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1.
In this paper, we study scheduling games under mixed coordination mechanisms on hierarchical machines. The two scheduling policies involved are ‐ and ‐, where ‐ (resp., ‐) policy sequences jobs in nondecreasing order of their hierarchies, and jobs of the same hierarchy in nonincreasing (resp., nondecreasing) order of their processing times. We first show the existence of a Nash equilibrium. Then we present the price of anarchy and the price of stability for the games with social costs of minimizing the makespan and maximizing the minimum machine load. All the bounds given in this paper are tight. 相似文献
2.
Ye Wan Jun Tan Guangling Song Chuanwei Yan 《Metallurgical and Materials Transactions A》2006,37(7):2313-2316
The focused ion beam technique was employed to investigate the atmospheric corrosion morphology of AZ91D. It was found that
the α matrix of the alloy was preferentially corroded in the areas adjacent to intermetallic phases. The most interesting
finding was that the corrosion products in corrosion cavities were pelletlike, which has never been reported before. 相似文献
3.
Supported metal catalysts, particularly noble metals supported on SiO2, have attracted considerable attention due to the importance of the silica–metal interface in heterogeneous catalysis and in electronic device fabrication. Several important issues, e.g., the stability of the metal–oxide interface at working temperatures and pressures, are not well-understood. In this review, the present status of our understanding of the metal–silica interface is reviewed. Recent results of model studies in our laboratories on Pd/SiO2/Mo(1 1 2) using LEED, AES and STM are reported. In this work, epitaxial, ultrathin, well-ordered SiO2 films were grown on a Mo(1 1 2) substrate to circumvent complications that frequently arise from the silica–silicon interface present in silica thin films grown on silicon. 相似文献
4.
P(DBF-VA)型柴油低温流动性改进剂的研制 总被引:1,自引:1,他引:0
针对新疆地产柴油蜡含量较高的特点,以游离基聚合法合成了富马酸双链混合酯和醋酸乙烯酯共聚物型[P(DBF-VA)]柴油低温流动改进剂,利用正交实验研究了单体配比,引发剂用量,溶剂用量,聚合温度对聚合物降冷滤效果的影响。共聚物用IR进行表征,利用XRD初步探讨了该降凝剂的降凝机理。结果表明:该剂能使吐哈—10~#、0~#柴油冷滤点降低10℃和7℃;使独山子0~#柴油冷滤点下降12℃;使石化0~#柴油冷滤点下降8℃;使克拉玛依0~#柴油的冷滤点下降8℃。 相似文献
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6.
A new detection algorithm (NDA) based on fuzzy cellular neural networks for white blood cell detection. 总被引:1,自引:0,他引:1
White blood cell detection is one of the most basic and key steps in the automatic recognition system of white blood cells in microscopic blood images. Its accuracy and stability greatly affect the operating speed and recognition accuracy of the whole system. But there are only a few methods available for cell detection or segmentation due to the complexity of the microscopic images. This paper focuses on this issue. Based on the detailed analysis of the existing two methods--threshold segmentation followed by mathematical morphology (TSMM), and the fuzzy logic method--a new detection algorithm (NDA) based on fuzzy cellular neural networks is proposed. NDA combines the advantages of TSMM and the fuzzy logic method, and overcomes their drawbacks. With NDA, we can detect almost all white blood cells, and the contour of each detected cell is nearly complete. Its adaptability is strong and the running speed is expected to be comparatively high due to the easy hardware implementation of FCN. Experimental results show good performance. 相似文献
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9.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献
10.