The influence of volume fraction of amorphous phase on corrosion resistance of Mg67Zn 29Ca 4 alloy

The aim of this study was to investigate the structure and corrosion resistance of amorphous, amorphous‐crystalline, and crystalline Mg₆₇Zn₂₉Ca₄ alloy for biodegradable applications. This paper presents a preparation method and results of the structural characterization and corrosion resistance analysis of the material. Samples were prepared in the form of 3 mm diameter rods. The structure of the alloy was examined with the use of X‐ray diffractometry and scanning electron microscopy. The thermal properties of the samples were examined with differential scanning calorimetry (DSC). Results of DSC analysis were used to determine heat treatment temperatures, allowing to obtain different fractures of crystalline phase in the material. Corrosion resistance of heat‐treated samples was investigated by immersion tests and electrochemical measurements performed in the simulated body fluid. The X‐ray diffraction results confirmed that the prepared Mg₆₇Zn₂₉Ca₄ alloy's structure is fully amorphous. After heat treatment, samples with different fractions of amorphous phase in the structure were obtained. Immersion tests of the samples showed that the structure significantly influenced corrosion resistance in examined materials. It should be pointed out, that certain amounts of crystalline phase in amorphous matrix can greatly improve the corrosion resistance of Mg₆₇Zn₂₉Ca₄ alloy.     

Non-contact methods of measuring moisture concentration in external layers of building partitions: III—Water vapour condensation on the cementitious surfaces

This paper presents the results of the larger study into a potential application of laser radiation for the detection of phase transition processes in low temperatures occurring on the surface layers of cementitious materials. An attempt was made to identify relationships between the environmental conditions—temperature and air humidity, and the selected parameters of the reflected light. Onset of the condensation process and formation of water microdrops on the surface of the material leads to the phase displacement of individual laser rays, which are represented by different speckle images.

Although the analysis of parameters of the reflected light are very difficult in the case of porous materials because of highly developed roughness of the surface structure it has been proved that a dynamic study of the phase transition phenomena can be successfully carried out without mechanical intervention.     

Non-contact methods of measuring moisture concentration in external layers of building partitions II—Monitoring of the water vapour condensation on porous surfaces

This paper present the results of the investigation into a potential application of laser radiation for the detection of phase transition processes occurring on the surface layers of porous materials. An attempt was made to discuss in the approximation equations, the relationships between coefficients of the reflected light, the temperature and humidity of the surrounding environment. Laser light reflected from the porous surface carries information about the roughness of the structure. The presence of water microdrop on the surface of the porous material, as a result of condensation and thus a phase transition, leads to the phase displacement of individual rays, which is represented by different images. Therefore, a comprehensive analysis of the reflected light parameters allows a dynamic study of the phase transition phenomena without mechanical intervention.     

Thick film NO2 Sensor

 Thick film technology was used to manufacture a solid-state electrochemical nitrogen dioxide sensor. The prepared sensor has a linear dependence of electromotive force that is based in the NO₂ concentration level. This paper presents discussion on a thick-film sensor that has a much smaller dimension and shorter response time as compared to typical ceramic solid-state electrochemical devices. Received: 26 February 1996/Accepted: 27 June 1996     

Microstructure and Mechanical Properties of the Ductile Al–Ti–Mo–Nb–V Refractory High Entropy Alloys

Metallurgical and Materials Transactions A - A number of non-equimolar refractory high entropy alloys (RF HEAs) from the Al–Ti–Mo–Nb–V system are synthesized, with the...     

Psychosocial aspects of children and families treated with hemodialysis

Introduction: The aim of this study was to analyze the selected psychosocial aspects of chronic kidney disease in children treated with hemodialysis (HD). Methods: The study included 25 children treated with HD aged 2 to 18 years and their parents. Data concerning the illness and socio‐demographic parameters was collected. We used the Paediatric Quality of Life Inventory (PedsQL) for patients and for their parents the PedsQL‐proxy version, General Health Questionnaire (GHQ‐12), Berlin Social Support Scales (BSSS), and the Caregivers Burden Scale (CBS) to evaluate health‐related quality of life (QoL) of HD children and their primary caregivers. Findings: In the PedsQL test, the QoL of HD children was lower than in healthy children. Children treated with HD assessed their QoL on the PedsQL questionnaire higher than the primary caregivers, on all subscales as well as an overall health‐related QoL. Scoring below 2 on the GHQ‐12 test was reported in 56% of mothers, which may indicate that psychological symptoms have intensified. There was no correlation between BSSS, CBS, and GHQ‐12. Discussion: The assessment of QoL in pediatric patients would allow for the earliest possible identification of their nonsomatic problems and irregularities. This could, consequently, contribute to improving QoL in both children with chronic kidney disease and their families.     

TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads

The current paper focuses on several mechanical aspects of a waferlevel packaging approach using a direct face-to-face Chip-to-Wafer (C2W) bonding of a MEMS device on an ASIC substrate wafer. Requirements of minimized inherent stress from packaging and good decoupling from forces applied in manufacturing and application are discussed with particular attention to the presence of through-silicon vias (TSV) in the substrate wafer. The paper deals with FEM analysis of temperature excursion, pressure during molding, materials used and handling load influence on mechanical stress within the TSV system and on wafer level, which can be large enough to disintegrate the system.