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<正> DG252型整体卡瓦封隔器,是近年来大港油田井下作业指挥部攻关队(现为采油工艺研究所)研制出的一种新型封隔器,它是采用从国外引进的一种独特的整体卡瓦,并结合两种不同的座封换向机构,设计了DG252-1型和DG252-2型封隔器。 相似文献
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Effect of electromigration and isothermal aging on interfacial microstructure and tensile fracture behavior of SAC305/Cu solder joint
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The Cu/Sn-3.OAg-0.5Cu/Cu butting solder joints were fabricated to investigate the evolution of the interfacial intermetallic compound(IMC) and the degradation of the tensile strength of solder joints under the effect of electromigration(EM) and aging processes.Scanning electron microscopy(SEM) results indicated that the Cu_6Sn_5 interfacial IMC presented obvious asymmetrical growth with the increase of EM time under current density of 1.78×10~4 A/cm~2 at 100℃,and the growth of anodic IMC presented a parabolic relationship with time while the cathodic IMC got thinner gradually.However,as for aging samples at 100℃ without current stressing,the Cu_6Sn_5 IMC presented a symmetrical growth with a slower rate than the anodic IMC of EM samples.The tensile results indicated that the tensile strength of the solder joints under current stress declined more drastic with time than the aging samples,and the fracture mode transformed from ductile fracture to brittle fracture quickly while the fracture mode of aging samples transformed from cup-cone shaped fracture to microporous gathering fracture in a slow way. 相似文献
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采用Ni/Sn/Cu互连焊点作为研究对象,在不涉及电迁移效应条件下,设置温度梯度为TG=1 046℃/cm,研究在热迁移作用下镍为热端、铜为冷端时界面金属间化合物(intermetallic compound,简称IMC)的显微组织变化. 结果表明,随着热迁移加载时间的增加,冷、热两端界面IMC的厚度都增加,但冷端界面IMC的生长速率大于热端.EDS分析表明,界面IMC是(Cu,Ni)6Sn5相,并且热端IMC中的Ni元素含量高于冷端. 另外,在冷端的界面(Cu,Ni)6Sn5相中观察到大量的空洞,且在(Cu,Ni)6Sn5/Cu界面之间没有观察到Cu3Sn. 相似文献
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