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Various pseudomorphic High Electron Mobility Transistor (pHEMT) structures of AlGaAs/InGaAs alloys have been observed their current-voltage behavior. The tungsten probes were used for a measurement the structures by ramping the voltage from −5 to 5 V and measure the electrical current. Measurement was carried out at room temperature and also under optical illumination. From the measurement, the electrical current was found to increase as the increase of Al content in the AlGaAs alloys layer in the pHEMT structure. This phenomenon was supported by the decrease of sheet resistance as obtained from Hall effect measurement. Under visible light illumination, the current-voltage behavior of pHEMT structure was observed to vary as the light power density was varied for 0, 25 and 55 μW/cm.  相似文献   
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Physico-mechanical properties of particleboard fabricated from heat-treated rubberwood particles were investigated. Reduction in water absorption and mass loss were observed in heat-treated rubberwood particles, and it was associated with the properties of particleboard. The density and moisture content of the particleboard decreased with increasing treatment temperature and time. Heat treatment of particles improved the dimensional stability of the particleboard, but the mechanical properties were adversely affected.  相似文献   
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This paper presents an approach to examine the microstructural properties and mechanical behavior of coconut husks, banana pseudo-stem, pineapple leaf, and sugarcane bagasse fibers by scanning electron microscope and mini-tensile tester, respectively. Single fiber bundles were examined by using scanning electron microscope. Tensile tests were performed at different diameters (0.15–0.55 mm) and gauge lengths (10, 15, 20, and 30 mm/min) to assess the effects of diameter and gauge length on tensile properties. It was found that fibers consisted of different types of regularly arranged cells. The tensile strength (310 MPa) and Young’s modulus (7.4 GPa) of pineapple leaf fiber bundles showed the highest value compared to the other fibers. The tensile strength and Young’s modulus decreased with the increase of diameter and gauge length of fiber bundles. Scanning electron microscopic fractography analysis showed comparatively heterogeneous ruptures associated with more participants of microfibrils for pineapple leaf and banana pseudo-stem fibers compared to coconut husk and sugarcane bagasse fibers. These fractographic observations were discussed in the light of current knowledge of the microstructure of each fiber and the corresponding mechanical properties.  相似文献   
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The present work evaluates curing and the thermal behavior of different molecular weight phenol formaldehyde (PF) resins used to prepare PF prepreg oil palm stem veneers. The physical properties (solid contents, gelation time, pH, and viscosity) of PF resins were determined. The molecular weight of resins was characterized by gel permeation chromatography, whilst thermal properties were determined by differential scanning calorimetry and thermogravimetric analyses. The average molecular weight of PF resins were 526 g/mole (low), 1889 g/mole (medium), and 5178 g/mole (control - commercial). Among the resins, medium (MMwPF) gives better thermal stability with a retained weight of 48.9% at 300°C. High (Commercial PF) had a low decomposition temperature (109.3°C) which occurred within 11 min. Both low (LMwPF) and MMwPF started to melt at ≥120°C. Based on strength and shear values, phenolic prepreg palm veneers can be prepared using either low or medium molecular weight PF but with varying results. In all cases, the mechanical properties of palm plywood made from PF prepreg veneers were superior to those made from PF-bonded plywood using the commercial process.  相似文献   
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Dimensional stability of heat oil-cured particleboard made with admixture of oil palm trunk and rubberwood was evaluated. Particleboard made with oil palm trunk had better dimensional stability due to better compact ratio and lower hygroscopicity than rubberwood. Combination of repellent properties of oil and application of heat had greatly reduced the hygroscopicity of particleboard by decreasing its equilibrium moisture content, thickness swelling and water absorption.  相似文献   
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