Recovery of deuterium from hydrogen–deuterium mixture using palladium

The applicability of palladium for the separation of hydrogen isotopes (hydrogen and deuterium) is evaluated systematically by generating isotherm data and conducting column experiments in a laboratory set-up. Effect of various parameters such as concentration of the isotopic mixture, particle size, eluent flow rate, etc. is studied experimentally. A fixed-bed chromatographic model is developed and validated using the experimental data. The model is further used to predict the performance of a multi-column configuration for large-scale separation. Chromatographic separation is thus found to be a promising technique to achieve the required purity and hence it may be clubbed with the existing systems (e.g. cryogenic distillation) to obtain enhanced performance.     

Next-generation 10 GBaud module based on emerging SFP+ with host-based EDC [Topics in Optical Communications]

There has been an ongoing trend to require transceivers for use in datacom and telecom switches to be small and have low power dissipation to enable large port count switches. At speeds between 1 and 4 GBaud the SFP form factor is by far the most commonly used. Up to now 10 GBaud transceivers have used larger devices with larger power dissipations. This article describes the SFP+ module being specified by the SFF Committee (SFF 8431) that will enable the same port densities as the SFP module. The adaptive equalizers and high-speed transmission channels required in the switches to make the SFP+ module work successfully are also described     

Study of tablet-coating parameters for a pan coater through video imaging and Monte Carlo simulation

The movement of tablets in a pan coater and the exposure of different surfaces of tablets for deposition of coatings by spray-coating have been studied by video imaging and Monte Carlo simulation techniques. A representative variety of tablets of different shapes and sizes were used at different pan loads and at various pan speeds. A single “tracer” tablet was used to track the motion of tablets and coating variables such as circulation time, surface time, projected surface area and surface velocity of a tablet were determined from the video imaging experiments. The coating uniformity is described in terms of the coating variation from tablet to tablet CV(tt) and a new parameter CV(st) the coating variation on a single tablet. The effect of shape of tablets on coating uniformity was analyzed by introducing a “sphericity” of tablet (φ_s) into the CV models. The methodology, new models and the analysis developed here incorporating the additional parameters will help users to optimize the coating process in pan-coating operations.     

Optimization of the assignment of circuit cards to assembly lines in electronics assembly

Process planning is an important and integral function for ensuring efficient operations in printed circuit card assembly systems. This paper presents a new approach for solving the circuit card to assembly line assignment problem to minimize assembly time. This problem occurs frequently in process planning for electronic assembly systems and involves considering other interelated process planning problems. The line assignment problem is formulated as a large-scale mixed-integer programming problem and then solved using problem decomposition along with the branch-and-bound algorithm. Techniques for improving the solution time are discussed, and the solution approach is demonstrated using industry representative data sets from Lucent Technologies. For the data sets considered, the solution approach provides solutions within 3% of optimal in approximately 6 min of computation time on a Sun UltraSparc 2 Workstation. The solution approach developed for addressing the line assignment problem can serve as a useful decision-support tool by offering significant opportunities to improve the productivity and throughput of the assembly lines with improved process plans. The approach also allows planning engineers to respond faster to changes in production requirements. This research will be of interest to researchers in printed circuit card assembly systems and to practitioners in both original equipment manufacturing and contract assembly firms.