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Ng C.Y. Chongcheawchamnan M. Aftanasar M.S. Robertson L.D. Minalgiene J. 《Electronics letters》2001,37(19):1167-1168
The design and measurement of a 10 GHz miniaturised branch-line coupler using thick-film photoimageable materials is presented. This attempts to reduce passive component size by demonstrating thin-film microstrip (TFMS)-based structures with a thick film processing technology. This technique offers a cheaper and faster way to implement compact multilayer circuits compared to thin-film technology. The fabricated hybrid of intrinsic area 1.19×1.07 mm demonstrates excellent performance and the measurements are in good agreement with the simulations 相似文献
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Chongcheawchamnan M. Ng C.Y. Aftanasar M.S. Robertson I.D. Minalgiene J. 《Electronics letters》2001,37(20):1228-1229
The design of a broadband coplanar waveguide (CPW) Marchand balun fabricated using a photoimageable thick-film process is described. A multilayer coupling structure is employed to obtain a tight coupling. The technique is suitable as a low cost means of fabricating balanced mixers and modulators, with the balun requiring no bond-wires or through-substrate vias. The balun operates from 2 to 9 GHz with an excellent performance 相似文献
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Aftanasar M.S. Young P.R. Robertson I.D. Minalgiene J. Lucyszyn S. 《Electronics letters》2001,37(18):1122-1123
A novel dielectric-filled metal-pipe rectangular waveguide has been fabricated using photoimageable thick-film materials. The waveguides incorporate a new transition from CPW-to-TFMS-to-MPRWG. Standard on-wafer measurement techniques, waveguide STD calibration standards, demonstrated low attenuation across the 60 to 90 GHz frequency range 相似文献
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