A novel compact ring dual-mode filter with adjustable second-passband for dual-band applications

In this letter, a novel compact ring dual-mode with adjustable second-passband for dual-band applications are presented. A ring resonator with two different geometric dimensions are derived and designed to have identical fundamental and the first higher-order resonant frequencies, and to establish appropriate couplings in the structure. Moreover, the proposed filter has smaller size as compared with the basic topology of stopband filters and stepped-impedance-resonator (SIR) filters. The measured filter performance is in good agreement with the simulated response.     

High-frequency small signal AC and noise modeling of MOSFETs for RFIC design

High-frequency (HF) AC and noise modeling of MOSFETs for radio frequency (RF) integrated circuit (IC) design is discussed. A subcircuit RF model incorporating the HF effects of parasitics is presented. This model is compared with the measured data for both y parameter and f_T characteristics. Good model accuracy is achieved against measurements for a 0.25 μm RF CMOS technology. The HF noise predictivity of the model is also examined with measured data. Furthermore, a methodology to extract the channel thermal noise of MOSFETs from HF noise measurements is presented. By using the extracted channel thermal noise, any thermal noise models can be verified directly. Several noise models including the RF model discussed in this paper have been examined, and the results show that the RF model can predict the channel thermal noise better than the other models     

Influence of quantum capture and tunneling mechanisms on the dark current of bound-to-continuum quantum-well infrared photodetectors

We present a theoretical model for the dark current of bound-to-continuum quantum-well infrared photodetectors (QWIPs), by considering the field-induced mixing effect, tunneling rate and phonon scattering rate between bound and continuum states. Using this model, we can see clearly how these mechanisms significantly influence the Fermi levels of bound and continuum electrons, and thus, the dark current. Nonlinear temperature dependence of the dark current at low temperature is predicted and discussed in detail. The simulated dark currents exhibit good agreement with the experimental results, without use of parameter fitting techniques.     

A 12-36GHz PHEMT MMIC balanced frequency tripler

A novel configuration of balanced frequency InGaAs pseudomorphic high electron mobility transistor (PHEMT) monolithic microwave integrated circuit (MMIC) tripler is proposed. A resonant LC filter is used to eliminate the fundamental frequency and a phase delay line is employed to suppress the second harmonic. The separation of the independent phase shifters makes the tripler more compact and flexible. The conversion loss of the tripler operating from 12 to 36GHz is less than 9.4dB at 9-dBm input power. As compared to the third-harmonic frequency, the fundamental frequency is suppressed more than 21.4dB while for the second harmonic is more than 22.3dB at 36GHz.     

How to protect exchanged secrets in the fair exchange protocol with off-line TTP

The most efficient approach to a fair exchange is to use an off-line trusted third party (TTP for short) who gets involved only when a dispute between two parties occurs. However, exchanged secrets that are not protected properly may be exposed to the TTP when one of these two parties asks the TTP to mediate the dispute. The first work to protect exchanged secrets from TTP’s misuse was proposed by Franklin and Reiter in 1997. They provided an on-line semi-trusted third party instead of an off-line third party for a fair exchange. Their schemes forced the TTP to take part in the protocol for all the cases, and thus, deemed to be impractical.The present paper, introduces several models, including single and multiple TTPs, to focus the attention not only on security properties, but also on reliability functions. In the single TTP mode, our new scheme can protect the exchanged data through an efficient exchange protocol, whereas in the multiple TTP mode, we proposed an approach to balance the security level with the reliability of the system.     

Parallelization of a Hyper-Linking–Based Theorem Prover

We describe the parallelization of a first-order logic theorem prover that is based on the hyper-linking proof procedure (HLPP). Four parallel schemes – process level, clause level, literal level, and flow level – are developed for two types of sequential implementation of HLPP: list based and network based. The motivation for developing each parallel scheme is presented, and the architecture and implementation details of each scheme are described. Issues about parallel processing, such as serialization and synchronization, load balancing, and access conflicts, are examined. Speedups over sequential implementations are attained, and timing results for benchmark problems are provided.     

Thermal resistance analysis and validation of flip chip PBGA packages

This work proposes a finite element numerical methodology to predict the thermal resistance of both flip chip-plastic ball grid array (FC-PBGA) with a bare die and FC-PBGA with a metal cap. The 3D finite element model was initially constructed to simulate the thermal resistance of FC-PBGA. A thermal resistance experiment was performed to verify the FEM results, following the construction of specimens of FC-PBGA with a bare die and with an aluminum cap, using six-layered substrate. The verified finite element model was employed to determine the thermal resistance of FC-PBGA with a copper cap using four-layered and six-layered substrates. Experimental results demonstrated that FC-PBGA with a metal cap improves thermal performance by 35% over with a bare die. FC-PBGA with a copper cap slightly improves thermal performance from 2% to 2.8% over that of FC-PBGA with an aluminum cap. The thermal resistance of FC-PBGA with a four-layered substrate is reduced by 4.0% to 5.9% from that of FC-PBGA with a six-layered substrate, since the four-layered substrate contains less metal. The finite element numerical results negligibly differ from the experimental results by 6% to 8.1%. A finite element numerical methodology is here proposed to predict the thermal resistance of FC-PBGA. The methodology is effective in researching and developing new products or improving existing packages.     

Enhanced high-level Petri nets with multiple colors for knowledgeverification/validation of rule-based expert systems

Exploring the properties of rule-based expert systems through Petri net models has received a lot of attention. Traditional Petri nets provide a straightforward but inadequate method for knowledge verification/validation of rule-based expert systems. We propose an enhanced high-level Petri net model in which variables and negative information can be represented and processed properly. Rule inference is modeled exactly and some important aspects in rule-based systems (RBSs), such as conservation of facts, refraction, and closed-world assumption, are considered in this model. With the coloring scheme proposed in this paper, the tasks involved in checking the logic structure and output correctness of an RES are formally investigated. We focus on the detection of redundancy, conflicts, cycles, unnecessary conditions, dead ends, and unreachable goals in an RES. These knowledge verification/validation (KVV) tasks are formulated as the reachability problem and improper knowledge can be detected by solving a set of equations with respect to multiple colors. The complexity of our method is discussed and a comparison of our model with other Petri net models is presented.     

Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding

This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer fabrication approach.