Correlation between motion of source bender element and feedback signal induced by self-monitoring

Since the introduction of bender element tests to soil testing, the reliability of the estimated travel time has been the most serious problem. The author has previously shown a potential solution whereby removing the response of the bender element subsystem from the whole response could dramatically improve the accuracy of the travel time estimation. In order to lay the foundation for estimating the response of the bender element subsystem, this paper examines the correlation between the displacements of the element and the induced feedback signals by employing a self-monitoring element. The response of the self-monitoring element is modeled as a transfer function involving two internal transfer functions that relate the input signals to the displacements and the displacements to the feedback signals, respectively. Using a laser displacement sensor, the displacements are directly measured through the entire surface and reveal the three-dimensional bending motion of the element oscillating in both longitudinal and width directions. The feedback signals are similar to, but inconsistent with, the tip displacements, and an attempt is made to correct the feedback signals. Finally, a conclusion is given on the potential for estimating the response of the bender element subsystem using the self-monitoring element.     

New fault locating system for air-insulated substations usingoptical current detector

The authors present the basic philosophy, construction, design features, and test results of a new fault locating system. This fault locating system helps to shorten the time required for restoration of service after the occurrence of a busbar fault in an air-insulated distribution substation. Recent optical and electronic technologies allow the design of a highly accurate and compact fault locating system which consists of optical current detectors using the Faraday effect and a fault locating processor using a digital data processing technique. The fault location is carried out by discriminating between the directions of zero-sequence currents. Through various tests and field operations, it has been confirmed that the system has sufficient performance for practical applications     

二垩英与资源回收-Ⅰ考虑到二垩英生成的资源与能量回收基础研究

目前在日本,存在大量工业垃圾,包括各种塑料制品,ASR(汽车破碎垃圾),含有毒PCB(多氯联苯)的110变压器和PVC(聚氯乙稀)制品等.而来自城市垃圾焚烧炉的废气含有大量能量.因此,在充分考虑环境、避免二垩英生成的同时,安全回收来自工业垃圾、城市和/或工业垃圾焚烧炉的资源和能量是个非常重要的课题,这也将对抑制CO2排放作出贡献.正确地阐明焚烧过程中二垩英的生成机理及详细研究含少量二垩英的焚烧废气在冷却过程中大量形成二垩英的临界温度是项很重要的工作.解决这个问题可有效实现资源和能量的回收.本报告介绍日本在二垩英排放方面目前采取的对策和存在的问题以及大阪大学为阻止二垩英生成所做的基础研究工作.     

Beam test of the CsI(Tl) calorimeter for the BELLE detector at the KEK-B factory

We studied the performance of a prototype electromagnetic calorimeter for the BELLE detector at the KEK proton synchrotron for an energy range of 0.25–3.5 GeV. The prototype consisted of an array of 6 × 5 CsI(Tl) crystals with 30 cm length (16.2 radiation lengths) and about 6 cm × 6 cm cross section. The scintillation light of each CsI(Tl) crystal was read out by two large-area PIN photodiodes and charge-sensitive preamplifiers attached at the rear face of the crystal. We measured the energy and position resolution for electrons and the e/π separation for two sets of matrix configurations: one corresponded to the center and the other to the edge of the barrel calorimeter. The overall performance measured by the test proves that the prototype calorimeter is satisfactory for the use in the BELLE detector.     

Reliability of Au bump––Cu direct interconnections fabricated by means of surface activated bonding method

As a room temperature bonding method, surface activated bonding (SAB) method has been introduced to be one of the most appropriate interconnection methods for the next generation of electronic packaging. Thus it is important to study the reliability of SAB interconnection in long term life test.In this paper, interconnections of Au bump and Cu film bonded by SAB method were performed in high temperature thermal aging test. Degradation of properties such as electrical resistance, shear strength of bump and interface microstructure during aging process were studied to investigate the failure mechanism of the interconnection. Intermetallic compound Cu₃Au was found formed at the interface during thermal aging, and it causes evolvement of the properties and failure mode of the interconnection changing in shear test. Results reveal that SAB is suitable for the interconnection between Au bump and Cu film and it is reliable in thermal reliability test.     

