Analysis of the mechanical performance of a cardiovascular stent design based on micromechanical modelling

Stents are very commonly used in the treatment of coronary heart disease. They are permanent vascular support structures that offer a preferred alternative to bypass surgery in certain situations. The purpose of this work is to examine the mechanical behaviour of a stainless steel balloon expandable stent design using computational micromechanics in the context of the finite element method. Deployment and cardiac pulsing loading conditions are considered. Classical phenomenological plasticity theory (J₂ flow theory) and physically based crystal plasticity theory are used to describe the stent material behaviour. Parametric studies are carried out using both constitutive theories with a view to determining important stent deployment characteristics such as recoil and foreshortening. Comparisons of the results obtained using both theories illustrate differences, with the crystal plasticity theory models showing closer agreement to published performance data. The implications of this for stent design are discussed.     

Molecular structure and storage hardening of natural rubber: Insight into the reactions between hydroxylamine and phospholipids linked to natural rubber molecule

The effect of hydroxylamine on the molecular structure and storage hardening of natural rubber (NR) was investigated by the treatment of deproteinized NR (DPNR) latex with hydroxylamine. The hydroxylamine treatment decreased the content of long‐chain fatty acid ester groups in DPNR from about 2–0.7 mol per rubber molecule. The molecular weight and molecular weight distribution changed apparently after treatment with hydroxylamine. The relative intensity of the ¹H NMR signals corresponding to phospholipids at the α‐terminal group decreased after the hydroxylamine treatment. The Huggins ‘k’ constant of hydroxylamine‐treated DPNR showed the liberation of linear rubber molecules caused by decomposition of branch points derived from phospholipids. The absence of storage hardening in hydroxylamine‐treated DPNR was observed to be caused by not only the reaction of hydroxylamine and aldehyde groups but also the removal of phospholipids as well as the breakdown of phospholipid aggregations as a result of hydroxylamime, contributing to the establishment of a newly proposed mechanism of hydroxylamine on the inhibition of storage hardening in NR. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43753.     

Obtaining written parent permission for school-based health surveys of urban young adolescents

The hmc operon of Desulfovibrio vulgaris subsp. vulgaris Hildenborough consists of six genes (hmcA to hmcF) that encode structural components of the high-molecular-mass cytochrome redox protein complex (the Hmc complex). Two genes (rrf1 and rrf2) encoding regulatory proteins are present downstream of hmcF. Expression of the hmc operon, monitored by incubating protein blots with HmcA-specific or HmcF-specific antibodies, was found to be highest when hydrogen was the sole electron donor for sulfate reduction. Use of lactate or pyruvate as electron donor reduced expression of the hmc operon. A mutant with a deletion of the rrf1 and rrf2 genes was generated with the sacB mutagenesis method. This mutant overexpressed the hmc operon approximately threefold. It grew more rapidly than the wild type when hydrogen was used as the electron donor for sulfate reduction, but more slowly than the wild type when lactate was used. The results indicate that a physiological function of the Hmc complex is in electron flow from hydrogen to sulfate. At least one redox carrier is shared competitively by the hydrogen and lactate oxidation pathways in D. vulgaris.     

Emerging technology for component life assessment

Operating plant component damage and failure experience is reviewed. Loading conditions such as thermal stratification and striping, turbulent flow and flow-induced vibrations are often found to limit useful life, even though such loadings were typically not considered when the components were designed. High cycle thermal and mechanical fatigue are identified as important damage mechanisms. A new method of correlating fatigue data and extrapolating to the very high cycle regime is described.

The results of environmental degradation testing during the past fifteen years have shown that such effects are much more deleterious than previously assumed. Therefore environmental and aging effects must be taken into account in evaluating the reliability and dependability of components for extended periods of operation. Since most of the available data on environmental effects focus on measured crack growth rates, methods of developing improved fatigue life evaluation methods which include environmental effects on crack growth rates are now being developed.

