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Ti3SiC2 materials have been fabricated by spark plasma sintering of the elemental powders with the addition of Al.At the heating rate of 80℃/min and under the pressure of 30MPa,the ideal synthesis temperature of Ti3SiC2 is in the range of 1150-1250℃.The addition of Al is in favor of the formation of Ti3SiC2.The synthesized compound has the molecular of Ti3Si0.8Al0.2C2 and lattice parameters of α=0.3069nm,c=1.7670nm.Its grain is plane-shape with a size of about 50μm in the elongated dimension.The prepared material has Vickers hardness of 3.5-5.5GPa(at 1N and 15s) and is as readily machinable as graphite‘s. 相似文献
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应用分光光度法测定食品中的蛋白质,操作简单,适合于大批样品的同时测定,检验所得结果与凯氏蒸馏法相比无显著性差异。 相似文献
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以TiC粉、Al粉、Ti粉为原料,采用无压烧结工艺制备高纯Ti–Al–C三元层状陶瓷,探究了烧结温度、烧结时间、烧结助剂等对Ti–Al–C系三元层状陶瓷制备的影响。结果表明:在一定范围内提高烧结温度和烧结时间能减少杂质相的产生,不添加助剂情况下在1 400℃下保温3 h能得到80%(质量分数)以上的Ti–Al–C系三元层状陶瓷,该条件下掺入少量Si粉或Sn粉能得到高纯Ti–Al–C系三元层状陶瓷。TiC、Al、Ti和Si质量比为2.0:1.2:1.0:0.1的原料粉末在1 400℃保温3 h能得到纯度99%以上的Ti_3AlC_2陶瓷,TiC、Al、Ti和Sn质量比为2.0:1.2:1.0:0.1与TiC、Al、Ti和Sn质量比为1.0:1.2:1.0:0.1的原料粉末在1 400℃保温3 h均能制备出纯度99%的以Ti_3AlC_2为主晶相的Ti_3AlC_2/Ti_2AlC复相陶瓷。 相似文献
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Cu/Ti_3AlC_2 composite and functional-gradient materials with excellent electrical conductivity and thermal conductivity as well as good flexural properties were prepared by low-temperature spark plasma sintering of Cu and Ti_3AlC_2 powder mixtures. The phase compositions of the materials were analyzed by X-ray diffraction, and their microstructure was characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy. Further, the electrical conductivity, thermal conductivity, and flexural properties of the materials were tested. Results show that, for the composite materials, the resistivity rises from 0.75 × 10~(-7) Ω·m only to 1.32 × 10~(-7) Ω·m and the thermal diffusivity reduces from 82.5 mm~2/s simply to 39.8 mm~2/s, while the flexural strength improves from 412.9 MPa to 471.3 MPa, as the content of Ti_3AlC_2 is increased from 5 wt%to 25 wt%. Additionally, the functional-gradient materials sintered without interface between the layers exhibit good designability, and their overall electrical conductivity, thermal conductivity, and flexural strength are all higher than those of the corresponding uniform composite material. 相似文献