Prediction of ultrasonic wave velocity in particleboard and fiberboard

Ultrasonic wave velocities were determined at parallel and perpendicular to manufacturing direction and at the interval angles of 15° in clockwise and counterclockwise directions of particleboard and fiberboard. The experimental results were compared with the predicted values using some empirical formulae such as Hankinson and Jacoby equations. The results showed that the ultrasonic wave velocity were the highest in parallel direction in particleboard and fiberboard and decreases with increase of angle and the lowest values occurred in perpendicular direction. The predicted ultrasonic velocity using Hankinson and Jacoby equations are in close agreement with the measured values. Relationship between ultrasonic wave velocities and particles and fibers angle could be successfully presented by cubic and quadratic regression equations as well.     

A hermetic glass-silicon micropackage with high-density on-chipfeedthroughs for sensors and actuators

This paper describes the development of a hermetic micropackage with high-density on-chip feedthroughs for sensor and actuator applications. The packaging technique uses low-temperature (320°C) electrostatic bonding of a custom-made glass capsule (Corning 7740, 2×2×8 mm³) to fine grain polysilicon in order to form a hermetically sealed cavity. High-density on-chip multiple polysilicon feedthroughs (200 per millimeter) are used for connecting external sensors and actuators to the electronic circuitry inside the package. A high degree of planarity over feedthrough areas is obtained by using grid-shaped polysilicon feedthrough lines that are covered with phosphosilicate glass (PSG), which is subsequently reflown at 1100°C in steam for 2 h. Saline and DI water soak tests at elevated temperatures (85 and 95°C) were performed to determine the reliability of the package. Preliminary results have shown a mean time to failure (MTTF) of 284 days and 118 days at 85 and 95°C, respectively, in DI water. An Arrhenius diffusion model for moisture penetration yields an expected lifetime of 116 years at body temperature (37°C) for these packages. In vivo tests in guinea pigs and rats for periods ranging from one to two months have shown no sign of infection, inflammation, or tissue abnormality around the implanted package     

Long‐term water uptake behavior of natural fiber/polypropylene composites

Composites of different natural fibers and polypropylene were prepared and their long‐term water absorption behaviors were studied. Wood flour, rice hulls, newsprint fibers, and kenaf fibers (at 25 and 50% by weight contents) were mixed with polypropylene and 1 and 2% compatibilizer, respectively. Water absorption tests were carried out on injection‐molded specimens at room temperature for 5 weeks. Measurements were made every week and water absorption was calculated. Water diffusion coefficients were also calculated by evaluating the water absorption isotherms. Results indicated a significant difference among different natural fibers, with kenaf fibers and newsprint fibers exhibiting the highest and wood flour and rice hulls the lowest water absorption values, respectively. The difference between 25 and 50% fiber contents for all composite formulations increased at longer immersion times. Water diffusion coefficients of the composites were found to be about 3 orders of magnitude higher than that of pure PP. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci, 2006     

Numerical and Experimental Study of an Under-Ground Water Reservoir,Cistern

This article presents experimental and numerical study of an under-ground water reservoir (cistern) during six months operation in a semi-arid region. The cistern with one dome, four windcatchers and a water reservoir is located in Lar, a hot arid city at south of Iran. Outdoor and indoor air temperature and humidity, water temperature in three depths and dome surface temperature were measured using a data logging system. The results show that the average air humidity inside the cistern was almost constant during the experiments but its slight variation during a day follows inside air temperature changes. The inside air temperature was always lower than the ambient temperature and inside and outside average air temperature difference was about 6 °C. The difference was slightly higher in the hot seasons. The water reservoir was also modeled in 2D, axisymmetric and quasi steady numerical simulation for six months of operation. Highly stratified water temperature distribution was observed in the numerical results as well as the experimental measurements.     

Mechanical properties of composites from sawdust and recycled plastics

Mechanical properties of wood plastic composites (WPCs) manufactured from sawdust and virgin and/or recycled plastics, namely high density polyethylene (HDPE) and polypropylene (PP), were studied. Sawdust was prepared from beech industrial sawdust by screening to the desired particle size and was mixed with different virgin or recycled plastics at 50% by weight fiber loading. The mixed materials were then compression molded into panels. Flexural and tensile properties and impact strength of the manufactured WPCs were determined according to the relevant standard specifications. Although composites containing PP (virgin and recycled) exhibited higher stiffness and strength than those made from HDPE (virgin and recycled), they had lower unnotched impact strengths. Mechanical properties of specimens containing recycled plastics (HDPE and PP) were statistically similar and comparable to those of composites made from virgin plastics. This was considered as a possibility to expand the use of recycled plastics in the manufacture of WPCs. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 3641–3645, 2006     

A parameter-tuned genetic algorithm for the resource investment problem with discounted cash flows and generalized precedence relations

A resource investment problem with discounted cash flows (RIPDCF) is a project-scheduling problem in which (a) the availability levels of the resources are considered decision variables and (b) the goal is to find a schedule such that the net present value of the project cash flows optimizes. In this paper, the RIPDCF in which the activities are subject to generalized precedence relations is first modeled. Then, a genetic algorithm (GA) is proposed to solve this model. In addition, design of experiments and response surface methodology are employed to both tune the GA parameters and to evaluate the performance of the proposed method in 240 test problems. The results of the performance analysis show that the efficiency of the proposed GA method is relatively well.     

A hermetic glass-silicon package formed using localizedaluminum/silicon-glass bonding

A hermetic package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. Less than 0.2 MPa contact pressure with 46 mA current input for two parallel 3.5-μm-wide polysilicon on-chip microheaters can raise the temperature of the bonding region to 700°C bonding temperature and achieve a strong and reliable bond in 7.5 min. The formation of aluminum oxide with silicon precipitate composite layer is believed to be the source of the strong bond. Accelerated testing in an autoclave shows some packages survive more than 450 h under 3 atm, 100% RH and 128°C. Premature failure has been attributed to some unbonded regions on the failed samples. The bonding yield and reliability have been improved by increasing bonding time and applied pressure     

Noise analysis and characterization of a sigma-delta capacitive microaccelerometer

This paper reports a high-sensitivity low-noise capacitive accelerometer system with one micro-g//spl radic/Hz resolution. The accelerometer and interface electronics together operate as a second-order electromechanical sigma-delta modulator. A detailed noise analysis of electromechanical sigma-delta capacitive accelerometers with a final goal of achieving sub-/spl mu/g resolution is also presented. The analysis and test results have shown that amplifier thermal and sensor charging reference voltage noises are dominant in open-loop mode of operation. For closed-loop mode of operation, mass-residual motion is the dominant noise source at low sampling frequencies. By increasing the sampling frequency, both open-loop and closed-loop overall noise can be reduced significantly. The interface circuit has more than 120 dB dynamic range and can resolve better than 10 aF. The complete module operates from a single 5-V supply and has a measured sensitivity of 960 mV/g with a noise floor of 1.08 /spl mu/g//spl radic/Hz in open-loop. This system can resolve better than 10 /spl mu/g//spl radic/Hz in closed-loop.     

Mechanical characterization and design of flexible silicon microstructures

A variety of different silicon structures has been fabricated and characterized mechanically to optimize the design of silicon ribbon cables used in neural probes and multichip packaging structures. Boron-doped 3-/spl mu/m-thick silicon beams were tested in three modes: bending in plane, twisting (along beam axis), and pushing. Various cable configurations were investigated (straight beams, curved beams, meandered beams, etc.) as well the effects of length, width, cable termination, and the presence of reinforcing spans between multistranded cables. The results along with finite element modeling indicated that many simple modifications could be made to increase the strength and flexibility of silicon ribbon cables. One structure, a meandered beam 200-/spl mu/m wide and 2-mm long could be twisted up to 712/spl deg/. It also was seen that structures having multiple 20-/spl mu/m-wide beams were generally more robust than those with a single 500-/spl mu/m-wide beam. Finally, a method for easy determination of the bending fracture strain is analyzed and verified. It was seen that the silicon structures tested broke after a strain slightly above 2%.