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Interfacial microstructure and properties of YG11C/42CrMo joint brazed with BCu64MnNi filler metal 下载免费PDF全文
Brazing hard alloy to high strength steel, incomplete atomic diffusion and excessive brittle reaction product precipitation at the faying interface are usually suffered because of incomplete understanding the process of the initial interface disappearing and diffusion layer forming and evolving. In this paper, hard alloy YG11C (WC-11wt.%Co) and high strength steel 42CrMo were picked up as base metals and BCu64MnNi as filler metal to clarify the interfacial microstructure evolution. The process parameters of dwell time were set as 30s, 60s, 120s, and 300s and braze temperature were set as 950℃, 970℃, 990℃, 1010℃, the effect of which on the evolution of interfacial microstructure, tensile strength, integrated with fracture morphology analysis, were conducted. The results showed that increasing brazing temperature from 950℃ to 970℃, no significant difference existed in the joint interface, whereas brazed at 990℃, the binder phase erosion occurred, i.e. the liquid filler metal etched into Co binder phase of WC-Co base metal, which caused WC particles debonding from the base metal surface and formed an micro-anisotropic zone.. Increase temperature to 1010℃, severe binder erosion happened so as to micropores appear. Through the parameters optimization, the tensile strength can reach to the maximum 589MPa at temperature of 970℃. The dwell time showed similar effect on tensile strength because longer dwell time also caused erosion and porosity owing to long-time diffusion and reaction. 相似文献
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以Ce(NO_3)_3·6H_2O、Zn(NO_3)_2·6H_2O和NaOH为原料通过沉淀法制备了一系列Ce掺杂氧化锌(ZnO)材料,研究了Ce掺杂量、煅烧温度和煅烧时间对ZnO发光性能的影响。并用X射线衍射仪和荧光分光光度计对ZnO材料进行表征。结果表明:ZnO与Ce掺杂ZnO的结晶度均较高,Ce的掺杂没有改变ZnO的晶体结构。在煅烧温度为500℃,煅烧时间为2h,Ce掺杂量(摩尔分数)为2%时ZnO的发光性能最佳。Ce掺杂ZnO材料被波长为350nm的光有效激发,在波长为510nm附近的绿光处出现最强发射峰。 相似文献
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在钎焊温度920~970℃和钎焊保温时间20s条件下,采用B-Cu64MnNi钎料对TC4钛合金与YG8硬质合金进行真空高频感应钎焊实验。利用扫描电镜(SEM)、能谱分析(EDS)及X射线衍射分析(XRD)对钎焊接头的显微组织、成分分布和相结构进行了研究,测试了接头的抗拉强度并观察分析了断口形貌及其元素分布。结果表明,钎焊温度为920~940℃时TC4与YG8钎焊接头显微结构为:TC4/β-Ti/TiCu+Ti3Cu4+TiMn+Cu(Mn,Ni)/YG8,钎缝呈镶嵌结构;随钎焊温度升高,脆性片状组织TiMn增多,镶嵌结构破坏,接头性能明显降低;钎焊温度为930℃时,获得的接头抗拉强度最高,为206MPa。 相似文献
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针对传统局部二值模式及其扩展算法存在特征维度高、不能充分体现局部邻域像素间差值大小信息等问题,提出一种局部排序差值细化模式(LSDRP).首先根据采样半径大小对图像进行相应规格的高斯滤波,并按灰度值将局部邻域采样点排序;然后计算局部排序邻域内像素间的差值并将其融入排序二值编码对应位置的权值中,从而生成LSDRP特征;最后选取LSDRP特征模式中的高频模式表征图像,并级联多个半径下LSDRP特征的高频模式构成图像纹理的多尺度表示.在Outex,CUReT和UMD纹理库上的实验结果表明,所提算法计算简单且能在低维度条件下有效解决纹理分类中存在的光照、旋转变化问题;特别是在TC10,TC12_000和TC12_001纹理库上仅需120维特征即可分别达到100%,99.38%和99.72%的分类精度. 相似文献
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利用微弧氧化(MAO)技术在TC4钛合金表面原位制备陶瓷膜层,并通过硅酸钠水溶液对膜层进行了封孔处理。采用X射线衍射仪(XRD)分析了膜层相组成,通过扫描电子显微镜(SEM)观察了膜层表面形貌。通过粘结拉伸测试,比较了膜层在封孔前后与基体的结合强度。利用高温氧化实验,考察了TC4基体及膜层试样封孔前后的抗高温氧化性能。结果表明:微弧氧化膜层与基体间的结合强度较高,经封孔处理及高温氧化100 h后,膜基结合强度降低至4.29 MPa。与TC4基体相比,微弧氧化膜层的高温氧化增重量小,抗高温氧化性能得到了显著的提高。封孔处理提高了微弧氧化膜层的致密性,使其能更好地阻止氧透过膜层向基体内侵入,进一步提高了膜层的抗高温氧化性能。 相似文献