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1.
AbstractGeneralized thermoelastic interactions due to three-phase-lag time-nonlocal heat transfer in a Kelvin-Voigt type infinitely extended visco-thermoelastic continuum with cylindrical cavity has been investigated. The two-temperature generalized thermoelasticity theory has also been taken into account. The problem has been solved in the domain of Laplace on the assumption that the surface of the cavity is free from traction and is subjected to a smooth and time-dependent-heating effect. Laplace inversion of the transformed solutions has been carried out numerically. The obtained numerical data for different considerations are plotted in graphs to study the effects of time-nonlocal parameter, two-temperature parameter and visco-thermoelastic relaxation parameter on different thermoelastic quantities of physical interest. 相似文献
2.
Distributed Transmit Antenna Selection (DTAS) Under Performance or Energy Consumption Constraints 总被引:1,自引:0,他引:1
Michalopoulos D.S. Karagiannidis G.K. Tsiftsis T.A. Mallik R.K. 《Wireless Communications, IEEE Transactions on》2008,7(4):1168-1173
Motivated by the transmit antenna selection (TAS) concept, used in Multiple-Input-Multiple-Output systems, we argue for distributed transmit antenna selection (DTAS), which corresponds to a method of selecting a subset of available relays in cooperative diversity systems. Assuming amplify and forward relays, the proposed selection method represents a low-complexity tool for determining the optimum relaying set. Two optimization problems are studied: the error probability minimization subject to total energy consumption constraints, and the dual one, the total energy consumption minimization under error performance constraints. Numerical examples verify the advantage of the proposed method in adapting the number of relaying terminals to the desired performance-consumption tradeoff. 相似文献
3.
In this Account, we explore the role constant curvature structures play in amphiphilic small molecule crystals and extended coordination solids. A constant curvature structure is one in which there is a surface or interface that has the same curvature throughout its surface. Simple examples of such structures contain spheres (micelles), columns, or layers. Yet another family are cubic as is found in the gyroid topology. For amphiphilic systems, there are two domains, one generally hydrophobic and the other hydrophilic. We find that the interfaces between these two domains in small molecule structures resemble those in larger scale systems and adopt topologies related to constant curvature structures. The hydrophobic-to-total volume ratio, a molecular parameter, can be used to predict which type of constant curvature structure is adopted. In the case of three coordinate extended solids, constant curvature plays a role both in the extended net topology and in the hydrophobic-to-hydrophilic interface. 相似文献
4.
Malunions of the hand present a challenging problem to the orthopaedic surgeon. Angular and rotational deformities, and shortening and articular incongruity, can lead to significant functional impairment or dysesthetic appearance. The prevention of malunion should remain a primary goal. When displaced fractures of the metacarpals or phalanges present within the first or second weeks, properly performed closed or open reduction with percutaneous pinning or internal fixation are excellent options with predictable results. Malaligned fractures that present later frequently cannot be readily reduced. Once fully united, treatment options have included corrective osteotomy if function is significantly impaired or if appearance is objectionable; for patients who are not suitable for surgery for medical or other reasons, or for whom appearance is acceptable, intensive occupational therapy to maximize function may yield sufficiently serviceable clinical results. During the past several years, the senior author (BL) has chosen to be more proactive in the prevention of malunions of the hand. In the authors' experience, results of aggressive surgical treatment of subacute, malaligned fractures in selected patients have produced results comparable with or superior to those reported for later reconstructive procedures. With the proliferation of managed care, there has been an increasing frequency of delayed referral patterns for fracture treatment by hand specialists. Definitive treatment of these "impending malunions" is preferable to passive treatment delay and secondary reconstructive procedures, offering both earlier correction of alignment and earlier opportunity for return of function. 相似文献
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6.
