Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High-Temperature Applications

There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 °C. Such devices require stable thermal properties, low thermal drift, and thermal cycling resistance. Conventional hybrid circuit technology demonstrates high-temperature packages, but the high costs and lead time are significant drawbacks. In contrast, additive manufacturing processes, including aerosol jet printing (AJP), offer cost and time benefits, as well as 3D structures and embedded features. However, the properties and reliability of additive packaging materials at extreme temperatures are not well known. Herein, the reliability at temperatures up to 750 °C in terms of electrical performance and mechanical strength of aerosol jet printed gold thick films onto ceramic substrates are assessed. Thermal coefficient of resistance of printed gold films is measured. The electrical resistance stability and leakage current of printed gold structures are also characterized during over 100 h of aging at temperatures up to 750 °C. Finally, the mechanical adhesion strength of the printed gold films is evaluated after aging for 100 h at temperatures up to 750 °C. The adhesion of the printed gold to the ceramic substrates remains high after aging, very stable resistances and minimal leakage currents have been observed.     

On forecasting large and infrequent snow avalanches

Snow avalanches that threaten a highway or a residential area are often large avalanches that have a return period > 1 year. Danger assessment strongly relies on precipitation data since these avalanches are typically triggered by major snow storms. Given the extensive protection work that is in place in the European Alps, the avalanche control service (also called avalanche commission) responsible for danger assessment will usually monitor the avalanche situation throughout the winter, but only become active in case of a major snow fall. Related safety concepts describing the procedures and measures to be taken in a given danger situation are therefore often based on threshold values for new snow. By analysing the avalanche occurrence of a major avalanche path, we show that forecasting based on new snow amounts involves high uncertainty. Whereas the return period of an avalanche to, for example, the road was about 5 years, the return period for the corresponding new snow depth was substantially smaller, in our case slightly less than 2 years. Similar proportions were found for a number of other avalanche paths with different snow climate. The return period of the critical new snow depth was about 2–5 times smaller than the return period of the avalanche. This proportion is expected to increase with increasing return period. Hence, based on the return period of an avalanche path a first estimate for the critical new snow depth can be made. With a return period of the critical new snow depth of 1–2 years, avalanche prediction for individual avalanche path becomes very challenging since the false alarm ratio is expected to be high.     

Reading the footprints of strained islands

We report on recent advances in the understanding of surface processes occurring during growth and post-growth annealing of strained islands which may find application as self-assembled quantum dots. We investigate the model system SiGe/Si(0 0 1) by a new approach based on “reading the footprints” which islands leave on the substrate during their growth and evolution. Such footprints consist of trenches carved in the Si substrate. We distinguish between surface footprints and footprints buried below the islands. The former allow us to discriminate islands which are in the process of growing from those which are shrinking. Islands with steep morphologies grow at the expense of smaller and shallower islands, consistent with the kinetics of anomalous coarsening. While shrinking, islands change their shape according to thermodynamic predictions. Buried footprints are investigated by removing the SiGe epilayer by means of selective wet chemical etching. Their reading shows that: (i) during post-growth annealing islands move laterally because of surface-mediated Si–Ge intermixing; (ii) a tree-ring structure of trenches is created by dislocated islands during their “cyclic” growth. This allows us to distinguish coherent from dislocated islands and to establish whether the latter are the result of island coalescence.     

Enhancing adhesion by ion beam-induced atomic mixing at the interface between copper film and polyimide substrate

Ion beam mixing was used to improve the adhesion between deposited Cu film (400 Å) and polyimide (PI) substrate. Ar⁺ ion with the energy levels between 180 and 200 keV, and the dose between 10¹⁴ to 4 × 10¹⁶ ions/cm² were used. The surface analyses were carried out by Rutherford Backscattering Spectroscopy (SEM). RBS analysis, using 2 MeV He⁺ ions, showed mixing of Cu and FI and the mixing depended on the Ar⁺ energy and dose. The X-ray study showed a very broad halo for deposited Cu film but the (111) peak appeared after the Ar⁺ implantation and the peak increased with Ar⁺ ion dose. Optical micrographs showed that Cu film formed circular bubbles after many thermal cycles when adhesion was poor and fracture cracks when adhesion was good.