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This paper proposes a multithreshold CMOS (MTCMOS) circuit that uses SIMOX process technology. This MTCMOS/SIMOX circuit combines fully depleted low-threshold CMOS logic gates and partially depleted high-threshold power-switch transistors. The low-threshold CMOS gates have a large noise margin for fluctuations in operating temperature in addition to high-speed operation at the low supply voltage of 0.5 V. The high-threshold power-switch transistor in which the body is connected to the gate through the reverse-diode makes it possible to obtain large channel conductance in the active mode without any increase of the leakage current in the sleep mode. The effectiveness of the MTCMOS/SIMOX circuit is confirmed by an evaluation of a gate-chain test element group (TEG) and an experimental 0.5-V, 40-MHz, 16-b ALU, which were designed and fabricated with 0.25-μm MTCMOS/SIMOX technology  相似文献   
2.
We have developed a mobile global positioning system (GPS) that operates on just photovoltaic (PV) cells. The system receives wireless signals from satellites and shows one's present location accurately on a map without the need for a battery. A PV display module, which combines a transparent LCD with a-Si PV cells and has a power generation function, is added to ordinary PV cells to increase the total amount of power generated. The PV display module enables 40% more power generation than a system without the module.  相似文献   
3.
Multithreshold-voltage CMOS (MTCMOS) technology has a great advantage in that it provides high-speed operation with low supply voltages of less than 1 V. A logic gate with low-V/sub th/ MOSFETs has a high operating speed, while a low-leakage power switch with a high-V/sub th/ MOSFET eliminates the off-leakage current during sleep time. By using MTCMOS circuits and silicon-on-insulator (SOI) devices, the authors have developed a 256-kb SRAM for solar-power-operated digital equipment. A double-threshold-voltage MOSFET (DTMOS) is adopted for the power switch to further reduce the off leakage. As regards the SRAM core design, we consider a hybrid configuration consisting of high-V/sub th/ and low-V/sub th/ MOSFETs (that is, multi-V/sub th/ CMOS). A new memory cell with a separate read-data path provides a larger readout current without degrading the static noise margin. A negatively overdriven bitline scheme guarantees sure write operation at ultralow supply voltages close to 0.5 V. In addition, a charge-transfer amplifier integrated with a selector and data latches for intrabus circuitry are installed to enhance the operating speed and/or reduce power dissipation. A 32K-word /spl times/ 8-bit SRAM chip, fabricated with the 0.35-/spl mu/m multi-V/sub th/ CMOS/SOI process, has successfully operated at 25 MHz under typical conditions with 0.5-V (SRAM core) and 1-V (I/O buffers) power supplies. The power dissipation during sleep time is less than 0.4 /spl mu/W and that for 25-MHz operation is 1 mW, excluding that of the I/O buffers.  相似文献   
4.
1-V power supply high-speed low-power digital circuit technology with 0.5-μm multithreshold-voltage CMOS (MTCMOS) is proposed. This technology features both low-threshold voltage and high-threshold voltage MOSFET's in a single LSI. The low-threshold voltage MOSFET's enhance speed performance at a low supply voltage of 1 V or less, while the high-threshold voltage MOSFET's suppress the stand-by leakage current during the sleep period. This technology has brought about logic gate characteristics of a 1.7-ns propagation delay time and 0.3-μW/MHz/gate power dissipation with a standard load. In addition, an MTCMOS standard cell library has been developed so that conventional CAD tools can be used to lay out low-voltage LSI's. To demonstrate MTCMOS's effectiveness, a PLL LSI based on standard cells was designed as a carrying vehicle. 18-MHz operation at 1 V was achieved using a 0.5-μm CMOS process  相似文献   
5.
A high-speed BiCMOS ECL (emitter coupled logic) interface SRAM (static RAM) architecture is described. To obtain high-speed operation for scaled-down devices, such as MOSFETs with a feature size of 0.8 μm or less and with a small MOS level, a new SRAM architecture featuring all-bipolar peripheral circuits and CMOS memory cells with VSS generator has been developed. Two key circuits, a VSS generator and a current switch level converter, are described in detail. These circuits reduce the external supply voltage to the internal MOS level, thus permitting high-speed SRAM operation. To demonstrate the effectiveness of the concept, a 256 kb SRAM with an address access time of 5 ns is described  相似文献   
6.
We have introduced an example of a system that embodies the concept of a ubiquitous communication service and explained the importance of low power consumption in the communicator that will serve as the bridge between the real world and the network for real‐time services in which sensor data is acquired every second. An effective solution to the problem of high energy efficiency is to employ the synergy of combining low‐voltage analog circuit technology and FD‐SOI devices. Taking advantage of that synergy to reduce the power consumption of the communicator during operation to about 10 mW and employing intermittent operation with an activity rate of less than l% would make it possible to support operation for 1 year or more with a commercial coin‐type lithium battery. © 2007 Wiley Periodicals, Inc. Electr Eng Jpn, 162(3): 38–43, 2008; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.20543  相似文献   
7.
BiCMOS circuit technology for a high-speed and large-capacity ECL-compatible static RAM (SRAM) is described. To obtain high-speed and low-power operation, a decoder with a pre-main decode configuration having an ECL-interface circuit and a word driver with BiCMOS inverter are proposed. A BiCMOS multiplexer with a single emitter-follower driver is also proposed. An optimization method for memory cell array configuration is presented that minimizes the total delay time and the total power dissipation of SRAMs. Circuit simulation results show that a 64-kbit ECL-compatible SRAM with an access time of less than 7 ns and a power dissipation of less than 1 W is obtainable  相似文献   
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