竖直式HVPE反应系统的理论模拟与GaN厚膜生长

根据流体动力学模型,研究了反应气体在反应室内的浓度分布,以及反应室的温场分布.NH3浓度在衬底附近分布均匀,而GaCl浓度在衬底中心区域较大,周边较小.实验结果表明,外延层在中心区生长速率为260μm/h,周边为140/μm/h.X射线摇摆曲线半高宽为141".O杂质的引入,使得样品具有较强的黄光发射.     

InAIN薄膜MOCVD外延生长研究

为了研究不同压力和不同模板对InAlN薄膜外延生长的影响,分别选取以GaN为模板时生长压力为4.00、6.67和13.33 kPa,压力为4.00 kPa时模板为GaN和A1N这两组条件进行实验比较.研究发现,随着生长压力的增加,样品中In含量降低,样品的粗糙度则随压力的增加而增大;压力为4.00 kPa时,分别以摇摆曲线半高宽(FWHM)为86.97”的AIN和224.1”的GaN为模板,发现A1N模板上生长的InAIN样品(002)和(102)峰的FWHM值及表面粗糙度比上述GaN为模板生长的InAlN样品都要小很多.综合以上结果可初步得知:降低压力可以优化InAlN薄膜的表面形貌,增加In组分含量;采用高质量的AIN作模板能生长出晶体质量和表面形貌都比较好的InAlN薄膜.     

蓝宝石图形衬底上GaN低温缓冲层的研究

低温下,在蓝宝石图形衬底上使用金属有机化学气相沉积(MOCVD)生长低温GaN(LT-GaN)缓冲层,并对其表面形貌进行了细致的观察,发现了不同于已报道的GaN选择性成核生长现象。基于不同厚度的低温GaN缓冲层生长了n型GaN(n-GaN),发现过厚或者过薄的缓冲层都会对n-GaN晶体质量产生负面影响,并结合初始成核阶段进行了原因分析。制备了基于不同厚度的n-GaN的发光二极管(LED)样品,分析了GaN晶体质量对LED输出功率的影响。同时发现,晶体质量较差的时候,光提取效率可能主导着对LED器件性能的影响。     

低损伤ICP刻蚀技术提高GaN LED出光效率

首先分析了在制作GaN基LED时,采用干法刻蚀技术会对材料的表面和量子阱有源区造成损伤,影响了GaN基LED的内量子效率。针对这个问题,研究实验采用感应耦合等离子反应刻蚀(ICP-RIE)技术,分别选择了氯气/三氯化硼(Cl2/BCl3)气体体系和氯气/氩气(Cl2/Ar)气体体系,通过优化射频功率、ICP功率、气体流量以及相应的真空度,得到了良好的刻蚀端面,对于材料造成的损伤较低,得到更好的I-V特性。实验结果表明,采用低损伤的偏压功率刻蚀后制作的LED器件,出光功率提升一倍以上,同时采用Cl2/Ar气体体系,改善了器件的I-V特性,有效提高了LED的出光效率。     

Influence of growth conditions on the V-defects in InGaN/GaN MQWs

The influence of the growth temperature,TMIn/TEGa andⅤ/Ⅲratio on the V-defects of InGaN/GaN multi-quantum wells（MQWs） has been investigated and discussed.When the TMIn flow increases from 180 to 200 sccm,the density of V-defects increases from 2.72×10¹⁸ to 5.24×10¹⁸ cm^-2,and the V-defect width and depth increase too.The density also increases with the growth temperature.The densities are 2.05×10⁸,2.72×10¹⁸ and 4.23×10⁸ cm^-2,corresponding to a growth temperature of 748,753 and 758℃respectively.When the NH₃ flows are 5000,6600 and 8000 sccm,the densities of the V-defects of these samples are 6.34×10¹⁸,2.72×10¹⁸ and 4.13×10¹⁸ cm^-2,respectively.A properⅤ/Ⅲratio is needed to achieve step flow growth mode.We get the best quality of InGaN/GaN MQWs at a growth temperature of 753℃TMIn flow at 180 sccm,NH₃ flow at 6600 sccm,a flatter surface and less V-defects density.The depths of these V-defects are from 10 to 30 nm,and the widths are from 100 to 200 nm.In order to suppress the influence of V-defects on reverse current and electro-static discharge of LEDs,it is essential to grow thicker p-GaN to fill the V-defects.     