Awadesh Kumar Mallik Nurcan Calis Acikbas Ferhat Kara Hasan Mandal Debabrata Basu 《Ceramics International》2012,38(7):5757-5767
Two different varieties of Si3N4 powders were used to prepare SiAlON ceramics. 100% β-Si3N4 was used from refractory grade powders (B1) and another purer 98% α-Si3N4 (50A) powder was used to prepare the SiAlON samples. Since SiC + SiAlON composites reportedly perform better, batches were prepared with 15% SiC addition to the refractory powders (B1) and 17.5% SiC was added to the other SiAlON composition (50A). The samples were gas pressure sintered at 1840 °C and at 22 bar with 1 h dwelling time. Thereby, we could achieve 97–98% theoretical density. The hardness was recorded 14–17 GPa while fracture toughness varied from 4.3 to 5 MPa m1/2. Fretting experiments showed initial running-in period of 300 cycles for all the tribo-couples. After which, the steady state coefficient of frictions (COF) were achieved. Steel ball of 10 mm diameter, fretting against 50A composition, showed 0.6 average steady state COF while the same composition while fretting against alumina ball of the same diameter, showed 0.57 average steady state COF. Results have been compared with SiAlON composition derived from refractory powder (B1) and found that the 50A composition performs better under identical test conditions. Moreover, cytocompatibility study also suggests that the investigated 50A composition can be used as substrate to support cell adhesion and proliferation of L929 mouse fibroblast cell lines whereas B1 composition derived from refractory powders are toxic in nature. 相似文献
7.
Mallik Bruhanth Sheikh-Akbari Akbar Kor Ah-Lian 《Multimedia Tools and Applications》2019,78(6):6701-6720
Multimedia Tools and Applications - There has been increasing demand for multiview video transmission over band limited channel over past years and various techniques have been proposed to fulfil... 相似文献
8.
9.
Ashoka Bali Il-Ho Kim Peter Rogl Ramesh Chandra Mallik 《Journal of Electronic Materials》2014,43(6):1630-1638
The thermoelectric figure of merit (zT) can be increased by introduction of additional interfaces in the bulk to reduce the thermal conductivity. In this work, PbTe with a dispersed indium (In) phase was synthesized by a matrix encapsulation technique for different In concentrations. x-Ray diffraction analysis showed single-phase PbTe with In secondary phase. Rietveld analysis did not show In substitution at either the Pb or Te site, and this was further confirmed by room-temperature Raman data. Low-magnification (~1500×) scanning electron microscopy images showed micrometer-sized In dispersed throughout the PbTe matrix, while at high magnification (150,000×) an agglomeration of PbTe particles in the hot-pressed samples could be seen. The electrical resistivity (ρ) and Seebeck coefficient (S) were measured from 300 K to 723 K. Negative Seebeck values showed all the samples to be n-type. A systematic increase in resistivity and higher Seebeck coefficient values with increasing In content indicated the role of PbTe-In interfaces in the scattering of electrons. This was further confirmed by the thermal conductivity (κ), measured from 423 K to 723 K, where a greater reduction in the electronic as compared with the lattice contribution was found for In-added samples. It was found that, despite the high lattice mismatch at the PbTe-In interface, phonons were not scattered as effectively as electrons. The highest zT obtained was 0.78 at 723 K for the sample with the lowest In content. 相似文献
10.
Kenny C. Otiaba R.S. Bhatti N.N. Ekere S. Mallik M.O. Alam E.H. Amalu M. Ekpu 《Microelectronics Reliability》2012,52(7):1409-1419
Chip scale package (CSP) technology offers promising solutions to package power device due to its relatively good thermal performance among other factors. Solder thermal interface materials (STIMs) are often employed at the die bond layer of a chip-scale packaged power device to enhance heat transfer from the chip to the heat spreader. Nonetheless, the presence of voids in the solder die-attach layer impedes heat flow and could lead to an increase in the peak temperature of the chip. Such voids which form easily in the solder joint during reflow soldering process at manufacturing stage are primarily occasioned by out-gassing phenomenon and defective metallisation. Apparently, the thermal consequences of voids have been extensively studied, but not much information exist on precise effects of different patterns of solder die-attach voids on the thermal performance of chip-level packaged power device. In this study, three-dimensional finite element analysis (FEA) is employed to investigate such effects. Numerical studies were carried out to characterise the thermal impacts of various voids configurations, voids depth and voids location on package thermal resistance and chip junction temperature. The results show that for equivalent voiding percentage, thermal resistance increases more for large coalesced void type in comparison to the small distributed voids configuration. In addition, the study suggests that void extending through the entire thickness of solder layer and voids formed very close to the heat generating area of the chip can significantly increase package thermal resistance and chip junction temperature. The findings of this study indicate that void configurations, void depth and void location are vital parameters in evaluating the thermal effects of voids. 相似文献