Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing

Al/Cu metal joints applied for the electrical connector was joined by the friction welding method to limit the formation of intermetallic compound under optimum friction welding condition. To guarantee the reliability of the Al/Cu joints in service requirement, the effects of the intermetallic compound layer on the electrical and mechanical properties have been investigated under various annealing conditions. Two kinds of intermetallic compounds layer were formed in the joints interface and identified by AlCu and Al₂Cu. The growth kinetic of these intermetallics during the annealing can be followed by volume diffusion process. The activation energy of Al₂Cu, AlCu and total intermetallic compound (AlCu + Al₂Cu) represented 107.5, 98.42 and 110.22 kJ/mol, respectively. A thicker intermetallic compound layers could seriously degrade the electrical resistivity and tensile strength. The electrical resistivity with 21 μm thickness of intermetallic compound was 45 μΩ cm and increased to be 85 μΩ cm with 107 μm of intermetallic compound. Tensile strength remarkably decreased from 85 MPa to near zero at the annealing condition of 773 K and 129.6 ks and fracture occurred through the intermetallic compound layers.     

Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress

The electromigration behavior of low-melting temperature Sn-58Bi (in wt%) solder joints was investigated with a high current density between 3 and 4.5 × 10³ A/cm² between 80 and 110 °C. In order to analyze the impact of various substrate metallizations on the electromigration performance of the Sn-58Bi joint, we used representative substrate metallizations including electroless nickel immersion gold (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG), and organic solderability preservatives (OSP). As the applied current density increased, the time to failure (TTF) for electromigration decreased regardless of the temperature or substrate metallizations. In addition, the TTF slightly decreased with increasing temperature. The substrate metallization significantly affected the TTF for the electromigration behavior of the Sn-58Bi solder joints. The substrate metallizations for electromigration performance of the Sn-58Bi solder are ranked in the following order: OSP-Cu, ENEPIG, and ENIG. Due to the polarity effect, current stressing enhanced the fast growth of intermetallic compounds (IMCs) at the anode interface. Cracks occurred at the Ni₃Sn₄ + Ni₃P IMC/Cu interfaces on the cathode sides in the Sn-58Bi/ENIG joint and the Sn-58Bi/ENEPIG joint; this was caused by the complete consumption of the Ni(P) layer. Alternatively, failure occurred via deformation of the bulk solder in the Sn-58Bi/OSP-Cu joint. The experimental results confirmed that the electromigration reliability of the Sn-58Bi/OSP-Cu joint was superior to those of the Sn-58Bi/ENIG or Sn-58Bi/ENEPIG joints.     

快速高精度除法算法的FPGA实现

为在现场可编程门阵列(FPGA)中实现快速高精度除法,在传统的倒数除法的基础上,提出一种改进算法.对倒数求解采用泰勒级数展开结合优化搜索逼近,求出各个分区间内的拟合一次两项式,再通过一次牛顿迭代提高精度.时序仿真结果表明,以该算法构建的除法器易于在FPGA上实现,时延仅为6个时钟周期,能达到2(-34)的有效精度和86...     

EXPERIMENTAL ESTIMATION OF A SCALING EXPONENT FOR TIP VORTEX CAVITATION VIA ITS INCEPTION TEST IN FULL- ANDMODEL-SHIP

Tip vortex cavitation noise of marine propeller became primary concerns to reduce hazardous environmental impacts from commercial ship or to keep the underwater surveillance of naval ships. The investigations of the tip vortex and its induced noise are normally conducted through the model test in a water cavitation tunnel. However the Reynolds number of model-test is much smaller than that of the full-scale, which subsequently results in the difference of tip vortex cavitation inception. Hence, the scaling law between model-and full-scales needs to be identified prior to the prediction and assessment of propeller noise in full scale. From previous researches, it is generally known that the incipient caivtation number of tip vortex can be represented as a power of the Reynolds number. However, the power exponent for scaling, which is the main focus of this research, has not been clearly studied yet. This paper deals with the estimation of scaling exponent based on tip vortex cavitation inception test in both full-and model-scale ships. Acoustical measurements as well as several kind of signal processing technique for an inception criterion suggest the scaling exponent as 0.30. The scaling value proposed in this study shows slight difference to the one of most recent research. Besides, extrapolation of model-ship noise measurement using the proposed one predicts the full-scale noise measurement with an acceptable discrepancy.     

Interfacial reactions and intermetallic compound growth between indium and copper

The growth kinetics of intermetallic compound layers formed between pure indium solder and bare Cu substrate by solid-state isothermal aging were examined at temperatures between 343 and 393 K for 0–4×10⁶ s. A quantitative analysis of the intermetallic compound layer thickness as a function of time and temperature was performed. Experimental results showed that the Cu₁₁In₉ intermetallic compound was observed for bare copper substrate. Additionally, the thickness of the Cu₁₁In₉ intermetallic compound was increased with the aging temperature and time. The layer growth of the intermetallic compound in the couple of the In/Cu system followed a parabolic law over the given temperature range. As a whole, because the values of time exponent (n) were approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by a diffusion mechanism over the temperature range studied. The apparent activation energy of Cu₁₁In₉ intermetallic compound in the couple of the In/Cu was 34.16 kJ mol^–1.     

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders

In this study, electrodes on a flexible printed circuit board (FPCB) and rigid PCB (RPCB) were bonded by a thermo-compression bonding. The surface finishes on the Cu electrodes of the FPCB and RPCB were organic-solderability-preservative and electroless Ni/immersion Au (ENIG), respectively. Pb-free Sn-3.0 Ag and Sn-3.0 Ag-0.5 Cu solders were used as interlayers. In order to determine the optimum bonding conditions, such as bonding force, time, and temperature, a 90° peel test of the FPCB-RPCB joint was conducted. The relationships between the bonding conditions and peel strength were investigated. We successfully accomplished the thermo-compression bonding of reliable FPCB-RPCB joints by using Sn-Ag and Sn-Ag-Cu interlayers. The thermo-compression bonding method is a stable and well-controlled process and can produce robust and reliable connections.