Processing and characterization of a-Si:H photoresists for a vacuum-compatible photolithography process

The vision of achieving a completely in-vacuum process for fabricating HgCdTe detector arrays is contingent on the availability of a vacuumcompatible photolithography technology. One such technology for vacuum photolithography involves the use of amorphous-hydrogenated Si (a-Si:H) as a photoresist. In this work, we deposit a-Si:H resists via plasma-enhanced chemical-vapor deposition (PECVD) using an Ar-diluted silane precursor. The resists are then patterned via excimer laser exposure and development etched in a hydrogen plasma where etch selectivities between unexposed and exposed regions exceed 600:1. To determine the best conditions for the technique, we investigate the effects of different exposure environments and carry out an analysis of the a-Si:H surfaces before and after development etching. Analysis via transmission electron microscopy (TEM) reveals that the excimer-exposed surfaces are polycrystalline in nature, indicating that the mechanism for pattern generation in this study is based on melting and crystallization. To demonstrate pattern transfer, underlying CdTe films were etched (after development of the resist) in an electron cyclotron resonance (ECR) plasma, where etch selectivities of approximately 8:1 have been achieved. The significance of this work is the demonstration of laser-induced poly-Si as an etching mask for vacuum-compatible photolithography.     

Effects of a-Si:H resist vacuum-lithography processing on HgCdTe

A vacuum-compatible process for carrying out lithography on Hg_1−xCd_xTe and CdTe films was previously demonstrated. It was shown that hydrogenated amorphous silicon (a-Si:H) could be used as a dry resist by projecting a pattern onto its surface using excimer laser irradiation and then developing that pattern by hydrogen plasma etching. Pattern transfer to an underlying Hg_1−xCd_xTe film was then carried out via Ar/H₂ plasma etching in an electron cyclotron resonance (ECR) reactor. Despite the successful demonstration of pattern transfer, the possibility of inducing harmful effects in the Hg_1−xCd_xTe film due to this vacuum lithography procedure had not been explored. Here we present structural and surface compositional analyses of Hg_1−xCd_xTe films at key stages of the a-Si:H vacuum lithography procedure. X-ray diffraction double crystal rocking curves taken before and after a-Si:H deposition and after development etching were identical, indicating that bulk structural changes in the Hg_1−xCd_xTe film are not induced by these processes. Cross-section transmission electron microscopy studies show that laser-induced heating in the 350 nm thick a-Si:H overlayer is not sufficient to cause structural damage in the underlying Hg_1−xCd_xTe surface. In vacuo surface analysis via Auger electron spectroscopy and ion scattering spectroscopy suggest that the hydrogen plasma development process produces Hg-deficient surfaces but does not introduce C contamination. However, after ECR plasma etching into the Hg_1−xCd_xTe film, the measured x value is much closer to that of the bulk.     

Observation of [100] and [010] dark line defects in optically degraded znsse-based leds by transmission electron microscopy

We have used transmission electron microscopy to study the [100] and [010] dark line defects (DLDs) produced after photodegradation of a ZnSSe-based/GaAs heterostructure. Our results show that the DLDs are networks of elongated dislocation loops or half-loops that originate in the quantum well region during device operation. Our results also show that after photodegradation the grownin or pre-existing Frank-type stacking faults become tangles of dislocations. In contrast, the Shockley-type stacking faults remained unchanged for the photodegradation conditions studied indicating that they are more resistant to photodegradation than the Frank-type stacking faults. Our results suggest that the Frank-type stacking faults are the sources of the DLDs. The mechanism for degradation probably starts by the emission of very small clusters of vacancies from the Frank-type faults. Upon further illumination the dislocation loops bounding the vacancies grow by gliding on {111} planes and become hairpin-like dislocation loops.     

SiC/Si(111) film quality as a function of GeH4 flow in an MOCVD reactor

Due to large lattice and thermal expansion coefficient mismatches, SiC films grown on Si are usually low quality. To provide a more stable growth front we added Ge in the form of GeH₄ to the reactant gases in a MOCVD reactor. Several SiC films with Ge flow rates ranging from 0–50 sccm were grown on (111) Si substrates at 1000°C. TEM results show that the crystalline quality is amorphous or polycrystalline for Ge flow rates at or below 15 sccm. Samples grown at Ge flow rates at or exceeding 20 sccm have an initial layer of single crystalline 3C SiC followed by heavily twinned crystalline 3C SiC. In particular, the samples grown with 20–30 sccm Ge contain an 80 nm initial layer of reasonably high quality single crystal 3C SiC.     

