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排序方式: 共有41条查询结果,搜索用时 15 毫秒
1.
Consider a manufacturing cell of two identical CNC machines and a material handling robot. Identical parts requesting the completion of a number of operations are to be produced in a cyclic scheduling environment through a flow shop type setting. The existing studies in the literature overlook the flexibility of the CNC machines by assuming that both the allocation of the operations to the machines as well as their respective processing times are fixed. Consequently, the provided results may be either suboptimal or valid under unnecessarily limiting assumptions for a flexible manufacturing cell. The allocations of the operations to the two machines and the processing time of an operation on a machine can be changed by altering the machining conditions of that machine such as the speed and the feed rate in a CNC turning machine. Such flexibilities constitute the point of origin of the current study. The allocation of the operations to the machines and the machining conditions of the machines affect the processing times which, in turn, affect the cycle time. On the other hand, the machining conditions also affect the manufacturing cost. This study is the first to consider a bicriteria model which determines the allocation of the operations to the machines, the processing times of the operations on the machines, and the robot move sequence that jointly minimize the cycle time and the total manufacturing cost. We provide algorithms for the two 1-unit cycles and test their efficiency in terms of the solution quality and the computation time by a wide range of experiments on varying design parameters.  相似文献   
2.
Ability to stack separate chips in a single package enables three-dimensional integrated circuits (3D ICs). Heterogeneous 3D ICs provide even better opportunities to reduce the power and increase the performance per unit area. An important issue in designing a heterogeneous 3D IC is reliability. To achieve this, one needs to select the data mapping and processor layout carefully. This paper addresses this problem using an integer linear programming (ILP) approach. Specifically, on a heterogeneous 3D CMP, it explores how applications can be mapped onto 3D ICs to maximize reliability. Preliminary experiments indicate that the proposed technique generates promising results in both reliability and performance.  相似文献   
3.
The effect of austenitization heat treatment on magnetic properties was examined by means of M6ssbauer spectroscopy on an Fe-40wt%Ni-2wt%Mn alloy. The morphology of the alloy was obtained by using scanning electron microscopy (SEM) under different heat treatment conditions. The magnetic behavior of the non heat-treated alloy is ferromagnetic. A mixed magnetic structure including both paramagnetic and ferromagnetic states was obtained at 800℃ after 6 and 12 h heat treatments. In addition, the magnetic structure of the heat-treated alloy at 1150~C for 12 h was ferromagnetic. With the volume fraction changing, the effective hyperfine field of the ferromagnetic austenite phase and isomery shift values were also determined by Mtssbauer spectroscopy.  相似文献   
4.
We present a new method for finding the temperature profile of vertically stacked three-dimensional (3-D) digital integrated circuits (ICs). Using our model, we achieve spatial thermal resolution at the desired circuit level, which can be as small as a single MOSFET. To resolve heating of 3-D ICs, we solve nonisothermal device equations self-consistently with lumped heat flow equations for the entire 3-D IC. Our methodology accounts for operational variations due to technology nodes (hardware: device), chip floor plans (hardware: layout), operating speed (hardware: clock frequency), and running applications (software). To model hardware, we first decide on an appropriate device configuration. We then calculate elements of the lumped thermal network using the 3-D IC layout. To include software, chip floor plan, and duty cycle-related performance variations, we employ a statistical Monte Carlo type algorithm. In this paper, we investigate performance of vertically stacked 3-D ICs, with each layer modeled after a Pentium III. Our calculated results show that layers within the stacked 3-D ICs, especially the ones in the middle, may greatly suffer from thermal heating.  相似文献   
5.
Compact modeling of MOSFETs from a 0.35 μm SOI technology node operating at 4 K is presented. The Verilog-A language is used to modify device equations for BSIM models and more accurately reproduce measured DC behavior, which is not possible with the standard BSIM model set. The model presented exhibits convergent behavior and is shown to be experimentally accurate at 4 K. No design tool currently in place exhibits convergence and/or accuracy over this range. The Verilog-A approach also allows the embedding of nonlinear length, width and bias effects into BSIM calculated curves beyond those that can be achieved by the use of different BSIM parameter sets. Nonlinear dependences are necessary to capture effects particular to 4 K behavior, such as current kinks. The 4 K DC behavior is reproduced well by the compact model and the model seamlessly evolves during simulation of circuits and systems as the simulator encounters SOI MOSFETs with different lengths and widths. The incorporation of various length/width and bias dependent effects into one Verilog-A/BSIM4 library, therefore, produces one model for all sets of devices called up in a given product design kit (PDK) for this technology node.  相似文献   
6.
7.
In today’s markets, non-uniform, customized products complicate the manufacturing processes significantly. In this paper, we propose a cellular manufacturing system design model to manage product variety by integrating with the technology selection decision. The proposed model determines the product families and machine groups while deciding the technology of each cell individually. Hedging against changing market dynamics leads us to the use of flexible machining systems and dedicated manufacturing systems at the same facility. In order to integrate the market characteristics in our model, we proposed a new cost function. Further, we modified a well known similarity measure in order to handle the operational capability of the available technology. In the paper, our hybrid technology approach is presented via a multi-objective mathematical model. A filtered-beam based local search heuristic is proposed to solve the problem efficiently. We compare the proposed approach with a dedicated technology model and showed that the improvement with the proposed hybrid technology approach is greater than 100% in unstable markets requiring high product varieties, regardless of the volumes of the products.  相似文献   
8.
A hierarchical multi-objective heuristic algorithm and pricing mechanism are developed to first determine the cell loading decisions, and then lot sizes for each item and to obtain a sequence of items comprising the group technology families to be processed at each manufacturing cell that minimise the setup, inventory holding, overtime and tardiness costs simultaneously. The linkage between the different levels is achieved using the proposed pricing mechanism through a set of dual variables associated with the resource and inventory balance constraints, and the feasibility status feedback information is passed between the levels to ensure internally consistent decisions. The computational results indicate that the proposed algorithm is very efficient in finding a compromise solution for a set of randomly generated problems compared with a set of competing algorithms.  相似文献   
9.
We propose an integrated algorithm that will solve the part-family and machinecell formation problem by simultaneously considering the within-cell layout problem. To the best of our knowledge, this is the first study that considers the efficiency of both individual cells and the overall system in monetary terms. Each cell should make at least a certain amount of profit to attain self-sufficiency, while we maximize the total profit of the system using a holonistic approach. The proposed algorithm provides two alternative solutions; one with independent cells and the other one with inter-cell movement. Our computational experiments indicate that the results are very encouraging for a set of randomly generated problems.  相似文献   
10.

Two-dimensional (2D) monolayers have opened a new door for further studies in search of multifunctional materials. In addition to the interesting properties that these monolayers exhibit on their own, these properties can be tuned by doping, creating defects or adatom adsorption processes. Recent research has focused on determining in what technological areas these monolayers can be used. Boron carbide (BC) is a new single layer material that has been shown to be stable from the boron-doped graphene family, but its uses, such as its sensing, uptaking and fixation ability of toxic gases, have not been fully determined yet. This study is a step taken in order to fill the gap in this field. Adsorption of CO and NO molecules on the BC monolayer has been investigated by using first principles DFT methods. After structural optimization, the adsorption energies have been computed for the model systems. Electronic properties of stable structures have been determined by introducing the total and partial DOS plots and charge distributions. Our results revealed that BC monolayer successfully adsorbed CO and NO toxic gases. Thus, useful information was provided for possible applications of a base material, such as detection, uptake, and fixation of toxic gases.

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