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工厂供电系统多采用电缆线路,其截面大、长度短,给线路保护级差配合增加了难度,在线路末端出现短路故障时易造成越级跳闸事故发生。为此,针对某110kV新建变电站出现的越级跳闸事故,对各线路保护定值时间重新进行校验,为下级出线留出时间配合空间,以满足保护选择性要求。 相似文献
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建筑施工图纸的设计效果的影响因素相对较多,由于施工图纸设计具有很强的综合性和技术性,因此在实际设计中需要结合建筑工程的特点和要求,明确施工图设计管理的内容,为提升理水平,促使建筑工程施工中各道工序都能高效、有序地开展,本文以西安金科博翠天宸项目为例,通过对建筑施工图设计管理内容,分析了当前设计管理中常见的问题,提出建筑施工图设计管理的优化策略,研究表明:施工图纸设计管理效果直接关系到整个建筑工程项目施工质量和效率。因此,对建筑施工图设计管理的优化策略的研究具有十分重要的意义。 相似文献
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The ion line of 434.8 nm and atom line of 419.8 nm of Ar plasma produced by an inductively coupled plasma (ICP) were measured by optical emission spectroscopy and the influences from the working gas pressure, radio-frequency (RF) power and different positions in the discharge chamber on the line intensities were investigated in this study. It was found that the intensity of Ar atom line increased firstly and then saturated with the increase of the pressure. The line intensity of Ar^+, on the other hand, reached a maximum value and then decreased along with the pressure. The intensity of the line in an RF discharge also demonstrated a jumping mode and a hysteresis phenomenon with the RF power. When the RF power increased to 400 W, the discharge jumped from the E-mode to the H-mode where the line intensity of Ar atom demonstrated a sudden increase, while the intensity of Ar^+ ion only changed slightly. If the RF power decreased from a high value, e.g., 1000 W, the discharge would jump from the H-mode back to the E-mode at a power of 300 W. At this time the intensities of Ar and Ar^+ lines would also decrease sharply. It was also noticed in this paper that the intensity of the ion line depended on the detective location in the chamber, namely at the bottom of the chamber the line was more intense than that in the middle of the chamber, but less intense than at the top, which is considered to be related to the capacitance coupling ability of the ICP plasma in different discharge areas. 相似文献
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Metallic copper(Cu) films were deposited on a Si (100) substrate by unbalanced magnetron sputtering enhanced by radio-frequency plasma and external magnetic field confinement. The morphology and structure of the films were examined by scanning electron microscopy (SEM), atomic force microscope (AFM) and X-ray diffraction (XRD). The surface average roughness of the deposited Cu films was characterized by AFM data and resistivity was measured by a four-point probe. The results show that the Cu films deposited with radio-frequency discharge enhanced ionization and external magnetic field confinement have a smooth surface, low surface roughness and low resistivity. The reasons may be that the radio-frequency discharge and external magnetic field enhance the plasma density, which further improves the ion bombardment effect under the same bias voltage conditions. Ion bombardment can obviously influence the growth features and characteristics of the deposited Cu films. 相似文献
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