A Broadband Dual Circularly Polarized Compact Printed Monopole Antenna

Wireless Personal Communications - Now-a-days the most common pretentious disease is the lung cancer, which has become more prevalent in the world that primarily infects the pulmonary nodules of...     

Nutritional components as mitigators of cellular senescence in organismal aging: a comprehensive review

Food Science and Biotechnology - The process of cellular senescence is rapidly emerging as a modulator of organismal aging and disease. Targeting the development and removal of senescent cells is...     

Effect of 100 KeV Ar+ ion beam irradiation on ZnO thin films – Influence of morphology vis-a-vis electrode/electrolyte interface and its impact on photoelectrochemical water splitting

The present study attempts quantitative determination of changes in the morphological surface features viz. fractal dimension, lower and upper cut off length scale through Power Spectral Density analysis prior to and after irradiation of 100 KeV Ar⁺ ion beam at incidence angles of 0°, 40° and 60° on ZnO thin films. All the unirradiated and irradiated samples are subjected to photoelectrochemical characterization and a correlation between photoelectrochemical performance and morphological parameters is established. Sample irradiated at 40° angle at the fluence of 5 × 10¹⁶ ions/cm² is found to possess maximum fractal dimension of 2.72, lower and upper cut off length scale of 3.16 nm and 63.00 nm respectively. This sample exhibits maximum photocurrent density of 3.19 mA/cm² and applied bias photon-to-current efficiency of 1.12% at 1.23 V/RHE. Hydrogen gas collected for duration of 1 h for the same sample was ~4.83 mLcm^?2.     

Effects of DEM Source,Spatial Resolution and Drainage Area Threshold Values on Hydrological Modeling

Water Resources Management - Automated computation of hydrological and morphometric parameters of any watershed are not only depended on Digital Elevation Model (DEM) resolution but also affected...     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Use of radial forces for fault detection in tapping

A model-based method for fault detection in tapping based on torque and radial forces is proposed. The method allows the identification of faults typical of a tapping operation including axial misalignment, tap runout, tooth breakage both singly and together. The validation experiments have been run on aluminum 356 workpieces for different combinations of process faults. Results have shown that the model predictions are in good agreement with the experimental radial force and torque signals under various fault conditions.     

A new approach to study organic solar cell using Lambert W-function

Organic photovoltaic solar cells bear an important potential of development in the search for low-cost modules for the production of domestic electricity. One of the main differences between inorganic and organic solar cells is that photo-excitation in these materials does not automatically lead to the generation of free charge carriers, but to bind electron–hole pairs (exciton) with a binding energy of about 0.4 eV. Till now various numerical methods using approximations have been reported to study different aspects of organic solar cells. For the first time an accurate method using Lambert W-function is presented to study different parameters of organic solar cells.     

Fuzzy Multiobjective and Linear Programming Based Management Models for Optimal Land-Water-Crop System Planning

In this article, linear programming and fuzzy optimization models are developed for planning and management of available land-water-crop system of Mahanadi-Kathajodi delta in eastern India. The models are used to optimize the economic return, production and labour utilization, and to search the related cropping patterns and intensities with specified land, water, fertilizer and labour availability, and water use pattern constraints. Due to extreme backwardness of the study area, it has been decided to keep all the three objectives of the linear programming models at the same priority level to obtain the compromised solution in a fuzzy environment that incorporates the imprecision in fuzzy goals and fuzzy constraints. These non-structural models facilitate the conjunctive use of available surface water and groundwater resources. A comparative evaluation along with the benefit-cost ratios of the existing and proposed farming systems is also presented.     

Implementations of a four-level mechanical architecture for fault-tolerant robots

This paper describes a fault tolerant mechanical architecture with four levels devised and implemented in concert with NASA (Tesar, D. & Sreevijayan, D., Four-level fault tolerance in manipulator design for space operations. In First Int. Symp. Measurement and Control in Robotics (ISMCR '90), Houston, Texas, 20–22 June 1990.) Subsequent work has clarified and revised the architecture. The four levels proceed from fault tolerance at the actuator level, to fault tolerance via in-parallel chains, to fault tolerance using serial kinematic redundancy, and finally to the fault tolerance multiple arm systems provide. This is a subsumptive architecture because each successive layer can incorporate the fault tolerance provided by all layers beneath. For instance a serially-redundant robot can incorporate dual fault-tolerant actuators. Redundant systems provide the fault tolerance, but the guiding principle of this architecture is that functional redundancies actively increase the performance of the system. Redundancies do not simply remain dormant until needed. This paper includes specific examples of hardware and/or software implementation at all four levels.