Improvement of the efficiency droop of GaN-LEDs using an AlGaN/GaN superlattice insertion layer

With an n-AlGaN(4 nm)/GaN(4 nm) superlattice(SL) inserted between an n-GaN and an InGaN/GaN multiquantum well active layer,the efficiency droop of GaN-based LEDs has been improved.When the injection current is lower than 100 mA,the lumen efficiency of the LED with an n-AlGaN/GaN SL is relatively small compared to that without an n-AlGaN/GaN SL.However,as the injection current increases more than 100 mA,the lumen efficiency of the LED with an n-AlGaN/GaN SL surpasses that of an LED without an n-AlGaN/GaN SL. The wall plug efficiency of an LED has the same trend as lumen efficiency.The improvement of the efficiency droop of LEDs with n-AlGaN/GaN SLs can be attributed to a decrease in electron leakage due to the enhanced current spreading ability and electron blocking effect at high current densities.The reverse current of LEDs at -5 V reverse voltage decreases from 0.2568029 to 0.0070543μA,and the electro-static discharge(ESD) pass yield of an LED at human body mode(HBM)-ESD impulses of 2000 V increases from 60%to 90%.     

插入n-AlGaN/GaN超晶格改善GaN基LED的droop效应

在GaN基LED的n-GaN和InGaN/GaN发光区之间插入n-AlGaN/GaN超晶格来改善其droop效应。注入电流低于100mA时,插入n-AlGaN/GaN超晶格的LED的流明效率低于没有插入层的LED。注入电流高于100mA时,插入n-AlGaN/GaN超晶格的LED的流明效率高于没有插入层的LED。插入n-AlGaN/GaN超晶格后,GaN基LED在-5V的反向电压下,漏电由2.568029μA减少到0.070543μA。人体模式下,插入n-AlGaN/GaN超晶格的LED在2000V的静电电压下的通过率从60%提高到了90%。LED droop效应的改善是因为n-AlGaN/GaN超晶格过滤了穿透位错并改善了电流扩展能力。     

P 型氮化镓层生长压力对InGaN/GaN基发光二极管性能的影响

The advantages of In Ga N/Ga N light emitting diodes(LEDs) with p-Ga N grown under high pressures are studied.It is shown that the high growth pressure could lead to better electronic properties of p-Ga N layers due to the eliminated compensation effect.The contact resistivity of p-Ga N layers are decreased due to the reduced donor-like defects on the p-Ga N surface.The leakage current is also reduced,which may be induced by the better filling of V-defects with p-Ga N layers grown under high pressures.The LED efficiency thus could be enhanced with high pressure grown p-Ga N layers.     

MOCVD于高温AlN模板上生长的AlGaN材料

A high temperature AlN template was grown on sapphire substrate by metalorganic chemical vapor deposition.AFM results showed that the root mean square of the surface roughness was just 0.11 nm.Optical transmission spectrum and high resolution X-ray diffraction（XRD）characterization both proved the high quality of the AlN template.The XRD（002）rocking curve full width at half maximum（FWHM）was about 53.7 arcsec and（102）FWHM was about 625 arcsec.The densities of screw threading dislocations（TDs）and edge TDs wereestimated to be - 6 × 10^6 cm^-2 and - 4.7 ×10^9 cm^-2. AlGaN of Al composition 80.2% was further grown on the AlN template. The RMS of the surface roughness was about 0.51 nm. XRD reciprocal space mapping was carried out to accurately determine the Al composition and relaxation status in the AlGaN epilayer. The XRD （002） rocking curve FWHM of the AIGaN epilayer was about 140 arcsec and （102） FWHM was about 537 arcsec. The density of screw TDs was estimated to be - 4 × 10^7 cm^-2 and that of edge TDs was - 3.3 × 10^9 cm^-2. These values all prove the high quality of the AlN template and AlGaN epilayer.     

AlGaN/GaN型气敏传感器对于C0的响应研究

研究了基于AlGaN/GaN型结构的气敏传感器对于C0的传感性.制备出AlGaN/GaN型气敏传感器器件,并测试得到了器件在50℃时对于不同浓度(1%,9000,8000,5000和1000ppm)的C0的响应情况;测试并分析了1%CO在50和100℃下响应度的差异,计算了通人1%CO前后器件的肖特基势垒高度的变化和灵敏度随电压的分布关系.结果表明,器件的灵敏度强烈依赖于器件的工作温度和通入的气体浓度,随着温度和浓度的增加,器件的灵敏度呈单调增加,器件在100℃空气气氛中表现出了良好恢复性能.