习进程;MU则能够在GOS采样失效情形下,利用分类器当前训练成果,选择查询不确定性最强的样本补充训练集。通过对网络商品的用户评论进行分类仿真,并比较其他采样学习方法的效果,证明了GOS+MU方法在压缩学习成本、提高训练效率方面的有效性。     

基于TMS320VC5410的最小系统设计

TMS320VC5410是TI公司生产的一款定点数字信号处理(DSP)芯片。基于DSP的最小系统是以其简洁的硬件结构来实现DSP的一般功能,广泛应用于工业生产、教学、科研、电子设计等领域。主要介绍了基于TMS320VC5410的最小系统硬件电路设计方案,阐述了重要电路部分的抗干扰设计和软件调试过程中应注意的若干问题。最后提出了简单易行的软件调试方法以及部分程序代码。     

几种重要的有机氯系阻燃剂

介绍了氯化石蜡、氯化聚乙烯、四氯邻苯二甲酸酐、四氯双酚A、六氯环戊二烯 及由六氯环戊二烯衍生的几种氯系阻燃剂的生产过程和用途。     

JOINING MECHANISMS OF β''''-Al2O3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE

The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.     

弹力竹节牛仔布织造工艺优化

介绍了弹力竹节牛仔布的生产工艺 ,同时对KT36 8剑杆织机织造该织物的工艺进行了优化研究     

通信设计在通信工程建设中的作用及发展思路探讨

就通信设计在通信工程建设中的重要地位进行了思考，分析了加入WTO以后我国通信设计行业面临的挑战与机遇，探讨了新形势下我国通信设计行业的应对措施及发展思路。     

Response of inertinites from some Australian coals to non-catalytic hydrogenation in tetralin

Inertinite concentrates from three Australian bituminous coals were hydrogenated at various temperatures ranging from 350 to 475 °C in the presence of tetralin without any added catalyst. Both conversion yields and microscopic observations of the benzene-extracted hydrogenation residues have revealed that the hydrogenation of the inertinite macerals becomes significant only > 400 °C, whereas the dissolution-hydrogenation of the accompanying vitrinite macerals occurs mainly between 350 and 400 °C. The major reaction pathway for the inertinite particles in the hydrogenation process appears to be one of initial mild carbonization followed by hydrogenation. A simplified reaction scheme is proposed which describes the reaction pathway involved in the hydrogenation of inertinite.     

基于PSR模型的水电工程生态效应评价指标体系构想

从水电工程生态效应评价指标体系研究的意义出发,通过分析水电工程生态效应评价的内涵,确立了评价指标的选取原则,基于压力(Pressure)-状态(State)-响应(Response)概念模型,构建了以科学、实用和可操作为目标的评价指标体系的框架。     

Cloning and expression of an endo-1,3-1,4-beta-glucanase gene from Bacillus macerans in Lactobacillus reuteri

Strains of the gastrointestinal species Lactobacillus reuteri were electrotransformed with plasmid constructs containing the endo-1,3-1,4-beta-glucanase gene (bglM) of Bacillus macerans. The enzyme was expressed and secreted by the lactobacilli. A plasmid construct containing the bglM gene lacking its promoter was derived and was demonstrated to be useful as a promoter probe vector.     

Impact of temperature cycle profile on fatigue life of solder joints

In this paper the influence of the temperature cycle time history profile on the fatigue life of ball grid array (BGA) solder joints is studied. Temperature time history in a Pentium processor laptop computer was measured for a three-month period by means of thermocouples placed inside the computer. In addition, Pentium BGA packages were subjected to industry standard temperature cycles and also to in-situ measured temperature cycle profiles. Inelastic strain accumulation in each solder joint during thermal cycling was measured by high sensitivity Moire interferometry technique. Results indicate that fatigue life of the solder joint is not independent of the temperature cycle profile used. Industry standard temperature cycle profile leads to conservative fatigue life observations by underestimating the actual number of cycles to failure.