具有缺陷和应力限值的预应力钢支撑柱屈曲性能

通过预应力支撑加固的钢柱,一般增加了轴向抗压强度。过去,十分强调获得更高的临界屈曲荷载,然而,后屈曲性能是结构安全性和功能的重要保证。对具有几何缺陷和与可能的材料失效相关的应力极限的支撑柱的屈曲性能进行检验。考虑有几何缺陷支撑柱的屈曲性能,采用Rayleigh-Ritz方法对几何非线性模型公式化,并通过有限元方法进行验证。研究显示：对于承受最高临界荷载的预应力状态,系统对有几何缺陷的柱更为敏感。对某一给定形状结构,实际的最大荷载似乎随着预应力的增加而增加。研究建议：最佳的预应力取值应该大于基于传统方法的线性分析的结果。     

ACROSS MASS TRANSFER PHENOMENON IN A CHANNEL OF LOWER STRETCHING WALL

This study aims to investigate the effect of across mass transfer (AMT) phenomenon on a three-dimensional steady viscous flow in a channel of lower stretching wall. The phenomenon of AMT is established by imposing suction at one plate and injection at the other plate of the channel simultaneously. Both the walls are assumed to be porous so that suction/injection can take place. Interesting observations regarding viscous drag at the stretching plate have been recorded in the presence of AMT phenomenon at the twin walls. A highly accurate purely analytic solution has been obtained for the governing nonlinear equations. The issue of convergence and accuracy of the analytic solution has been discussed in detail. Results are discussed through graphs.     

Integrating renewables economic dispatch with demand side management in micro-grids: a genetic algorithm-based approach

Economic dispatch and demand side management are two of the most important tools for efficient energy management in the grid. It is a casual observation that both these processes are intertwined and thus complement each other. Strategies aiming to optimize economic dispatch have implications for demand side management techniques and vice versa. In this paper, we present a genetic algorithm-based solution which combines economic dispatch and demand side management for residential loads in a micro-grid. Our system collects preferences of demand data from consumers and costs of energy of various sources. It then finds the optimal demand scheduling and energy generation mix for the given time window. Our evaluations show that the given approach can effectively reduce operating costs in a single- and multiple-facility micro-grids for both suppliers and consumers alike.     

Solder joint fatigue life of fine pitch BGAs – impact of design and material choices

The impact of design and material choices on solder joint fatigue life for fine pitch BGA packages is characterized. Package variables included die size, package size, ball count, pitch, mold compound, and substrate material. Test board variables included thickness, pad configuration, and pad size. Three thermal cycle conditions were used.Fatigue life increased by up to 6× as die size was reduced. For a given die size, fatigue life was up to 2× longer for larger packages with more solder balls. Mold compounds with higher filler content reduced fatigue life by up to 2× due to a higher stiffness and lower thermal expansion coefficient. Upilex S tape with punched holes gave 1.15× life improvement over Kapton E tape with etched holes. Once optimized, tape-based packages have equal board level reliability to laminate-based packages.Solder joint fatigue life was 1.2× longer for 0.9 mm thick test boards compared to 1.6 mm thick boards due to a lower assembly stiffness. The optimum PCB pad design depends on failure location. For CSP applications, NSMD test board pads give up to 3.1× life improvement over SMD pads. For a completely fan-out design, there was a 1.6× acceleration factor between −40125°C, 15 min ramps, 15 min dwells and 0100°C, 10 min ramps, 5 min dwells.     

Salmonella typhimurium encodes an SdiA homolog, a putative quorum sensor of the LuxR family, that regulates genes on the virulence plasmid

OBJECTIVE: Despite improved systemic control of metastatic breast cancer, the incidence of brain metastases from breast carcinoma continues to rise, in part because most systemically administered agents have poor central nervous system penetration. Therefore, as a method of optimizing drug delivery into the central nervous system, we studied the safety and efficacy of chemotherapy delivered locally via biodegradable polymers in a mouse model of breast carcinoma metastases to the brain. METHODS: The chemotherapeutic agents carmustine (BCNU), carboplatin, and camptothecin were incorporated into controlled release polymers and tested individually against intracranial challenges of EMT-6 breast tumor in BALB/c female mice. For each drug, four groups were tested: Group 1, empty polymer (no drug); Group 2, external beam radiotherapy (XRT) alone; Group 3, local chemotherapy from biodegradable polymer alone; and Group 4, local chemotherapy and XRT together. Polymers were implanted 5 days after intracranial tumor inoculation; XRT was administered on Days 7 through 9 (300 cGy/d). RESULTS: BCNU polymer alone (n = 10; median survival time, >200 d; P < 0.0001) and BCNU and XRT together (n = 10; median survival time, 41 d; P = 0.02) significantly improved survival in mice with intracranial EMT-6 breast cancer in comparison with control animals (n = 20; median survival time, 17 d). Carboplatin and camptothecin, either with or without XRT, and XRT alone did not have any significant effect on survival. CONCLUSION: Local delivery of BCNU with biodegradable polymers can significantly prolong survival in a murine model of intracranial metastatic breast cancer. Surgical resection and placement of BCNU polymers into the resection cavity may decrease the incidence of local recurrence of breast cancer metastases with minimal morbidity.     

