Neo Arithmetic and Ranking Techniques for Trapezoidal Generalized Interval Valued Fuzzy Numbers: Their Applications in Decision Making for Medical Investigation

Neural Processing Letters - The uncertainty caused mainly by the deficiency of precision and data, artificial/human-made errors, information accessed from expert opinions or very miniature size of...     

Heat Transfer Analysis for Gas-to-Liquids Transportation Through Trans Alaska Pipeline

Gas-to-liquids (GTL) technology involves the conversion of natural gas to liquid hydrocarbons. In this article, theoretical studies have been presented to determine the feasibility of transporting GTL products through the Trans-Alaska Pipeline System (TAPS). To successfully transport GTL through TAPS, heat loss along the route must be carefully determined. This study presents heat transfer and fluid dynamic calculations to evaluate this feasibility. Because of heat loss, the fluid temperature decreases in the direction of flow and this affects the fluid properties, which in turn influence convection coefficient and pumping power requirements. The temperature and heat loss distribution along the pipeline at different locations have been calculated. Fairly good agreement with measured oil temperatures is observed. The powers required to pump crude oil and GTL individually, against various losses have been calculated. Two GTL transportation modes have been considered; one as a pure stream of GTL and the second as a commingled mixture with crude oil. These results show that the pumping power and heat loss for GTL are less than that of the crude oil for the same volumetric flow rate. Therefore, GTL can be transported through TAPS using existing equipment at pump stations.     

Life expectancies of Pb-free SAC solder interconnects in electronic hardware

The transition from lead (Pb) bearing solder to Pb-free solder has arisen in response to government restrictions on the use of lead (Pb) by the European Union. As a result, electronic manufacturers have sought a material comparable to the conventional 63Sn37Pb solder that has been traditionally used to assemble electronic hardware. Based on extensive review of various solder combination, the majority of electronic manufacturers appear to be adopting a tin–silver–copper (SAC) solder as a popular Pb-free solder replacement. Significant investments have been made by many researchers to characterize the material behavior and durability of this solder system. While the exact composition of the SAC solder is still in question, it now appears that the 96.5Sn3.0Ag0.5Cu (SAC305) solder is gaining wider acceptance as the favored Pb-free replacement, for surface mount assemblies that are going to be subjected predominantly to cyclic thermal environments. This paper presents a review of our current understanding of the life expectancy of Pb-free SAC solder interconnects for electronic hardware. To this end, the paper focuses on material characterization of SAC solder, as well as its temperature cycling and vibration fatigue reliability. From this review, SAC solder interconnects are shown to be suitable for providing adequate life expectancies for temperature cycling in electronic hardware. However, it is clear that there are differences between SAC and the conventional Sn37Pb solder, that need to be understood in order to design reliable electronic hardware.     

Response level crossing rate of a linear system excited by a partially specified Gaussian load process

The problem of determining the maximum mean response level crossing rate of a linear system driven by a partially specified Gaussian load process has been considered. The partial specification of the load is given only in terms of its total average energy. The critical input power spectral (PSD) function, which maximizes the mean response level crossing rate, is obtained. The critical input PSD turns out to be highly narrow-banded which fails to capture the erratic nature of the excitation. Consequently, the trade-off curve between the maximum mean response level crossing rate and the maximum disorder in the input process, quantified in terms of its entropy rate, has been generated. The method of Pareto optimization is used to tackle the conflicting objectives of the simultaneous maximization of the mean response level crossing rate and the input entropy rate. The non-linear multi-objective optimization has been carried out using a recently developed multi-criteria genetic algorithm scheme. Illustrative example of determining the critical input of an axially vibrating rod, excited by a partially specified stationary Gaussian load process, has been considered.     

Pad effects on material-removal rate in chemical-mechanical planarization

The role of a porous pad in controlling material-removal rate (MRR) during the chemical-mechanical planarization (CMP) process has been studied numerically. The numerical results are used to develop a phenomenological model that correlates the forces on each individual abrasive particle to the applied nominal pressure. The model provides a physical explanation for the experimentally observed domains of pressure-dependent MRR, where the pad deformation controls the load sharing between active-abrasive particles and direct pad-wafer contact. The predicted correlations between MRR and slurry characteristics, i.e., particle size and concentration, are in agreement with experimentally measured trends reported by Ouma¹ and Izumitani.²     

Exact solutions for characterization of electro-elastically graded materials

The present paper deals with a class of functionally graded materials (FGM), called active FGM that has electro-elastically graded material phases. An active FGM system leads to minimization of stress concentration that arises due to mismatch in the electrical and elastic properties of the constituent phases. This work focuses on the characterization of the through thickness stresses of an active FGM subjected to electrical excitation. The structure is comprised of a substrate, an electro-elastically graded layer and an active layer. A formulation for exact solutions of the system based on Euler–Bernoulli theory is presented. Power-law variation of the composition of the two phases in the graded layer is considered. Performance of linearly gradient FGM for a range of stiffness and electrical property ratios of the active and substrate materials have been studied. It is observed that the electrical strain component and the compositional gradation significantly influence the stress characteristics of the active FGM.     

Decentralizing India's urban development

Early in 1983 the Indian Planning Commission appointed four Task Forces on Housing and Urban Development to review existing urban policies and to recommend appropriate action starting from the Seventh Plan (1985–1989). The Task Forces covered four areas of major concern: (1) urban planning, (2) urban finance, (3) urban organizations, and (4) urban shelter. They submitted their reports by the end of 1983, and taken together these constitute the most significant review of urban policy ever undertaken in India. ¹ The Task Forces had distinguished urban experts, both officials and academics, as members, with a common Member-Secretary from the Planning Commission. The common theme in all four reports is a plea for a decentralized and equitable approach towards urban development in the country.     

III–V super-lattice SPST/SPMT pin switches for THz communication: theoretical reliability and experimental feasibility studies

Microsystem Technologies - A physics-based Quantum-Modified CLassical Drift–Diffusion (QMCLDD) non-linear mathematical model has been developed for design and characterisation of GaN/AlGaN...     

Design and characterization of asymetrical super-lattice Si/4H-SiC pin photo diode array: a potential opto-sensor for future applications in bio-medical domain

Microsystem Technologies - Photo-sensors are integral part of different bio-medical diagnostic equipment. Each type of bio-molecules possess unique spectral fingerprint in visible wavelength region...     

Chemical composition and bond structure of carbon-nitride films deposited by CH4/N2 dielectric barrier discharge

Carbon nitride films have been deposited by dielectric barrier discharge with a CH₄/N₂ gas mixture at different conditions. Fourier Transform Infrared (FTIR) spectroscopy, X-ray photo electron spectroscopy (XPS), Raman spectroscopy, Atomic force microscopy (AFM) and ellipsometry were used to systematically study chemical composition, bond structure and surface morphology of deposited films. Various bonds between carbon, nitrogen, hydrogen, and also oxygen were observed.