运动饮料配方设计概论

运动中，人体生理发生一系列的变化，包括水分损失、血糖／糖原消耗、电解质损失等，导致运动中／后的疲劳和运动能力下降。以运动中人体生理特点为基础，通过讨论运动前／中／后补充水、碳水化合物及电解质的问题，论证了运动饮料配方设计的原理依据。     

Microstrip stepped impedance resonator bandpass filter with an extended optimal rejection bandwidth

Bandpass filters with an optimal rejection bandwidth are designed using parallel-coupled stepped impedance resonators (SIRs). The fundamental (f/sub o/) and higher order resonant harmonics of an SIR are analyzed against the length ratio of the high-Z and low-Z segments. It is found that an optimal length ratio can be obtained for each high-Z to low-Z impedance ratio to maximize the upper rejection bandwidth. A tapped-line input/output structure is exploited to create two extra transmission zeros in the stopband. The singly loaded Q(Q/sub si/) of a tapped SIR is derived. With the aid of Q/sub si/, the two zeros can be independently tuned over a wide frequency range. When the positions of the two zeros are purposely located at the two leading higher order harmonics, the upper rejection band can be greatly extended. Chebyshev bandpass filters with spurious resonances up to 4.4f/sub o/, 6.5f/sub o/, and 8.2f/sub o/ are fabricated and measured to demonstrate the idea.     

The mechanics of compressive kinking in unidirectional fiber reinforced ductile matrix composites

Three distinct stages of kink band formation and propagation exist in ductile matrix composites subjected to compressive loading. These stages are called incipient kinking, transient kinking and kink band broadening. Each stage involves a different deformation mode. The mechanics governing each stage are discussed. Incipient kinking, where the peak load is attained, and kink band broadening, where the load attains a steady-state, are important in structural design. Two design philosophies are presented. References to pertinent literature are made throughout.     

Thin-gate oxides prepared by pure water anodization followed byrapid thermal densification

Anodic oxidation at room temperature with pure deionized water as electrolyte and then followed by high-temperature rapid thermal densification was used to prepare high breakdown endurance thin-gate oxides with thicknesses of about 50 Å. It was observed that the oxides prepared by anodic oxidation followed by rapid thermal densification (AOD) show better electrical characteristics than those grown by rapid thermal oxidation (RTO) only. The AOD oxides have a very low midgap interface trap density, Ditm, of smaller than 1×10¹⁰ eV^-1 cm^-2 and negative effective oxide trapped charge. From the smaller leakage currents observed during staircase ramp voltage time-zero dielectric breakdown (TZDB) and constant field time-dependent dielectric breakdown (TDDB) testings, it is supposed that the uniform interfacial property and the pretrapped negative charges in AOD oxides are responsible for the improved characteristics     

Effect of exponentially graded base doping on the performance ofGaAs/AlGaAs heterojunction bipolar transistors

The authors have fabricated n-p-n GaAs/AlGaAs heterojunction bipolar transistors (HBTs) with base doping graded exponentially from 5×10¹⁹ cm^-3 at the emitter edge to 5×10¹⁸ cm^-3 at the collector edge. The built-in field due to the exponentially graded doping profile significantly reduces base transit time, despite bandgap narrowing associated with high base doping. Compared to devices with the same base thickness and uniform base doping of 1×10¹⁹ cm^-3 , the cutoff frequency is increased from 22 to 31 GHz and maximum frequency of oscillation is increased from 40 to 58 GHz. Exponentially graded base doping also results ill consistently higher common-emitter current gain than uniform base doping, even though the Gummel number is twice as high and the base resistance is reduced by 40%     

Stress distribution on [100] Si wafer mapped by novel I-V analysis of MOS tunneling diodes

The current-voltage (I-V) characteristics of metal-oxide-semiconductor tunneling diodes distributed over a 3-in Si wafer were analyzed to investigate the stress distribution on the wafer. Generally, the substrate injection saturation current (J/sub sat/) decreases as the gate injection leakage current (J/sub g/) increases, the latter being dominated by oxide thickness via a trap related mechanism. A universal curve to fit all analyzed data was found and it is suggested that devices with extremely high (low) J/sub sat/ at a given J/sub g/ should be located in areas of the silicon lattice with relatively high external compressive (tensile) stress because of the stress-induced bandgap variation effect. The mapped locations of the highly stressed devices on a 3-in [100] Si wafer correspond to the patterns of slips caused by thermal stress during rapid thermal processing, as described in previous reports.     

The geometry effects for stress intensity factor of sandwich specimen for measuring interfacial fracture toughness

The interfacial stress intensity factors for three types of sandwich specimens: the single edge crack tensile specimen, the three point bend specimen and the four point shear specimen were obtained by the finite element analysis and compared with the asymptotic solutions. The results show that the geometric effect for mode II specimen is larger than mode I specimen. The limit curves for geometry factor equal to 1.05 were obtained to indicate the usable range of validity of the asymptotic solution.     

2-D dopant profiling in VLSI devices using dopant-selectiveetching: an atomic force microscopy study

We report a detailed mapping of a 2-D dopant profile on a fully processed industrial sample with large dynamic range and high spatial resolution by utilizing a dopant-selective etching process and Atomic Force Microscopy. The experimental results show excellent agreement with those obtained from SRP and SIMS as corroborative methods. We also discuss the most critical factors which influence the applicability, reproducibility, and reliability of this method