首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   1293篇
  免费   37篇
  国内免费   1篇
电工技术   48篇
化学工业   328篇
金属工艺   34篇
机械仪表   19篇
建筑科学   34篇
能源动力   52篇
轻工业   58篇
水利工程   5篇
石油天然气   3篇
无线电   149篇
一般工业技术   226篇
冶金工业   246篇
原子能技术   32篇
自动化技术   97篇
  2023年   12篇
  2022年   15篇
  2021年   32篇
  2020年   14篇
  2019年   19篇
  2018年   24篇
  2017年   19篇
  2016年   31篇
  2015年   20篇
  2014年   45篇
  2013年   70篇
  2012年   57篇
  2011年   61篇
  2010年   42篇
  2009年   54篇
  2008年   48篇
  2007年   42篇
  2006年   43篇
  2005年   37篇
  2004年   32篇
  2003年   37篇
  2002年   20篇
  2001年   16篇
  2000年   17篇
  1999年   22篇
  1998年   95篇
  1997年   64篇
  1996年   43篇
  1995年   30篇
  1994年   24篇
  1993年   26篇
  1992年   8篇
  1991年   14篇
  1990年   15篇
  1989年   15篇
  1988年   15篇
  1987年   13篇
  1986年   23篇
  1985年   10篇
  1984年   17篇
  1983年   13篇
  1982年   9篇
  1981年   15篇
  1980年   7篇
  1979年   11篇
  1978年   4篇
  1977年   9篇
  1976年   7篇
  1975年   4篇
  1974年   5篇
排序方式: 共有1331条查询结果,搜索用时 15 毫秒
1.
A novel monitoring method for plasma-charging damage is proposed. This method performs a quick and accurate evaluation using antenna PMOSFET. It was found that not only hot-carrier (HC) lifetime but transistor parameters such as initial gate current and substrate current were changed according to the degree of plasma-charging damage. However, the present work suggests that monitoring the shift of drain current after a few seconds of HC stress is a more accurate method to indicate plasma-charging damage. The monitoring method using the present test structure is demonstrated to be useful for realizing highly reliable devices  相似文献   
2.
3.
Reduction of flash generated in a gas vent is of great concern for manufacturers of electronic parts. The present study proposes a theoretical model for flash generation through consideration of flow characteristics in a gas vent. The model predicts the factors controlling flash, i.e., material parameters such as zero‐shear viscosity, crystallization temperature, thermal conductivity, and heat capacity, and process parameters such as injection and mold wall temperatures, packing pressure, and the clearance of a gas vent. On the other hand, we measure the amount of flash generated in the molding of poly(phenylene sulfide) (PPS) composites containing glass fiber and spherical fillers (CaCO3 or Al2O3). Flash reduces with decreasing size of spherical fillers. These experimental data are successfully interpreted using the flash model. Polym. Eng. Sci., 45:198–206, 2005. © 2005 Society of Plastics Engineers  相似文献   
4.
The purpose of this study is to determine whether left ventricular dysfunction following coronary artery spasm by 123I-BMIPP myocardial imaging. To reveal the clinical efficacy of 123I-BMIPP SPECT, 20 patients with vasospastic angina were studied using resting, 3-hour delayed image with 123I-BMIPP and exercise, 3-hour delayed image with 201Tl SPECT. 123I-BMIPP uptake was decreased compared to 201Tl (discordant) in 12 patients (60%) and in 49/100 myocardial segments (49%). The extent and severity score in resting image with 123I-BMIPP were significantly larger than that in delayed image with 201Tl (p < 0.01). In 123I-BMIPP SPECT, the severity score in the latest ischemia were significantly larger than that in others. The incidence of a complete agreement of decreased 123I-BMIPP uptake and coronary artery spasm was significantly higher (75%) than that in 201Tl (28%, p < 0.01). Furthermore, compared to 201Tl uptake, decreased 123I-BMIPP uptake much more corresponded to reduced wall motion in 9 of patients with mismatching. The severity of regional wall motion abnormality was significantly correlated with severity score of 123I-BMIPP. Late redistribution in delayed image with 123I-BMIPP was seen in 6 patients. The regional washout rate and the severity of regional wall motion abnormality in 6 patients was significantly lower than that in others (p < 0.05). Thus, metabolic abnormality assessed by 123I-BMIPP is well associated with left ventricular asynergy and spastic region in patients with vasospastic angina. In conclusion, 123I-BMIPP SPECT may sensitively delineate the impaired myocardium following coronary artery spasm, and it is very useful in diagnosing and estimating the severity of vasospastic angina.  相似文献   
5.
The temperature dependence of luminescence from a long-lasting phosphor (LLP), SrAl2O4 : Eu2+,Dy3+, exposed to ionizing radiation has been measured to understand the LLP luminescence mechanism. Evaluation of the decay constants of the LLP exposed to -, β- or γ-rays at temperatures from 200 to 390 K showed that the decay constant is divided into four components ranging from 10−4 to 10−1 s−1 with activation energies of 0.02–0.35 eV.

Total luminous intensity from the LLP with changing irradiation temperature has its maximum value around the room temperature. Irradiation at elevated temperature (390 K) has the total luminescence pattern with monotonous decrease as temperature rises. As a result of evaluating the temperature dependence of luminescence, the luminescence mechanism is considered as follows:

 

Author Keywords: Radiation detection; Long-lasting phosphor; Luminescence; Temperature dependence; Fade-out effect  相似文献   

6.
7.
Tsuruoka  Y. Koyama  K. 《Electronics letters》1997,33(16):1370-1371
A fast modular multiplication method based on precomputation is proposed for use in public-key cryptosystems. The proposed method can compute the Montgomery reduction TR1 mod N only through additions. Furthermore, this is 6.4 times faster than the Montgomery method implemented in modular reduction with a 512 bit modulus when 2.1 MB of memory is used. This memory size is also only 1/4 of that required in the method proposed by Takenaka et al  相似文献   
8.
A 1-Gb/s/pin 512-Mb DDRII SDRAM has been developed using a digital delay-locked loop (DLL) and a slew-rate-controlled output buffer. The digital DLL has a frequency divider for DLL input, performs at an operating frequency of up to 500 MHz at 1.6 V, and provides internal clocking with 50% duty-cycle correction. The DLL has a current-mirror-type interpolator, which enables a resolution as high as 14 ps, needs no standby current, and can operate at voltages as low as 0.8 V. The slew-rate impedance-controlled output buffer circuit reduces the output skew from 107 to 10 ps. This SDRAM was tested using a 0.13-/spl mu/m 126.5-mm/sup 2/ 512-Mb chip.  相似文献   
9.
Cardiac arrest occurred in a male Labrador Retriever dog weighing 27.8 kg during induction to anesthesia. Immediately after the failure of resuscitation by the external cardiac compression, thoracotomy was performed and open chest direct current (DC) counter shocks were applied with routine emergency medications. Then the dog recovered consciousness. Although cardiac rhythm just after resuscitation was sinus tachycardia with paroxysmal supraventricular tachycardia, multifocal ventricular arrhythmia occurred 2 hr after resuscitation. This arrhythmia might be the result from reversible cardiac lesions due to DC counter shock.  相似文献   
10.
A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.1 This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm?) and four small vias (1.0 mm?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号