Fatigue tests on polished specimens are characterized by nominal stress amplitudes over yield, where linear elastic fracture mechanics (da/dn vs. ΔK) methods, such as those used in the ASME Code, are not valid. The small plastic zone corrections used in the Code do not account for the plastic crack-driving energies encountered in low-cycle fatigue testing. J-integral solutions are used herein to evaluate the growth of cracks in these specimens. This approach can be shown to correlate the growth of cracks over the entire range of loading from elastic to grossly plastic conditions in widely different geometries and sizes, including the growth of very short cracks for materials of major interest in pressure vessels and piping. It can be used to correct S-N fatigue life evaluation, curves for known differences in crack growth rates whether they are due to corrosion-assisted fatigue or other variables.

Environmental effects on the crack initiation phase of fatigue failure can be directly incorporated into S-N life evaluation curves. Once the crack propagation effects are included, the resulting improved S-N curves provide a means for plant operators to evaluate the current condition of these components and systems, taking into account the cumulative damage from operating transients and cycles which the plant has experienced. The safe residual life can then be evaluated using the S-N curves to include cumulative damage for the anticipated future period of operation. This plant life evaluation approach is applicable even where in-service inspections are not feasible. It provides a sound quantitative basis for making repair/replacement decisions.     

Analysis of a 62 kb DNA sequence of chromosome X reveals 36 open reading frames and a gene cluster with a counterpart on chromosome XI

We have sequenced a 61.989 bp stretch located between genes RAD7 and FIP1 of Saccharomyces cerevisiae chromosome X. This stretch contains 36 open reading frames (ORFs) of at least 100 codons. Fourteen of these correspond to sequences previously published as HIT1, CDC8, YAP17, CBF1, NAT1, RPA12, CCT5, TOR1, RFC2, PEM2, CDC11, MIR1, STE18 and GRR1. The proteins deduced from four ORFs (YJR059w, YJR065c, YJR075w, YJR078w) have significant similarity to proteins of known function from yeast or other organisms, including S. cerevisiae serine/threonine-specific protein kinase. Schizosaccharomyces pombe Act2 protein, S. cerevisiae mannosyltransferase OCH1 protein and mouse indoleamine 2,3-dioxygenase, respectively. Four of the remaining 18 ORFs have similarity to proteins with unknown function, six are weakly similar to other known sequences, while another eight exhibit no similarity to any known sequence. In addition, three tRNA genes have been recognized. Three genes clustered within 22 kb (YJR059w, YJR061w and TOR1) have counterparts arranged within 15 kb on the left arm of chromosome XI.     

Developmental sex differences in verbal learning

OBJECTIVE: To examine the health insurance experience and out-of-pocket health care costs of families with a child with IDDM. RESEARCH DESIGN AND METHODS: A case-control study of 197 families with a child with IDDM and 142 control families with no diabetic children was conducted. IDDM-affected families were identified from the Allegheny County IDDM Registry. Brothers and sisters of the parents in the IDDM-affected families were asked to participate as control subjects. Health insurance coverage and the money that families spent on health care services and supplies not reimbursed by insurance (out-of-pocket costs) were assessed by questionnaire. RESULTS: No difference was found between the IDDM-affected and control families in the percentages with or without insurance. Families with low household incomes ($10,000-$19,999) were at the greatest risk for having no insurance. While coverage provided by private plans was similar between the IDDM-affected and control families, many families had no reimbursement for insulin (10%), syringes (10%), or blood testing strips (30%). Out-of-pocket expenses were 56% higher in the IDDM-affected families than in the control families. Seventeen percent of the IDDM-affected families had expenses over 10% of their household income. This particularly affected families with low household incomes. Pre-existing illness clauses and insurance denial affected only a small proportion of the case families. CONCLUSIONS: These data illustrate that most families with a child with IDDM have health insurance, yet still incur larger out-of-pocket health care costs than do families without the presence of diabetes. IDDM-affected families likely face a number of economic decisions regarding health insurance and the use of health care.     

PICA: Backside failure analysis of CMOS circuits using Picosecond Imaging Circuit Analysis

Normal operation of complementary metal-oxide semiconductor (CMOS) devices entails the emission of picosecond pulses of light, which can be used to diagnose circuit problems. The pulses that are observed from submicron sized field effect transistors (FETs) are synchronous with logic state switching. Picosecond Imaging Circuit Analysis (PICA), a new optical imaging technique combining imaging with timing, spatially resolves individual devices at the 0.5 micron level and switching events on a 10 picosecond timescale. PICA is used here for the diagnostics of failures on two VLSI microprocessors.