On the origin of high-temperature ferromagnetism in the low-temperature-processed Mn-Zn-O system

The recent discovery of ferromagnetism above room temperature in low-temperature-processed MnO(2)-ZnO has generated significant interest. Using suitably designed bulk and thin-film studies, we demonstrate that the ferromagnetism in this system originates in a metastable phase rather than by carrier-induced interaction between separated Mn atoms in ZnO. The ferromagnetism persists up to approximately 980 K, and further heating transforms the metastable phase and kills the ferromagnetism. By studying the interface diffusion and reaction between thin-film bilayers of Mn and Zn oxides, we show that a uniform solution of Mn in ZnO does not form under low-temperature processing. Instead, a metastable ferromagnetic phase develops by Zn diffusion into the Mn oxide. Direct low-temperature film growth of Zn-incorporated Mn oxide by pulsed laser deposition shows ferromagnetism at low Zn concentration for an optimum oxygen growth pressure. Our results strongly suggest that the observed ferromagnetic phase is oxygen-vacancy-stabilized Mn(2-x)Zn(x)O(3-delta.).     

Properties of GaN epitaxial layers grown on 6H-SiC(0001) by plasma-assisted molecular beam epitaxy

The structural, electrical, and optical properties of GaN grown on 6H-SiC(0001) substrates by molecular beam epitaxy are studied. Suitable substrate preparation and growth conditions are found to greatly improve the structural quality of the films. Threading dislocation densities of about 3×10⁹ cm⁻² for edge dislocations and <1×10⁶ cm⁻² for screw dislocations are achieved in GaN films of 0.8 μm thickness. Mechanisms of dislocation generation and annihilation are discussed. Increasing the Ga to N flux ratio used during growth is found to improve the surface morphology. An unintentional electron concentration in the films of about 5×10¹⁷ cm⁻³ is observed, and is attributed to excess Si in the films due to a Si-cleaning step used in the substrate preparation. Results from optical characterization are correlated with the structural and electronic studies.     

Dislocation nucleation mechanism and doping effect in p-type ZnSe/GaAs

Nitrogen doped ZnSe/GaAs heterostructures grown at 150 and 250°C were studied by transmission électron microscopy (TEM). The density of threading dislocations and the interfacial dislocation structure in ZnSe/GaAs heterostructures are related to the N-doping concentration. In addition, in-situ TEM heating studies show that Frank partial dislocations formed below critical thickness in N-doped ZnSe/GaAs are the sources for nucleation of a regular array of misfit dislocations at the ZnSe/GaAs interface. By the dissociation of the Frank partial dislocations and interaction reactions between the dislocations, the 60° misfit dislocations form. The Frank partial dislocations bound stacking faults which usually form in pairs at the film/substrate interface. The density of stacking faults increases with increasing N-doping concentration. Thus, at high N-doping levels, the dislocation nucleation sources are close together and not all of the Frank partial dislocations dissociate, so that a high density of threading dislocations results in samples with high N-doping concentrations. The high density of threading dislocations in the ZnSe film are found to be associated with a reduction or saturation of the net carrier density.     

Role of a nucleation layer in suppressing interfacial pitting in

In this work, we investigate the role of a low temperature nucleation layer on the interfacial properties of InAs epilayers grown on (100) semi-insulating InP substrates using a two-step metalorganic chemical vapor deposition method. Cross-sectional and plan-view transmission electron microscopy studies were carried out on InAs films of nearly equal total film thicknesses but for different thicknesses of a nucleation layer of InAs deposited at low temperature on the substrate. Our studies show that thermal etchpits are created at the interface between the InAs film, and the InP substrate for thin nucleation layer thicknesses. This is because the low temperature nucleation layer of InAs does not cover completely the surface of the InP substrate. Hence, when the temperature is raised to deposit the bulk of the InAs film, severe thermal pitting is observed at the interface. These thermal etchpits are sources of threading dislocations. To obtain high quality InAs films and suppress interfacial pitting there is an optimum thickness of the nucleation layer. Also, our studies show that there is a relationship between the density of defects in the film and the thickness of the nucleation layer. This in turn relates to the variation of the electronic properties of the InAs films. We have observed that for all nucleation layer thicknesses, the density of threading dislocations is higher close to the interface than at the free surface of the film.