Component allocation to balance workload in printed circuit card assembly systems

Component allocation in printed circuit card assembly systems is a special case of the classical mixed-model assembly line balancing problem and involves assigning component types to machines to achieve specific production objectives. In this paper the component allocation problem is considered for the scenario where there are two or more placement machines (possibly nonidentical) and the objective is to balance, for every card type, a combination of the card assembly time and the machine setup time. A mathematical formulation of the problem is developed for a class of placement machines. Two alternative solution approaches are presented: a list-processing-based heuristic for a simple version of the problem, and a linear-programming-based branch-and-bound procedure for the general component allocation problem. Industrial case study results are presented for each approach that indicate expected throughput improvements of up to 8-10% over the company's current procedure, with much less direct effort required by the process engineer.     

Surface Finish Effects and the Strength-Grain Size Relation in SiC

The effect of surface finish on the strength-grain size relation was investigated for dense hot-pressed SiC. Failure initiated predominantly via the propagation of extrinsic machining-induced flaws for the range of grain sizes and machining grit sizes studied. These results are consistent with the region of large-grain-size flaw control as delineated by Prochazka and Charles. The severity of machining-induced flaws, relative to the machining grit size, decreased with increasing machining grit size and decreasing SiC grain size.