Characterization of the exbBD operon of Escherichia coli and the role of ExbB and ExbD in TonB function and stability

TonB protein appears to couple the electrochemical potential of the cytoplasmic membrane to active transport across the essentially unenergized outer membrane of gram-negative bacteria. ExbB protein has been identified as an auxiliary protein in this process. In this paper we show that ExbD protein, encoded by an adjacent gene in the exb cluster at 65', was also required for TonB-dependent energy transduction and, like ExbB, was required for the stability of TonB. The phenotypes of exbB exbD+ strains were essentially indistinguishable from the phenotypes of exbB+ exbD strains. Mutations in either gene resulted in the degradation of TonB protein and in decreased, but not entirely absent, sensitivities to colicins B and Ia and to bacteriophage phi 80. Evidence that the absence of ExbB or ExbD differentially affected the half-lives of newly synthesized and steady-state TonB was obtained. In the absence of ExbB or ExbD, newly synthesized TonB was degraded with a half-life of 5 to 10 min, while the half-life of TonB under steady-state conditions was significantly longer, approximately 30 min. These results were consistent with the idea that ExbB and ExbD play roles in the assembly of TonB into an energy-transducing complex. While interaction between TonB and ExbD was suggested by the effect of ExbD on TonB stability, interaction of ExbD with TonB was detected by neither in vivo cross-linking assays nor genetic tests for competition. Assays of a chromosomally encoded exbD::phoA fusion showed that exbB and exbD were transcribed as an operon, such that ExbD-PhoA levels in an exbB::Tn10 strain were reduced to 4% of the levels observed in an exbB+ strain under iron-limiting conditions. Residual ExbD-PhoA expression in an exbB::Tn10 strain was not iron regulated and may have originated from within the Tn10 element in exbB.     

Entropy generation in hydrodynamic slip flow over a vertical plate with convective boundary

The present article aims to report the effects of hydrodynamic slip on entropy generation in the boundary layer flow over a vertical surface with convective boundary condition. Suitable similarity transformations are used to transform the fundamental equations of hydrodynamic and thermal boundary layer flow into ordinary differential equations. The governing equations are then solved numerically using the shooting method and the velocity and the temperature profiles are obtained for various values of parameters involved in the governing equations. The expressions for the entropy generation number and the Bejan number are presented and the results are discussed graphically and quantitatively for the slip parameter, the local Grashof number, the Prandtl number, the local convective heat transfer parameter, the group parameter and the local Reynolds number. It is observed that due to the presence of slip, entropy production in a thermal system can be controlled and reduced.     

Geometric modelling of kink banding in laminated structures

An analytical model founded on geometric and potential energy principles for kink band deformation in laminated composite struts is presented. It is adapted from an earlier successful study on confined layered structures that was formulated to model kink band formation in the folding of geological layers. This study's principal aim was to explore the underlying mechanisms governing the kinking response of flat, laminated components comprising unidirectional composite laminae. A pilot parametric study indicates that the key features of the mechanical response are captured well and that quantitative comparisons with experiments presented in the literature are highly encouraging.     

High temperature lead-free solder for microelectronics

This paper reports results of a four-year industrial consortium effort to develop lead-free solders for high-temperature applications (up to 160°C). Work included preliminary evaluations of 32 tin-based alloys, a screening of the thermomechanical fatigue performance of 13 promising alloys, and a full manufacturability and fatigue testing of the seven most promising of those alloys, namely Sn-3.5Ag, Sn-4Ag-1Cu, Sn-4Ag-0.5Cu, Sn-2.5Ag-0.8Cu-0.5Sb, Sn-4.6Ag-1.6Cu-1Sb-1Bi, Sn-3.3Ag-1Cu-3.3Bi, and Sn-3.5Ag-1.5In (compositions in weight percent). Eight different components were used on the reliability test vehicle, and the alloys were compared through Weibull analysis. In addition, the same seven experimental alloys were tested with ball grid array packages cycled up to 100°C or 125°C. All the lead-free alloys performed well, but those containing bismuth showed especially outstanding performance. In general, the ternary and higher alloys performed as well or better than the industry standard tin-silver eutectic, suggesting that solders other than the tin-silver eutectic should be considered for high-reliability, high-temperature applications. Frank W. Gayle is with NIST, Stop 8555, 100 Bureau Drive, Gaithersburg, MD 20899, frank.gayle@nist.gov.     

Analytic solution of generalized three-dimensional flow and heat transfer over a stretching plane wall

This communication aims to investigate the incompressible generalized three-dimensional viscous flow with heat transfer analysis in the presence of viscous dissipation. The flow is generated due to uniform stretching of the plane wall. Complete analytic solutions for velocity and temperature are obtained by homotopy analysis method (HAM). Graphs are plotted to discuss the effects of different parameters.