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排序方式: 共有1264条查询结果,搜索用时 15 毫秒
1.
Gladson S. Chrisben Prasad P. Siva Manickam Bhaskar 《Analog Integrated Circuits and Signal Processing》2021,109(3):571-583
Analog Integrated Circuits and Signal Processing - As the 5G era beckons in the world of communication and information technology, there is a surge in demand for battery-operated, mobile wireless... 相似文献
2.
Ferrite particles coated with biocompatible phases can be used for hyperthermia treatment of cancer. We have synthesized substituted
calcium hexaferrite, which is not stable on its own but is stabilized with small substitution of La. Hexaferrite of chemical
composition (CaO)0.75(La203)0.20(Fe2O3)6 was prepared using citrate gel method. Hydroxyapatite was prepared by precipitating it from aqueous solution of Ca(NO3)2 and (NH4)2HPO4 maintaining pH above 11. Four different methods were used for coating of hydroxyapatite on ferrite particles. SEM with EDX
and X-ray diffraction analysis shows clear evidence of coating of hydroxyapatite on ferrite particles. These coated ferrite
particles exhibited coercive field up to 2 kOe, which could be made useful for hysteresis heating in hyperthermia. Studies
by culturing BHK-21 cells and WBC over the samples show evidence of biocompatibility. SEM micrographs and cell counts give
clear indication of cell growth on the surface of the sample. Finally coated ferrite particle was implanted in Kasaulli mouse
to test its biocompatibility. The magnetic properties and biocompatibility studies show that these hydroxyapatite coated ferrites
could be useful for hyperthermia. 相似文献
3.
4.
Michael Osterman Abhijit Dasgupta 《Journal of Materials Science: Materials in Electronics》2007,18(1-3):229-236
The transition from lead (Pb) bearing solder to Pb-free solder has arisen in response to government restrictions on the use
of lead (Pb) by the European Union. As a result, electronic manufacturers have sought a material comparable to the conventional
63Sn37Pb solder that has been traditionally used to assemble electronic hardware. Based on extensive review of various solder
combination, the majority of electronic manufacturers appear to be adopting a tin–silver–copper (SAC) solder as a popular
Pb-free solder replacement. Significant investments have been made by many researchers to characterize the material behavior
and durability of this solder system. While the exact composition of the SAC solder is still in question, it now appears that
the 96.5Sn3.0Ag0.5Cu (SAC305) solder is gaining wider acceptance as the favored Pb-free replacement, for surface mount assemblies
that are going to be subjected predominantly to cyclic thermal environments. This paper presents a review of our current understanding
of the life expectancy of Pb-free SAC solder interconnects for electronic hardware. To this end, the paper focuses on material
characterization of SAC solder, as well as its temperature cycling and vibration fatigue reliability. From this review, SAC
solder interconnects are shown to be suitable for providing adequate life expectancies for temperature cycling in electronic
hardware. However, it is clear that there are differences between SAC and the conventional Sn37Pb solder, that need to be
understood in order to design reliable electronic hardware. 相似文献
5.
V Douzdjian SS Bhaskar PK Baliga KK Gugliuzza PR Rajagopalan 《Canadian Metallurgical Quarterly》1997,20(8):1310-1314
OBJECTIVE: The racial impact on graft outcome is not well defined in diabetic recipients. The purpose of this study is to analyze our experience with kidney-alone (A) and kidney-pancreas (KP) transplantation in type 1 diabetic recipients and evaluate the impact of racial disparity on outcome. RESEARCH DESIGN AND METHODS: The records of 217 kidney transplants (118 KA, 99 KP) performed on type 1 diabetic patients between 1985 and 1995 at the Medical University of South Carolina and the University of Texas Medical Branch were reviewed. RESULTS: A total of 53 (31%) white patients and 15 (33%) black patients experienced at least one episode of biopsy-proven acute rejection of the renal graft (NS). Patient survival at 1, 2, and 5 years was similar in white (92, 87, 69%) and black (91, 91, 69%) patients (NS). Kidney graft survival at 1, 2, and 5 years in the KA group was 72, 62, and 42% in blacks, compared with 79, 76, and 53% in whites (NS). Kidney graft survival at 1, 2, and 5 years in the KP group was 92, 92, and 74% in blacks, compared with 83, 77, and 58% in whites (NS). Pancreas graft survival at 1, 2, and 5 years was 81, 81, and 81% in blacks, compared with 81, 75, and 62% in whites (NS). Cox regression analysis revealed that donor age > or = 40 years increased the risk of renal graft failure 6.2-fold (P = 0.0001), whereas the addition of a pancreas transplant to a kidney and a living-related transplant decreased the risk of failure of the kidney graft 0.2 (P = 0.005) and 0.1 times (P = 0.005). CONCLUSIONS: Our results suggest that when compared with whites, there may be a trend toward an improved kidney and pancreas graft outcome in blacks undergoing KP transplants. These findings suggest that diabetes may override the risk factors that account for the pronounced disparity in outcome observed between nondiabetic white and black recipients. 相似文献
6.
7.
Solutions, within the framework of linear uncoupled thermoelasticity, are presented for certain problems of flexure of composite laminates. Benchmark numerical results, useful for the validation or otherwise of approximate laminate models, are tabulated. Finally, these results are used to examine the accuracy of the classical lamination theory based on Kirchhoff's hypothesis. 相似文献
8.
Time dispersion (TD) is computed for large neutron detectors using plastic scintillators. It is shown that TD seen by the photomultiplier (PM) tube does not necessarily increase with incident neutron energy, which is a result not fully in agreement with the usual finding 相似文献
9.
Dasgupta U. Wooi Gan Yeoh Chun Geik Tan Sheng Jau Wong Mori H. Singh R. Itoh M. 《Microwave Theory and Techniques》2002,50(11):2443-2452
An implementation of the IF section of WCDMA mobile transceivers with a set of two chips fabricated in an inexpensive 0.35-/spl mu/m two-poly three-metal CMOS process is presented. The transmit/receive chip set integrates quadrature modulators and demodulators, wide dynamic range automatic gain control (AGC) amplifiers, with linear-in-decibel gain control, and associated circuitry. This paper describes the problems encountered and the solutions envisaged to meet stringent specifications, with process and temperature variations, thus overcoming the limitations of CMOS devices, while operating at frequencies in the range of 100 MHz-1 GHz. Detailed measurement results corroborating successful application of the new techniques are reported. A receive AGC dynamic range of 73 dB with linearity error of less than /spl plusmn/2 dB and spread of less than 5 dB for a temperature range of -30/spl deg/C to +85/spl deg/C in the gain control characteristic has been measured. The modulator measurement shows a carrier suppression of 35 dB and sideband/third harmonic suppression of over 46 dB. The core die area of each chip is 1.5 mm/sup 2/. 相似文献
10.
Two techniques for designing function-dependent easily testable programmable logic arrays are presented. The techniques can detect all the multiple stuck-at, crosspoint and bridging faults, as compared with most of the existing techniques where some of the faults, especially bridging faults, remain undetected.<> 相似文献