Preparation of zirconia-toughened bioactive glass-ceramics

Bioactive glass-ceramics toughened by tetragonal zirconia polycrystal (TZP) were prepared by hot-pressing mixed powders of the MgO-CaO-P₂O₅-SiO₂ glass and TZP containing 20 to 80% alumina. The bending strength and the fracture toughness of the composite materials were improved compared with those of the material without TZP. These composites showed high bending strengths (400 to 500MPa) and high fracture toughness ( 2.8MPa m^1/2). The existence of a crack deflection mechanism was observed by scanning electron microscopy. After soaking in simulated physiological solution at 100 °C, no phase transformation from tetragonal to monoclinic of TZP in the composites and no degradation in bending strength occurred.     

Humidity Sensor Characteristics of Woodceramics

The humidity sensor characteristics of Woodceramics were investigated. The Woodceramics used in this experiment were prepared at 650–900°C. The size of specimens selected was 1 × 1 × 10 mm . One was used as-cut and the other was polished. Above 700°C, the resistance of the specimen was below 50 and the decrease of resistance with increasing relative humidity was small. The specimen prepared at 650°C had a resistance of about 1 k. The resistance of as-cut specimens decreased with increase in relative humidity, but that of the polished specimen did not change significantly. The difference between as-cut and polished samples was explained by the differences in surface micro-structure.     

Application of enzymatically gelled chitosan solutions to water‐resistant adhesives

An investigation was undertaken on the application of dilute chitosan solutions gelled by tyrosinase‐catalyzed reaction with 3,4‐dihydroxyphenethylamine (dopamine). The tyrosinase‐catalyzed reaction with dopamine conferred water‐resistant adhesive properties to the semidilute chitosan solutions. The viscosity of the chitosan solutions increased highly by the tyrosinase‐catalyzed reaction and the subsequent reactions between o‐quinone compounds and chitosan. These highly viscous, gel‐like modified chitosan materials were allowed to spread onto the surfaces of the glass slides, which were tightly lapped together and held them in water. Tensile shear adhesive strength of over 400 kPa was observed for the modified chitosan samples. The increase in the amino group concentration of the chitosan solutions and the molecular mass of the chitosan used effectively led to the increase in adhesive strength of the glass slides. In addition, in the case where the chitosan solution was gelled by the enzymatic reaction with dopamine in the presence of poly(ethylene glycol), adhesive strength sharply increased at shorter reaction times concomitantly with the increase in the viscosity of the chitosan solutions because the tyrosinase activity effectively was retained by poly(ethylene glycol). © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1818–1827, 2007     

Development of reel-to-reel microchip mounting system for fabrication of meter-long LED lighting tapes

We have developed a reel-to-reel microchip mounting system that continuously mounts LED chips and other microchips on meter-long flexible printed circuit board (PCB) tape for 1.2-m-long standard LED light tubes. Mounting microchips on meter-long PCBs is difficult because a large chip mounter is expensive and the chip positioning stage is difficult to move in a meter-wide area with an accuracy of hundreds of micrometers. Hence, we developed a new microchip mounting system that utilizes a small chip mounter and reel winding machines. The system repeatedly moves the long PCB tape by a certain length with the reel winding machines and mounts the chips on it. The PCB tape (which is 5 mm wide) is made by fabricating long PCB tapes which are 25 cm × 26.6 m through a roll-to-roll PCB process and slitting them into meter-long tapes. The reel-to-reel system repeatedly mounts chips by adjusting their positions through image processing of the copper wiring pattern on the PCBs. Our constructed system mounted 24 LED chips with a pitch of 5 cm with an accuracy of 0.082 mm to form a 1.2-m-long LED tape. The luminance of the tape is 12.4 lx at a distance of 1 m, which is the luminance of outdoor corridor lighting. Therefore, this system can be used for meter-long tape lighting.