Displaying a bright future [vacuum microelectronics]

Recent technical and market advances have created a resurgence of interest in miniature vacuum devices based on field-emission vacuum microelectronics. For several operational conditions, these new devices have inherent advantages over their solid-state counterparts. Vacuum microelectronic devices are less sensitive to temperature variations, provide high-speed switching capabilities, and are less susceptible to radiation damage. In addition, electron beams can be steered with external electric and magnetic fields, and electron devices are capable of operation with high current densities. In this article, we describe the development of this new generation of vacuum microelectronic devices and showcase some exciting applications arising from this technology, ranging from flat-panel displays to electron beam devices     

Special Issue on Flexible Electronics Technology, Part II: Materials and Devices

Presents an introduction to a special issue of Proceedings of the IEEE. Flexible electronics is entering an exciting phase in the technology development cycle. After a decade of fundamental materials and device research, we are now witnessing the first major push toward commercialization. Productization requires device architectures and materials processes that are reliable and suitably qualified for high volume manufacturing. While the focus of the July issue of the Proceedings of the IEEE was on electronic systems and applications, the theme of the current issue is on materials and device technology, process development, and manufacturing technology. The fifteen papers in this issue provide a good overview of the status of flexible electronic materials and manufacturing technology.     

FED up with fat tubes

Field emission displays (FED) offer the best and brightest of two display worlds: the bright picture of bulky cathode-ray tube devices and the trim flat-panel picture of liquid-crystal displays. The similarities and differences between FED and CRT are briefly mentioned. The principles of FED operation, and the fabrication of the emitter array and anode, are described     

Big and bendable [flexible plastic-based circuits]

This paper discusses the possibility of cheap and fast fabrication of high-quality, even custom, plastic-based flexible integrated circuits with the aid of the low-cost technologies of inkjet printing. An important advantage of the inkjet print process over conventional techniques is that the jet process puts the circuit material only where it is needed, whereas the conventional process puts the material down over the whole substrate and then etches most of it away. By eliminating the high-temperature, high-vacuum steps used in conventional circuit manufacture, the jet process has the potential to substantially cut the manufacturing cost.     

Macroelectronics: Perspectives on Technology and Applications

Flexible, large area electronics - macroelectronics - using amorphous silicon, low-temperature polysilicon, or various organic and inorganic nanocrystalline semiconductor materials is beginning to show great promise. While much of the activity in macroelectronics has been display-centric, a number of applications where macroelectronics is needed to enable solutions that are otherwise not feasible are beginning to attract technical and/or commercial interest. In this paper, we discuss the application drivers and the technology needs and device performance requirements to enable high performance applications to include RF systems.