Highly rectifying Au-contacts on diamond-on-silicon substrate

Au Schottky diodes have been fabricated on highly oriented diamond (HOD) films, grown on silicon using AC-bias nucleation and microwave plasma chemical vapor deposition. The active layers were selectively grown and doped by solid boron source. High rectification ratios were obtained up to 500°C in a bias voltage range up to ±15 V. A current density of more than 1 A/cm² and a breakdown field strength up to 2.0·10⁶ V/cm for point contacts has been demonstrated     

THE INFLUENCE OF ISLAND-INDUCED STRAIN ON THE Si SURFACE MORPHOLOGY IN Ge-Si MULTILAYERS： A TRANSMISSION ELECTRON MICROSCOPY STUDY

1.IntroductionA n active field ofresearch concernsthe fabrication and investigation ofquantum dotand quantumw ire structuresw hich could becom e the basisforfuture nanoelectronics.W ith deposition by low-pres-sure chem icalvapourdeposition(LPCV D)techniqu…     

High current p/p+-diamond Schottky diode

Epitaxial p-type Schottky diodes have been fabricated on p⁺ -substrate. While the activation energy of the epitaxial layer conductivity is 390 meV, that of the substrate is only 50 meV. At forward bias the substrate conductivity dominates above 150°C, leading for a 5×10^-5 cm² area contact to a series resistance of 14 Ω at 150°C reducing to 8 Ω at 500°C. To our knowledge, this is the lowest series resistance reported so far for a diamond Schottky diode enabling extremely high current densities of 10³ A/cm and a current rectification ratio at ±2 V of 10⁵ making these diodes already attractive as high temperature rectifiers     

Metalorganic Vapor-Phase Epitaxy Growth Parameters for Two-Dimensional MoS<Subscript>2</Subscript>

The influence of the main growth parameters on the growth mechanism and film formation processes during metalorganic vapor-phase epitaxy (MOVPE) of two-dimensional MoS₂ on sapphire (0001) have been investigated. Deposition was performed using molybdenum hexacarbonyl and di-tert-butyl sulfide as metalorganic precursors in a horizontal hot-wall MOVPE reactor from AIXTRON. The structural properties of the MoS₂ films were analyzed by atomic force microscopy, scanning electron microscopy, and Raman spectroscopy. It was found that a substrate prebake step prior to growth reduced the nucleation density of the polycrystalline film. Simultaneously, the size of the MoS₂ domains increased and the formation of parasitic carbonaceous film was suppressed. Additionally, the influence of growth parameters such as reactor pressure and surface temperature is discussed. An upper limit for these parameters was found, beyond which strong parasitic deposition or incorporation of carbon into MoS₂ took place. This carbon contamination became significant at reactor pressure above 100 hPa and temperature above 900°C.     

Polarization-Engineered Enhancement-Mode High-Electron-Mobility Transistors Using Quaternary AlInGaN Barrier Layers

Group III nitride heterostructures with low polarization difference recently moved into the focus of research for realization of enhancement-mode (e-mode) transistors. Quaternary AlInGaN layers as barriers in GaN-based high-electron-mobility transistors (HEMTs) offer the possibility to perform polarization engineering, which allows control of the threshold voltage over a wide range from negative to positive values by changing the composition and strain state of the barrier. Tensile-strained AlInGaN layers with high Al contents generate high two-dimensional electron gas (2DEG) densities, due to the large spontaneous polarization and the contributing piezoelectric polarization. To lower the 2DEG density for e-mode HEMT operation, the polarization difference between the barrier and the GaN buffer has to be reduced. Here, two different concepts are discussed. The first is to generate compressive strain with layers having high In contents in order to induce a positive piezoelectric polarization compensating the large negative spontaneous polarization. Another novel approach is a lattice-matched Ga-rich AlInGaN/GaN heterostructure with low spontaneous polarization and improved crystal quality as strain-related effects are eliminated. Both concepts for e-mode HEMTs are presented and compared in terms of electrical performance and structural properties.     

Devices at High Temperatures—Status and Prospects

The temperature-handling capability of diamond diode and field effect transistor structures is discussed and compared with recent results on GaN. The main parameters limiting the high-temperature performance are identified and evaluated. A diamond high-temperature technology is presented which has allowed 1000°C operation of a diamond Schottky diode, the highest temperature of operation of any semiconductor diode yet.     

Very high temperature operation of diamond Schottky diode

For the first time, the operating temperature of a Schottky diode structure has been pushed to 1000°C. The diode structure consists of a Si-based Schottky material deposited onto a homoepitaxial boron doped diamond surface. At high temperatures, the forward I-V characteristics are dominated by the thermionic emission (n≈1.01) across a barrier of 1.9 eV height. The reverse characteristics are still dominated by thermally activated defects. The series resistance shows thermal activation associated with the boron doping     

High-temperature, high-voltage operation of pulse-doped diamondMESFET

The fabrication and operation of a pulse-doped diamond metal-semiconductor field-effect transistor (MESFET) is presented showing a usable source drain voltage of 70 V and no breakdown up to 100 V at 350°C operating temperature. A channel sheet concentration of 8.5×10¹² cm^-2 could be fully modulated leading to a maximum transconductance of 0.22 mS/mm, although full activation of the boron acceptor had not been reached. For an optimized device structure, with reduced gate length below 0.25 μm and full activation, more than 10 W/mm RF-power density can be predicted     

Current instabilities in GaN-based devices

Current dispersion effects have been experimentally investigated in a variety of AlGaN/GaN heterostructure FETs with large signal and switching measurements including HEMTs with doped and undoped barrier layer. A range of dispersion frequencies from 10^-3 Hz to 10 GHz were observed, where the output current amplitude is drastically reduced. Through this effect the full channel charge of an AlGaN/GaN heterostructure FET may be completely depleted under specific bias conditions. This indicates that this phenomena cannot be related to deep traps alone, but is also connected to piezorelated charge states and conduction to these states     

12 W/mm AlGaN-GaN HFETs on silicon substrates

Al/sub 0.26/Ga/sub 0.74/N-GaN heterojunction field-effect transistors were grown by metal-organic chemical vapor deposition on high-resistivity 100-mm Si (111) substrates. Van der Pauw sheet resistance of the two-dimensional electron gas was 300 /spl Omega//square with a standard deviation of 10 /spl Omega//square. Maximum drain current density of /spl sim/1 A/mm was achieved with a three-terminal breakdown voltage of /spl sim/200 V. The cutoff frequency and maximum frequency of oscillation were 18 and 31 GHz, respectively, for 0.7-/spl mu/m gate-length devices. When biased at 50 V, a 2.14-GHz continuous wave power density of 12 W/mm was achieved with associated large-signal gain of 15.3 dB and a power-added efficiency of 52.7%. This is the highest power density ever reported from a GaN-based device grown on a silicon substrate, and is competitive with the best results obtained from conventional device designs on any substrate.