等离子体过程不稳定性和氢处理对HIT电池界面特性影响的研究

采用等离子体增强化学气相沉积（PECVD）技术制备薄膜硅/晶体硅异质结,通过测量沉积了本征非晶硅（a-Si:H(i)）后晶体硅（c-Si）的少子寿命以及结构为Ag/a-Si:H(p)/a-Si:H(i)/c-Si(n) /Ag 异质结的暗I-V特性,研究了等离子体初期瞬态过程和氢预处理对异质结界面性质的影响。结果表明：使用挡板且当挡板时间（tS）大于100秒时,可以有效地减少等离子体初期瞬态过程对界面性质的负面影响;与热丝化学气相沉积中氢原子处理有利于界面钝化不同,PECVD中的氢等离子体处理,由于氢原子的轰击特性,对钝化可能存在一定的不利影响;最优氢预处理时间为60秒。     

Influence of the initial transient state of plasma and hydrogen pre-treatment on the interface properties of a silicon heterojunction fabricated by PECVD

Amorphous/crystalline silicon heterojunctions(a-Si:H/c-Si SHJ) were prepared by plasma-enhanced chemical vapor deposition(PECVD).The influence of the initial transient state of the plasma and the hydrogen pre-treatment on the interfacial properties of the heteroj unctions was studied.Experimental results indicate that: (1) The instability of plasma in the initial stage will damage the surface of c-Si.Using a shutter to shield the substrate for 100 s from the starting discharge can prevent the influence of the instable plasma process on the Si surface and also the interface between a-Si and c-Si.(2) The effect of hydrogen pre-treatment on interfacial passivation is constrained by the extent of hydrogen plasma bombardment and the optimal time for hydrogen pre-treatment is about 60 s.