课程群案例嵌入协同教学模式的探索

在课程群的教学中由于每门课程各自独立开展教学,缺乏知识的融合和衔接,导致学生运用综合知识解决问题的能力较弱。在课程群的教学中采用案例嵌入协同教学模式,将完整的工程案例嵌入到课程群各门课程的教学中,协同规划各门课程的教学任务,每门课程再围绕案例展开研究性教学。通过嵌入的工程案例衔接各门课程的知识点,帮助学生建构完整的知识体系,强化工程应用的概念；同时通过研究性教学,培养学生分析问题和解决问题的能力,两部分相结合,提高了学生运用综合知识解决复杂问题的能力。     

Structural dependence of microwave dielectric properties of spinel structured Mg2(Ti1-xSnx)O4 solid solutions: Crystal structure refinement,Raman spectra study and complex chemical bond theory

Mg₂(Ti_1-xSn_x)O₄ (x?=?0–1) ceramics were prepared through conventional solid-state method. This paper focused on the dependence of microwave dielectric properties on crystal structural characteristics via crystal structure refinement, Raman spectra study and complex chemical bond theory. XRD spectrums delineated the phase information of a spinel structure, and structural characteristic of these compositions were achieved with the help of Rietveld refinements. Raman spectrums were used to depict the correlations between vibrational phonon modes and dielectric properties. The variation of permittivity is ascribed to the Mg₂(Ti_1-xSn_x)O₄ average bond covalency. The relationship among the B-site octahedral bond energy, tetrahedral bond energy and temperature coefficient are discussed by defining on the change rate of bond energy and the contribution rate of octahedral bond energy. The quality factor is affected by systematic total lattice energy, and the research of XPS patterns illustrated that oxygen vacancies can be effectively restrained in rich oxygen sintering process. Obviously, the microwave dielectric properties of Mg₂(Ti_1-xSn_x)O₄ compounds were obtained (${\epsilon }_r$= 12.18, $Q\times f$?=?170,130?GHz, ${\tau }_f$?=??53.1?ppm/°C, x?=?0.2).     

我国上市公司股票评级研究——财务结构模型分析法在股票市场中的应用

目前,我国股票市场上的股票评级尚处于探索阶段,评级时多采用专家法或历史法,而对于影响股票评级的各因素的确定以及因素间的相互作用缺乏定量分析。研究将结构模型应用到我国股票市场的股票评级中,建立关于我国股票评级的财务结构模型;分析各个因素对股票评级的影响;建立股票评级经验模式值。     

针对不同地质目标的叠前时间偏移成像解释评价

随着计算机硬件和地震勘探成像技术的发展，叠前时间偏移正逐步替代常规的NMO加DMO加叠后时间偏移成为地震数据成像处理方法的主流。但对于不同的地质目标，叠前时间偏移的成像效果是否优于常规NMO加DMO加叠后时间偏移的成像效果呢？为此，从地震数据成像处理方法、处理流程和处理参数等方面进行了讨论，并基于某地区三维数据常规处理结果和叠前时间偏移处理结果，针对不同地质目标进行了剖析与评价。认为：叠前时间偏移成像的垂向分辨率较常规处理明显降低，但对于空间波阻抗变化明显的河流和断层，叠前时间偏移成像的空间分辨率要高于常规处理；对于小于1／4波长的叠置薄储层，叠前时间偏移成像的垂向和空间分辨率低于常规处理结果。     

水土资源保护的措施与途径

水土资源是人类赖以生存的基本资源,是国民经济待续发展的基础。我国的水资源和耕地,人均占有量分别不及世界人均占有量的1/4和1/2,而庄河市据2000年卫星遥感普查结果显示,目前有不同侵蚀强度的水土流失面积1640,占全市总面积的40%以上,远大于全国的平均水平。这种严峻的生态环境形势,对庄河市国民经济的发展极为不利。因此,加强水土保持,改善生     

多带抗噪声语音识别算法研究

根据Flether等人的研究,基于感知独立性假设的子带识别方法被用于抗噪声鲁棒语音识别。本文拓展子带方法,采用基于噪声污染假定的多带框架来减少噪声影响。论文不仅从理论上分析了噪声污染假定多带框架在识别性能上的潜在优势,而且提出了多带环境下的鲁棒语音识别算法。研究表明：多带框架不仅回避了独立感知假设要求,而且与子带方法相比,多带方法能更好的减少噪声影响,提高系统识别性能。     

蜕变——中国气象局华风影视大楼

华风气象影视大楼总面积4万平方米，根据空间功能不同分为办公大楼和商务写字楼两部分，办公大楼是集演播室、制作机房、办公室为一体的九层综合性建筑。设计师杨宇在刚接触到这个项目的时候，面对的是一个既成事实的建筑。     

SIMPLIS环境中开关电源集成电路控制器模型的开发及应用

介绍现代开关电源行业仿真工作的意义和现状,以及专用仿真软件包SIM etrix/SIMPLIS的优点和不足。通过实例给出SIMPLIS环境中集成电路控制芯片的建模过程,并就其中的关键技术予以简单讨论。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported