Structural dependence of microwave dielectric properties of spinel structured Mg2(Ti1-xSnx)O4 solid solutions: Crystal structure refinement,Raman spectra study and complex chemical bond theory

Mg₂(Ti_1-xSn_x)O₄ (x?=?0–1) ceramics were prepared through conventional solid-state method. This paper focused on the dependence of microwave dielectric properties on crystal structural characteristics via crystal structure refinement, Raman spectra study and complex chemical bond theory. XRD spectrums delineated the phase information of a spinel structure, and structural characteristic of these compositions were achieved with the help of Rietveld refinements. Raman spectrums were used to depict the correlations between vibrational phonon modes and dielectric properties. The variation of permittivity is ascribed to the Mg₂(Ti_1-xSn_x)O₄ average bond covalency. The relationship among the B-site octahedral bond energy, tetrahedral bond energy and temperature coefficient are discussed by defining on the change rate of bond energy and the contribution rate of octahedral bond energy. The quality factor is affected by systematic total lattice energy, and the research of XPS patterns illustrated that oxygen vacancies can be effectively restrained in rich oxygen sintering process. Obviously, the microwave dielectric properties of Mg₂(Ti_1-xSn_x)O₄ compounds were obtained (${\epsilon }_r$= 12.18, $Q\times f$?=?170,130?GHz, ${\tau }_f$?=??53.1?ppm/°C, x?=?0.2).     

管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

SIMPLIS环境中开关电源集成电路控制器模型的开发及应用

介绍现代开关电源行业仿真工作的意义和现状,以及专用仿真软件包SIM etrix/SIMPLIS的优点和不足。通过实例给出SIMPLIS环境中集成电路控制芯片的建模过程,并就其中的关键技术予以简单讨论。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Blind estimation of OFDM carrier frequency offset via oversampling

Blind deterministic estimation of the orthogonal frequency division multiplexing (OFDM) frequency offset via oversampling is proposed in this paper. This method utilizes the intrinsic phase shift of neighboring sample points incurred by the frequency offset that is common among all subcarriers. The proposed method is data efficient - it requires only a single OFDM symbol to achieve reliable estimation, hence making it more suitable to systems with stringent delay requirement and mobility-induced channel variation. The proposed scheme is devised to perfectly retrieve frequency offset in the absence of noise. Quite remarkably, we show that in the presence of channel noise, this intuitive scheme is indeed the maximum likelihood estimate of the carrier frequency offset. The possible presence of virtual carriers are also accommodated in the system model, and some interesting observations are obtained. The Cramer-Rao lower bound is derived for the oversampling-based signal model, and we show through numerical simulation that the proposed algorithm is efficient. Practical issues such as identifiability, the front-end filter bandwidth, and the possible presence of correlated noises are also carefully addressed.     

Mining predecessor–successor rules from DAG data

Data mining extracts implicit, previously unknown, and potentially useful information from databases. Many approaches have been proposed to extract information, and one of the most important ones is finding association rules. Although a large amount of research has been devoted to this subject, none of it finds association rules from directed acyclic graph (DAG) data. Without such a mining method, the hidden knowledge, if any, cannot be discovered from the databases storing DAG data such as family genealogy profiles, product structures, XML documents, task precedence relations, and course structures. In this article, we define a new kind of association rule in DAG databases called the predecessor–successor rule, where a node x is a predecessor of another node y if we can find a path in DAG where x appears before y. The predecessor–successor rules enable us to observe how the characteristics of the predecessors influence the successors. An approach containing four stages is proposed to discover the predecessor–successor rules. © 2006 Wiley Periodicals, Inc. Int J Int Syst 21: 621–637, 2006.     

大型往复式压缩机的配管设计

大型往复式压缩机功率大、占地面积大,管道振动问题也更为突出。笔者结合实践经验,对大型往复式压缩机的配管设计进行探讨,说明了平面布置与管道防振设计的密切关系,并介绍了管道防振设计的方法和步骤,以及相对简单的复杂管系气柱固有频率的转移矩阵计算方法。     

Gamma-irradiation-induced Ag/SiO2 composite films and their optical absorption properties

Small Ag particles or clusters dispersed mesoporous SiO₂ composite films were prepared by a new method: First the matrix SiO₂ films were prepared by sol-gel process combined with the dip-coating technique, then they were soaked in AgNO₃ solutions followed by irradiation of γ-ray at room temperature and in ambient pressure. The structures of these films were examined by X-ray diffraction (XRD), high-resolution transmission electron microscope (HRTEM), and optical absorption spectroscopy. It has been shown that the Ag particles grown within the porous SiO₂ films are very small, and they are isolated and dispersed from each other with very narrow size distributions. With increasing the soaking concentration and an additional annealing, an opposite peakshift effect of the surface plasmon resonance (SPR) was observed in the optical absorption measurements.     

Data-efficient blind OFDM channel estimation using receiver diversity

We investigate non data-aided channel estimation for cyclically prefixed orthogonal frequency division multiplexing (OFDM) systems. By exploiting channel diversity using only two receive antennas, a blind deterministic algorithm is proposed. Identifiability conditions are derived that guarantee the perfect channel retrieval in the absence of noise. In the presence of noise, the proposed method has the desired property of being data efficient-only a single OFDM block is needed to achieve good estimation performance for a wide range of SNR values. The algorithm is also robust to input symbols as it does not have any restriction on the input symbols with regard to their constellation or their statistical properties. In addition, this diversity-based algorithm is computationally efficient, and its performance compares favorably to most existing blind algorithms.     

SrTiO3基压敏电阻的研究及其在武器系统中的应用

电子设备的广泛使用带来的设备干扰及浪涌冲击等问题使人们开始关注SrTiO3基压敏电阻器件材料的开发.本文介绍了SrTiO3基压敏电阻的一般制造配方和工艺流程.和ZnO基压敏电阻相比,此材料在低压领域具有更优良的电气性能,如较大的电容量(C=10～150nF);在高于电压临界值又具有较低压敏电压;非线性系数在5～43之间可调;耐浪涌能量大;并且具有自复位特性.这些特性使得它具有高频噪声吸收、前沿快速上升型脉冲噪声吸收和浪涌吸收等功能.针对武器系统的高性能要求,本文提出了SrTiO3基压敏电阻在直流电机消噪、电源输入端、吸收电感性负载开关浪涌、旁路电容器、通信线路防护、防止电涌冲击等方面的应用.