Listening to Brain Microcircuits for Interfacing With External World-Progress in Wireless Implantable Microelectronic Neuroengineering Devices: Experimental systems are described for electrical recording in the brain using multiple microelectrodes and short range implantable or wearable broadcasting units

Acquiring neural signals at high spatial and temporal resolution directly from brain microcircuits and decoding their activity to interpret commands and/or prior planning activity, such as motion of an arm or a leg, is a prime goal of modern neurotechnology. Its practical aims include assistive devices for subjects whose normal neural information pathways are not functioning due to physical damage or disease. On the fundamental side, researchers are striving to decipher the code of multiple neural microcircuits which collectively make up nature's amazing computing machine, the brain. By implanting biocompatible neural sensor probes directly into the brain, in the form of microelectrode arrays, it is now possible to extract information from interacting populations of neural cells with spatial and temporal resolution at the single cell level. With parallel advances in application of statistical and mathematical techniques tools for deciphering the neural code, extracted populations or correlated neurons, significant understanding has been achieved of those brain commands that control, e.g., the motion of an arm in a primate (monkey or a human subject). These developments are accelerating the work on neural prosthetics where brain derived signals may be employed to bypass, e.g., an injured spinal cord. One key element in achieving the goals for practical and versatile neural prostheses is the development of fully implantable wireless microelectronic "brain-interfaces" within the body, a point of special emphasis of this paper.     

An Integrated Patch-Clamp Amplifier in Silicon-on-Sapphire CMOS

We designed and tested an integrated patch-clamp amplifier capable of recording from pico to tens of microamperes of current. The high-dynamic range of seven decades and the picoampere sensitivity of the instrument was targeted to whole-cell patch-clamp recordings. The prototype was fabricated on a 0.5-mum silicon-on-sapphire process. The device employs an integrating headstage with a pulse frequency modulated output, ranging from 3 Hz to 10 MHz. A digital interface produces a 16-bit output conversion of the input currents. We report on electronic characterization of the fabricated device, dynamic performance, and examples of measurements on biological cells for patch-clamp applications. The device will be used in an advanced planar high-throughput patch-clamp screening system for testing medicines     

Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)

A hermetic sealing method of sub‐millimeter‐sized microelectronic chiplets for wireless body implants is presented by ultrathin and electromagnetically transparent atomic layer deposition (ALD) coatings. Fully 3D conformal encapsulation of wirelessly powered microdevices is demonstrated both with and without opening windows for electrophysiological measurements. The chiplets embedding custom application‐specific integrated circuits (ASICs) with radio frequency (RF) transmitters are encapsulated by a stack of alternating layers of hafnium oxide and silicon dioxide to maximize impermeability of water and ionic penetration while minimizing the volume of the packaging material. The hermeticity of the devices is characterized through accelerated aging tests in saline at T = 87 °C, while continued functionality is monitored via evaluation of backscattered RF signals (near 1 GHz) to ascertain possible degradation and electronic failure. Earliest failures of wirelessly functional devices occur after more than 180 d of immersion at 87 °C. Wireless devices having opening windows through the ALD envelope show no signs of degradation for >100 d. This implies an equivalent lifetime >10 years at T = 37 °C. This approach is readily scalable to high throughput batch processing of hundreds of microchiplets, offering a methodology for hermetic packaging of microscale biomedical chronic implants.