Dielectric Depression and Dispersion in Electrophoretically Fabricated BaTiO3 Ceramic Films

Dielectric depression and dispersion were observed in BaTiO3 ceramic films fabricated by electrophoretic deposition followed by sintering. The dielectric constants were depressed down to 6800–4600 around the Curie point ( T _C ). The dielectric dispersion occurred above T _C . These dielectric properties are attributable to a surface layer formed during sintering. XRD analysis indicated that the surface layer was a hexagonal-like BaTiO₃ phase. A mixed solvent of acetylacetone and alcohol employed in the present work may have been responsible for the formation of the surface layer.     

Shape optimization for a link mechanism

This paper presents a numerical solution for shape optimization problems for link mechanisms, such as a piston-crank mechanism. The dynamic behavior of a link mechanism is described by a differential-algebraic equation (DAE) system consisting of motion equations for each single body and constraints of linkages and rigid motions. In a shape optimization problem, the objective function to maximize is constructed from the external work done by a given external force, which agrees with the kinetic energy of the link mechanism, for an assigned time interval, and the total volume of all the links forms the constraint function. The Fréchet derivatives of these cost functions with respect to the domain variation, which we call the shape derivatives of these cost functions, are evaluated theoretically. A scheme to solve the shape optimization problem is presented using the H ¹ gradient method (the traction method) proposed by the authors as a reshaping algorithm, since it retains the smoothness of the boundary. A numerical example shows that reasonable shapes for each link such that mobility of the link mechanism is improved are obtained by this approach.     

Formation Mechanism and Synthesis of Apatite-Type Structure Ba2+xLa8−x(SiO4)6O2−δ

The formation process of Ba₂La₈(SiO₄)₆O₂ was clarified using thermogravimetry–differential thermal analysis (TG-DTA) and a high-temperature powder X-ray diffraction (HT-XRD) method. Phase changes identified from the HT-XRD data surprisingly corresponded to the weight loss and/or endothermic peaks observed in the TG-DTA curves. Raw material with the composition Ba₂La₈(SiO₄)₆O₂ was completely reacted at 1400°C and produced only an apatite-type compound without a secondary phase. Moreover, the synthesis of Ba_{2+ x} La_{8− x} (SiO₄)₆O_2−δ crystals with x = 0–2 was attempted using a solid-state reaction.     

Observations of high-field domains in GaxIn1 ? xSb Gunn diodes

The properties of high-field domains in GaxIn1-xSb Gunn diodes (0.4 < x < 0.82) have been studied by measuring the surface potential on the diodes. The domain velocities vary with the Ga composition x, 5.3?6.1×106 cm/s for0.8 > x > 0.55 and 10×106 cm/s for x = 0.4, but they are almost independent of the applied voltage, even if the electron concentration is increased by the impact ionisation in the domain at high applied voltages for the small-x samples.     

Studies on solder bump electromigration in Cu/Sn–3Ag–0.5Cu/Cu system

This paper aims to understand the solder bump electromigration phenomenon in the Cu/Sn–3Ag–0.5Cu/Cu system. A temperature of 453 K with a current density of 10 kA/cm² was applied. A void nucleated at the highest current density point at the cathode. As the void grew along the cathode side, a solder depletion occurred on the opposite side of the electron entry point, resulting in an open failure. A unique purposely-designed 3D model simulation methodology provides a good understanding of the void nucleation and growth behavior. The temperature of the solder joint during the electromigration test was measured successfully by the resistance change in the junction line between the two joints.     

Temperature measurement at flip chip solder joint during electromigration test

Measuring the real temperature of a flip chip solder joint during an electromigration test has been a problem because of its small size and the local Joule heating due to a large applied current. A unique method that employs the electrical resistance change in the junction line between two solder joints was introduced to determine the temperature of the solder joint. The change in resistance was converted into temperature using a thermal coefficient of resistance of the junction line. The method accurately measured temperatures of the solder joint within 2 K until the solder joint resistance change ratio reached 100% due to growth of an electromigration void.     

