移动运营商手机游戏业务的战略定位和发展策略探讨

分析了韩国、日本及国内运营商手机游戏业务的发展状况．探讨了手机游戏业务的模式．论述了该业务的战略定位和市场前景。从地区提供给移动通信市场对外部环境、产业链的准备是否充分以及运营商内部的资源和运营状况等三个方面阐明了手机游戏业务发展的关键因素。     

澳大利亚2001～2002年度Internet业务市场回顾

在2001－2002年度中，澳大利亚Internet用户已超过总人口的50％。用户订购业务的类型有较大程度的变化，按月、季度和年度订购Internet业务的用户数量不断增长，免费订房、按小时付费和按容量接入的用户在减少。网上商业交易和政府业务在增加，政府积极实施公共Internet接入项目。澳大利亚各州和地区的ISP及相应的接入点数量逐渐减少，通信基础设施则进一步改善。     

短信服务误区的成因分析及其对策

短信市场巨额收入的刺激，再加上市场监管力度不够，使得一些服务提供商（SP）片在追求收益而忽视消费者需求，导致短信服务走入了一些误区，这已经引起一系列负面效应，要解决此问题，SP应树立服务理念，根据客户的需求来提供服务内容和服务方式；运营商需改进商业模式，应考虑对SP提供的业务内容和配套服务进行规范，用户要维护自身权益，政府则应加强监管能力。     

单电源等离子-MIG焊方法

本文提出了一种使用一个陡降特性的焊接电源同时为两个电弧供电的单电源等离子-MIG 焊方法.试验研究了该方法的电流分配与调节特性、电压关系与电位关系、熔滴过渡与电弧形态等电弧特性.结果表明.该法是一种简单可行且有利于生产应用的新的等离子-MIG 焊方法.     

旋转机械故障可视化方法的研究

将高维的各种故障样本数据经降维和聚类后，在二维的平面上显示出来，使每种类别的故障占据平面的不同区域，从而达到故障可视的目的。据此能很好地对新的样本进行故障识别，还可以对故障的发展趋势进行预测。采用Ko—honen的自组织神经网络方法可以对故障样本数据进行降维和聚类。实例说明了该方法的正确性。     

基于注册表的网络攻击分析及相应解决方案

介绍了Windows注册表的结构以及修改注册表的操作方法，分析了在使用Windows操作系统上网时注册表可能受到的攻击，并提出了相应的解决方案和预防措施，来增强系统的安全性。     

Calibrated,Registered Images of an Extended Urban Area

We describe a dataset of several thousand calibrated, time-stamped, geo-referenced, high dynamic range color images, acquired under uncontrolled, variable illumination conditions in an outdoor region spanning several hundred meters. The image data is grouped into several regions which have little mutual inter-visibility. For each group, the calibration data is globally consistent on average to roughly five centimeters and 0 1°, or about four pixels of epipolar registration. All image, feature and calibration data is available for interactive inspection and downloading at http://city.lcs.mit.edu/data.Calibrated imagery is of fundamental interest in a variety of applications. We have made this data available in the belief that researchers in computer graphics, computer vision, photogrammetry and digital cartography will find it of value as a test set for their own image registration algorithms, as a calibrated image set for applications such as image-based rendering, metric 3D reconstruction, and appearance recovery, and as input for existing GIS applications.     

Investigation and minimization of underfill delamination in flip chip packages

A generalized plane strain condition is assumed for an edge interfacial crack between die passivation and underfill on an organic substrate flip chip package. C4 solder bumps are explicitly modeled. Temperature excursions are treated as loading conditions. The design factors studied include underfill elastic modulus, underfill coefficient of thermal expansion (CTE), fillet height, and die overhang. Varying underfill modulus and CTE produces a different stress field at underfill/die passivation interface, different stress intensity factor (SIF), and phase angle (/spl psi/) even under the same loading condition. The baseline case uses underfill with elastic modulus of 6 GPa, CTE of 36 ppm//spl deg/C and fillet height equal to half die thickness. Four more cases involving underfill material properties are investigated by varying elastic modulus between 3 and 9 GPa, and by varying CTE between 26 and 46 ppm//spl deg/C. The effect of fillet height is also studied by assuming no fillet and full fillet, i.e., fillet height equal to die thickness. Finally, two cases concerning the influence of die overhang, defined as the nominal distance between outermost solder joint and die edge, are investigated. Fracture parameters, including energy release rate (G) and phase angle (/spl psi/), are evaluated as a function of dimensions. Underfill material properties (elastic modulus and CTE), fillet configuration, and die overhang can be optimized to reduce the risk of underfill delamination in flip chip or direct chip attach (DCA) applications.     

移动通信业务套餐设计原则探讨

针对当前移动通信行业业务套餐设计中存在的问题(如缺乏充分市场细分、没有突出品牌概念、停滞于恶性竞争状态、影响企业整体形象)。以广东移动通信市场为例进行了分析，提出了遵循双赢、有效区隔、协调平衡和注重品牌等4个基本原则。     

ANSYS在激光熔覆成形温度场数值模拟中的应用

基于ANSYS的激光熔覆成形温度场数值模拟可以真实再现熔覆工艺全过程,为优化工艺参数和预测成形缺陷提供可靠的理论依据。本文系统总结了ANSYS在熔覆成形温度场数值模拟中的应用;深入分析了有限元模型的建立、网格划分、热源形式及动态实现、熔池对流、材料动态增长描述等关键问题的处理方法;指出了ANSYS在熔覆成形温度场数值模拟领域应用中存在的问题,并在此基础上提出了今后的发展方向。