Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

IP网络实施QoS的策略分析

介绍了衡量IP QoS的技术指标和业务等级的划分，提出了IP网络中QoS的实施建议。     

燕皮传统加工工艺中碱液对肉糜特性的影响

燕皮是以猪肉和甘薯粉为原料,手工制成的薄如纸且经煮不烂的传统食品。在传统制作燕皮过程中添加山榉灰配制的碱液是影响肉糜品质的关键步骤。通过测定制作燕皮过程中各工序样品的氮溶解指数、持水性、乳化稳定性、pH值和粘度,利用SDS-PAGE分析样品中的蛋白质组分、利用光学显微镜观察它们的结构变化,证实植物碱液能够提高样品的氮溶解指数、持水性和乳化稳定性并且延迟了肉糜硬化。同时实验证明碳酸碱(Na2CO3或K2CO3)可替代传统工艺中的植物碱,为后续标准化、工业化生产提供可行条件。     

利用中石油域用户认证系统实现数据存储备份

系统面向中石油域用户提供了安全、高速的数据传输服务.实现了数据传输DES加密、用户登录LDAP限制、系统安全审计、空间容量扩容等功能.充分利用SAN网络光存储设备,同时也为油田网络存储应用的开发提供了成功经验.     

Numerical Study of Finite Element Method Based Solutions for Propagation of Wetting Fronts in Unsaturated Soil

The accurate prediction of the propagation of a wetting front in an unsaturated soil subjected to surficial infiltration is of practical importance to many geotechnical and geoenvironmental problems. The finite element method is the most common solution technique as the hydraulic soil properties are highly nonlinear. Two important issues are often found to create difficulties in such analyses. First, numerical oscillations are usually observed in the calculated pore pressures at the wetting front. Second, when a reasonable mesh size and time step are used, the elevation of the wetting front may be seriously overpredicted. This paper is focused on the second issue. The under-relaxation (UR) technique used in the iterative process within each time step is found to have a serious impact on rate of convergence with refinement in mesh size and time step. Two different techniques are typically used; the first evaluates the hydraulic conductivity using an average of heads calculated from the preceding time node and the most recent iteration of the current time node (UR1), and the second evaluates the hydraulic conductivity using the average of heads calculated from the two most recent iterations of the current time nodes (UR2). The study shows that UR1, which is adopted in programs such as SEEP/W, ensures that the solution converges rapidly to a stable solution within a time step, but may converge to the wrong wetting front at a given elapsed time unless a sufficiently refined mesh is used. UR2 converges much more slowly within a time step, but the error in the wetting front is smaller than that generated by UR1.     

NSA-500-1型氩弧焊机VD9不同接法对引弧和稳弧的影响

从一起NSA－500－1型氩弧焊机故障，分析其高压脉冲旁路二极管VD9不同接法对引弧、稳弧及设备安全的影响。     

邻—(4—乙基苯甲酰基)苯甲酸的研究

本文阐述了通过Friedel-Crafts反应合成邻-(4-乙基苯甲酰基)苯甲酸的方法.研究了影响产物质量的因素,提出了适宜的工艺条件.     

Low temperature wafer direct bonding

A pronounced increase of interface energy of room temperature bonded hydrophilic Si/Si, Si/SiO₂, and SiO₂/SiO ₂ wafers after storage in air at room temperature, 150°C for 10-400 h has been observed. The increased number of OH groups due to a reaction between water and the strained oxide and/or silicon at the interface at temperatures below 110°C and the formation of stronger siloxane bonds above 110°C appear to be the main mechanisms responsible for the increase in the interface energy. After prolonged storage, interface bubbles are detectable by an infrared camera at the Si/Si bonding seam. Desorbed hydrocarbons as well as hydrogen generated by a reaction of water with silicon appear to be the major contents in the bubbles. Design guidelines for low temperature wafer direct bonding technology are proposed     

聚氧乙烯油酸酯的合成与物性

论述了合成聚氧乙烯油酸酯的较佳反应条件,探讨了不同EO加成数的聚氧乙烯油酸脂的表面物性规律。