Synthesis,structure, CO oxidation,and H2 production activities of CaCu3−xMnxTi4−xMnxO12 (x = 0, 0.5, and 1.0)

Synthesis of nanocrystalline pristine and Mn-doped calcium copper titanate quadruple perovskites, CaCu_3?xMn_xTi_4?xMn_xO₁₂ (x = 0, 0.5, and 1.0) by modified citrate solution combustion method has been reported. Powder X-ray diffraction patterns attest the phase purity of the perovskite materials. Average particle sizes of all the materials obtained from the Scherrer's formula are in the range of 55–70 nm. The specific surface areas for all the perovskites obtained from BET isotherms are found to be low as expected for the condensed oxide systems and fall in the range of 13–17 m² g^?1. Transmission electron microscopy studies show a reduction in particle size of CaCu₃Ti₄O₁₂ with increase in Mn doping. Ca and Ti are present in +2 and +4 oxidation states in all the materials as demonstrated by X-ray photoelectron spectroscopy analyses. Cu²⁺ gets reduced in CaCu₃Ti₄O₁₂ with higher Mn content. Mn is observed to be present only in +3 oxidation state. All the materials have been examined to be active in CO oxidation as well as H₂ production from methanol steam reforming. CaCu₃Ti₄O₁₂ with ~14 at.% Mn is found to show best catalytic activities among these materials. A comprehensive analysis of the catalytic activities of these perovskites toward CO oxidation and H₂ production from MSR reveal the cooperative activity of copper-manganese in the doped perovskites and it is more effective at lower manganese content.     

An Integrated Approach to Thermal Management in High-Level Synthesis

Thermal effects are becoming an important factor in the design of integrated circuits due to the adverse impact of temperature on performance, reliability, leakage, and chip packaging costs. Making all phases of the design flow aware of this physical phenomenon helps in reaching faster design closure. In this paper, we present an integrated approach to thermal management in architectural synthesis. Our synthesis flow combines temperature-aware scheduling and binding based on feedback from thermal simulation. We show that our flow is effective in preventing hotspot formation and creating an even thermal profile of the resources. Our integrated thermal management technique on average reduces the peak temperature of the resources by 7.34 degC when compared to a thermal unaware flow without increasing the number of resources across our set of benchmarks     

Nodal sensitivities as error estimates in computational mechanics

Summary This paper proposes the use of special sensitivities, called nodal sensitivities, as error indicators and estimators for numerical analysis in mechanics. Nodal sensitivities are defined as rates of change of response quantities with respect to nodal positions. Direct analytical differentiation is used to obtain the sensitivities, and the infinitesimal perturbations of the nodes are forced to lie along the elements. The idea proposed here can be used in conjunction with general purpose computational methods such as the Finite Element Method (FEM), the Boundary Element Method (BEM) or the Finite Difference Method (FDM); however, the BEM is the method of choice in this paper. The performance of the error indicators is evaluated through two numerical examples in linear elasticity.     

Optimized partitioning of a wavelength distributed data interfacering network

A fiber optic ring network, such as fiber distributed data interface (FDDI), can be operated over multiple wavelengths on its existing fiber plant consisting of point-to-point fiber links. Using wavelength division multiplexing (WDM) technology, FDDI nodes can be partitioned to operate over multiple subnetworks, with each subnetwork operating independently on a different wavelength, and inter-subnetwork traffic forwarding performed by a bridge. For this multiwavelength version of FDDI, which we refer to as wavelength distributed data interface (WDDI), we examine the necessary upgrades to the architecture of a FDDI node, including its possibility to serve as a bridge. The main motivation behind this study is that, as network traffic scales beyond (the single-wavelength) FDDI's information-carrying capacity, its multiwavelength version, WDDI, can gracefully accommodate such traffic growth. A number of design choices exist in constructing a good WDDI network. Specifically, we investigate algorithms using which, based on prevailing traffic conditions, partitioning of nodes into subnetworks can be performed in an optimized fashion. Our algorithms partition the nodes into subrings, such that the total traffic flow in the network and/or the network-wide average packet delay is minimized     

Estimation of failure probability from a bivariate normal stress-strength distribution

Probability (P) of equipment failure consequent upon stress exceeding built-in strength has been estimated assuming a bivariate normal stress-strength distribution. The UMVUE of P when parameters other than the means are known has been derived. An alternative estimator based on maximum likelihood estimates has been proposed in the case when all the five parameters are unknown. Asymptotic variances of both these estimators have been worked out. Some relevant numerical computations have also been reported.     

Heat Transfer Analysis for Gas-to-Liquids Transportation Through Trans Alaska Pipeline

Gas-to-liquids (GTL) technology involves the conversion of natural gas to liquid hydrocarbons. In this article, theoretical studies have been presented to determine the feasibility of transporting GTL products through the Trans-Alaska Pipeline System (TAPS). To successfully transport GTL through TAPS, heat loss along the route must be carefully determined. This study presents heat transfer and fluid dynamic calculations to evaluate this feasibility. Because of heat loss, the fluid temperature decreases in the direction of flow and this affects the fluid properties, which in turn influence convection coefficient and pumping power requirements. The temperature and heat loss distribution along the pipeline at different locations have been calculated. Fairly good agreement with measured oil temperatures is observed. The powers required to pump crude oil and GTL individually, against various losses have been calculated. Two GTL transportation modes have been considered; one as a pure stream of GTL and the second as a commingled mixture with crude oil. These results show that the pumping power and heat loss for GTL are less than that of the crude oil for the same volumetric flow rate. Therefore, GTL can be transported through TAPS using existing equipment at pump stations.     

Life expectancies of Pb-free SAC solder interconnects in electronic hardware

The transition from lead (Pb) bearing solder to Pb-free solder has arisen in response to government restrictions on the use of lead (Pb) by the European Union. As a result, electronic manufacturers have sought a material comparable to the conventional 63Sn37Pb solder that has been traditionally used to assemble electronic hardware. Based on extensive review of various solder combination, the majority of electronic manufacturers appear to be adopting a tin–silver–copper (SAC) solder as a popular Pb-free solder replacement. Significant investments have been made by many researchers to characterize the material behavior and durability of this solder system. While the exact composition of the SAC solder is still in question, it now appears that the 96.5Sn3.0Ag0.5Cu (SAC305) solder is gaining wider acceptance as the favored Pb-free replacement, for surface mount assemblies that are going to be subjected predominantly to cyclic thermal environments. This paper presents a review of our current understanding of the life expectancy of Pb-free SAC solder interconnects for electronic hardware. To this end, the paper focuses on material characterization of SAC solder, as well as its temperature cycling and vibration fatigue reliability. From this review, SAC solder interconnects are shown to be suitable for providing adequate life expectancies for temperature cycling in electronic hardware. However, it is clear that there are differences between SAC and the conventional Sn37Pb solder, that need to be understood in order to design reliable electronic hardware.