Effect of geometry and dielectric material on thermo-mechanical strain on micro-vias in build-up substrates

Build-up substrates have been preferable solutions for small and high performance systems for more than a few decades. Micro-vias need to be smaller to realize ever higher wiring density in build-up substrates, but there has been concern on the reliability. This paper focuses on Cu filled micro-vias of 25 μm in diameter and investigates the strain on micro-vias using a finite element method for varying geometric parameters and material properties. The strain becomes smaller with shrinking micro-vias, and a prediction equation for the strain is developed as a function of the aspect ratio and material properties for both single and stacked micro-vias.     

开挖扰动区内岩石的压密特性和强度恢复性研究

 利用交替变换荷载速率试验研究压密后岩石试样的强度恢复和荷载速率依存性。首先,分别对田下凝灰岩、来待砂岩、河津凝灰岩和三城目安山岩4种岩石试样在空心圆筒内进行压缩破坏,然后持续轴向加载,压密破坏后的岩石试样。从空心圆筒中推出压密后的试样,进行单轴压缩下的交替变换荷载速率试验,即按一定应变或位移间隔,对同一试样交替施加高低2种不同的荷载速率,得到对应于2种荷载速率的应力–应变曲线。在整个交替变换荷载速率试验过程中,应力随荷载速率的切换而增减。从交替变换荷载速率试验得到的应力–应变曲线上的荷载速率切换点出发,利用3次样条曲线拟合得到2条对应于高低2种荷载速率的应力–应变曲线,并求解强度点处荷载速率依存性参数n。试验结果表明,田下凝灰岩、来待砂岩和河津凝灰岩的强度恢复现象明显,单轴抗压强度随着压密试验中轴向最大荷载的增加而增加,但没有观察到三城目安山岩的强度恢复现象。当压密试验中的最大轴向荷载较大时,压密后的试样的荷载速率依存性与完整试样的基本一致。当压密试验中的最大轴向荷载较小时,从极大和极小2个方面求解荷载速率依存性参数n,得出完整试样的n值介于压密试样的极大值 和极小值 之间,且差值不大。研究结果表明,在进行适当支护之后,随着时间的推移,开挖扰动区内的岩石存在强度恢复的可能性,且今后利用数值模拟考虑开挖扰动区内的岩石强度恢复特性和时间依存性时,在本构方程中可以采用与完整围岩区域一样的参数,从而简化数值模拟程序。     

Preparation of Polymethylmethacrylate-Reinforced Functionally Graded Hydroxyapatite Composites

A functionally graded hybridization approach has been used in the formation of polymer-ceramic composites of polymethylmethacrylate (PMMA) and hydroxyapatite (HAp). HAp was successfully reinforced by sedimentary HAp distributions on a PMMA matrix using a centrifuge to avoid stress convergence on the interface. The stress-strain curves of the functionally graded PMMA-HAp composite showed sufficient mechanical strength with reduced brittleness. Scanning electron micrographs also showed evidence of exposed HAp on the surface of the composites.     

Thermal link for cartridge-type cryostat

We have developed a simple and small thermal link for cooling a cylindrical cartridge, on which device under test is mounted. It consists of a crown-like ring with an inner diameter of 170 or 140 mm and a clamping belt, which is a metal spring or nylon. A thermal conduction of the thermal link is achieved as the crown-like ring clamps the disk-like stage of the cartridge with external force of the clamping belt. This link can be applied at various temperature ranges from 2 to 100 K. The measured thermal conductance of the 170 mm link is 1.7, 5.6 and 3.3 W K⁻¹ for 4, 12, and 80 K stages, respectively. These values are consistent with a empirical calculation within 10% errors. This link is also effective to reduce mechanical vibration to be 6 μm (peak-to-peak) in the horizontal direction of the cartridge. This link is easily fabricated and is useful to various detectors which require to be cooled down.