乌江索风营水电站地下厂房岩锚梁镜面混凝土施工技术

镜面混凝土是水电工程建设中新兴的一门施工技术,在乌江索风营水电站地下厂房岩锚梁混凝土施工中采用了镜面混凝土,这在技术上是一次大胆的尝试和创新,既满足了功能上的要求,同时也达到了美观和装饰地下厂房的效果,为今后水电工程施工中广泛采用镜面混凝土技术提供了样本和宝贵经验。     

关于天然气水合物钻采工艺技术进展的研究

目前全球正面临着前所未有的能源危机，天然气水合物由于储量大、能量密度高而将成为一种诱人的新型能源。天然气水合物主要存在于冻土带和海洋，在地下处于低温和高压状态，以现有的技术，钻井和开采都存在很大的困难。简要介绍了天然气水合物的性质及储量，阐述了天然气水合物钻井的六个挑战及目前国外天然气水合物的两种钻探方法；同时阐述了以热力法、降压法和化学试剂注入法为主的天然气水合物开采方法，并针对天然气水合物钻采技术现状指出了下一步的研究方向。     

Degree-of-polarization and eye-closure penalty associated with optical signals with orthogonal polarizations

We perform a systematic measurement of the degree-of-polarization (DOP) and eye-closure penalty for optical signals with orthogonal polarizations. We find that the symmetry of DOP is maintained for the orthogonal polarizations under both first and higher order polarization-mode dispersion (PMD), whereas the symmetry of eye-closure penalty is broken under second-order PMD. An orthogonal polarization pair can have large disparity of eye-closure penalty despite an identical DOP. We also demonstrate a novel approach to estimate the maximum eye-closure penalty asymmetry with three orthogonal polarizations on the Poincare/spl acute/ sphere.     

地震勘探测量数据处理的全面解决方案

本文针对近年来地震勘探技术的发展对测量工作提出的新要求，分析了SSOffiee软件解决问题的方案和技术特色，最后提出了SSOffice软件的发展方向。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

宽带DDS跳频源设计

直接数字合成（DDS）简单可靠、控制方便，具有很高的频率分辨率，高速转换，非常适合快速跳频的要求。在对DDS基本原理进行了简要介绍和分析后，提出宽带跳频源设计方案。     

Mining predecessor–successor rules from DAG data

Data mining extracts implicit, previously unknown, and potentially useful information from databases. Many approaches have been proposed to extract information, and one of the most important ones is finding association rules. Although a large amount of research has been devoted to this subject, none of it finds association rules from directed acyclic graph (DAG) data. Without such a mining method, the hidden knowledge, if any, cannot be discovered from the databases storing DAG data such as family genealogy profiles, product structures, XML documents, task precedence relations, and course structures. In this article, we define a new kind of association rule in DAG databases called the predecessor–successor rule, where a node x is a predecessor of another node y if we can find a path in DAG where x appears before y. The predecessor–successor rules enable us to observe how the characteristics of the predecessors influence the successors. An approach containing four stages is proposed to discover the predecessor–successor rules. © 2006 Wiley Periodicals, Inc. Int J Int Syst 21: 621–637, 2006.     

Intelligent process analytics for CRM

Many organisations use decision models in their processes such as tables or trees to provide decision support to their operational divisions. For example, in fault management, customer contact centre operators usually use a decision model in the form of prescribed interviews. Based on the answers given by customers, the operator navigates through the decision model to reach an assessment of the problem. In order to achieve customer satisfaction and operational excellence, it is very important to constantly monitor the performance of a decision model not only on an overall level, but also on the level of individual decisions. In this paper we present a configurable business process analytics tool, known as the intelligent Universal Service Management System, that constantly monitors decision data and is capable of optimising the decisions based on high-level business objectives. We explain the various features of the software and show how it can be used to optimise decision processes. We also show how we can easily provide a customised version to monitor the performance of provision processes.     

一种改进的MC-CDMA系统结构

MC-CDMA在频域扩频时实际上是一种频率分集,对于频率分集重数的要求通常小于子载波的数目N,故扩频因子可以小于子载波数目。改进了这种MC-CDMA系统的结构,通过在频域引入交织器,使交织后频率分集各分量经历独立的哀落,从而提高了抗哀落能力。最后给出了用系统仿真软件SPW仿真的结果。     

High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.