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1.
This paper deals with the connections existing between fuzzy set theory and fuzzy relational databases. Our new result dealing with fuzzy relations is how to calculate the greatest lower bound (glb) of two similarity relations. Our main contributions in fuzzy relational databases are establishing from fuzzy set theory what a fuzzy relational database should be (the result is both surprising and elegant), and making fuzzy relational databases even more robust.Our work in fuzzy relations and in fuzzy databases had led us into other interesting problems—two of which we mention in this paper. The first is primarily mathematical, and the second provides yet another connection between fuzzy set theory and artificial intelligence. In understanding similarity relations in terms of other fuzzy relations and in making fuzzy databases more robust, we work with closure and interior operators; we present some important properties of these operators. In establishing the connection between fuzzy set theory and artificial intelligence, we show that an abstraction on a set is in fact a partition on the set; that is, an abstraction defines an equivalence relation on the underlying set. 相似文献
2.
We present results from computer simulations of the events immediately following the scattering of a dark matter particle off a nucleus in a crystal detector. Our simulations show that with NaF as the target, the recoil produces solitary waves that decay slowly, resulting in a narrow wake of phonons. The phonon wake allows a determination of direction of the nuclear recoil. 相似文献
3.
Glory H. Anila Vigneswaran C. Jagtap Sujeet S. Shruthi R. Hariharan G. Sriram V. S. Shankar 《Neural computing & applications》2021,33(11):6065-6093
Neural Computing and Applications - “Brain–Computer Interface” (BCI)—a real-life support system provides a way for epileptic patients to improve their quality of life. In... 相似文献
4.
High-Thermal-Conductivity Aluminum Nitride Ceramics: The Effect of Thermodynamic, Kinetic, and Microstructural Factors 总被引:8,自引:0,他引:8
T. Barrett Jackson Anil V. Virkar Karren L. More Ralph B. Dinwiddie Jr. Raymond A. Cutler 《Journal of the American Ceramic Society》1997,80(6):1421-1435
Improvement in the thermal conductivity of aluminum nitride (AlN) can be realized by additives that have a high thermodynamic affinity toward alumina (Al2 O3 ), as is clearly demonstrated in the aluminum nitride-yttria (AlN-Y2 O3 ) system. A wide variety of lanthanide dopants are compared at equimolar lanthanide oxide:alumina (Ln2 O3 : Al2 O3 , where Ln is a lanthanide element) ratios, with samaria (Sm2 O3 ) and lutetia (Lu2 O3 ) being the dopants that give the highest- and lowest-thermal-conductivity AlN composites, respectively. The choice of the sintering aid and the dopant level is much more important than the microstructure that evolves during sintering. A contiguous AlN phase provides rapid heat conduction paths, even at short sintering times. AlN contiguity decreases slightly as the annealing times increase in the range of 1–1000 min at 1850°C. However, a substantial increase in thermal conductivity results, because of purification of AlN grains by dissolution-reprecipitation and bulk diffusion. Removal of grain-boundary phases, with a concurrent increase in AlN contiguity, occurs at high annealing temperatures or at long times and is a natural consequence of high dihedral angles (poor wetting) in liquidphase-sintered AlN ceramics. 相似文献
5.
Mamballykalathil N. Menon Ho T. Fang David C. Wu Michael G. Jenkins Mattison K. Ferber Karren L. More Camden R. Hubbard Theodore A. Nolan 《Journal of the American Ceramic Society》1994,77(5):1217-1227
Cylindrical buttuohead specimens of an advanced silicon nitride were tested in uniaxial tension at temperatures between 1422 and 1673 K. In the range 1477 to 1673 K, creep deformation was reliably measured using high-temperature contact probe extensometry. Extensive scanning and transmission electron microscopy has revealed the formation of lenticular cavities at two-grain junctions at all temperatures (1422–1673 K) and extensive triple-junction cavitation occurring at the higher temperatures (1644–1673 K). Cavitation is believed to be part of the net creep process. The stress rupture data show stratification of the Monkman–Grant lines with respect to temperature. Failure strain increased with increase in rupture time or temperature, or decrease in stress. Fractography showed that final failure occurred by subcritical crack growth in all specimens. 相似文献
6.
S. R. Bandler C. Enss G. Goldhaber R. E. Lanou H. J. Maris T. More F. S. Porter G. M. Seidel 《Journal of Low Temperature Physics》1993,93(3-4):715-720
Alpha particles stopped in a 3 liter volume of liquid helium at 30 mK are observed by the calorimetric detection of helium atoms evaporated from the free surface of the liquid. Quantum evaporation of the helium is produced by the rotons that are created by the particle. While the energy spectrum of the 5.5 MeV 's from the241Am source has a width of less than 0.5%, the energy distribution of the observed evaporation signals extends from the low energy threshold of several keV up to a maximum of several 100 keV, depending on geometrical factors and the collection area of the calorimeter. The origin of the observed distribution may result in part from the presence of the substrate and a dependence on the direction of the track of the particle. A simple model of the generation of rotons by the particle will be discussed. 相似文献
7.
Sorghum (cv. Maldandi M35-1) was modified to 12, 14 and 16% moisture content (m.c.) and heat-treated with microwave energy at 3 levels, for 30 sec (=4.5, 9 and 18 kJ), and 60 sec (=9, 18 and 36 kJ). The effect of microwave heating on rise and subsequent fall in grain temperature, reduction in m.c. and quality characteristics including germination, seedling dry matter, free fatty acids (FFA) and contaminant fungi was determined. The temperature attained and the moisture loss in the sorghum grain was affected by grain m.c. and the time of exposure. At the lowest and highest microwave treatment level grain temperatures reached 30–40°C and 90–101°C, respectively. However, a 60-sec treatment at the highest energy level was lethal for the grain, particularly at 14 and 16% m.c. The FFA values were unaffected by microwave treatment. Statistical analyses showed that the microwave power level and time individually, and power level × time interactions were significant for most quality characteristics. The fungi present most abundantly on the sorghum grain were Eurotium spp., Aspergillus candidus, A. niger and Penicillium spp. Increasing m.c. and microwave heating resulted in elimination of most fungi after a 30-sec exposure time. With a 60-sec exposure period, practically all fungi were eliminated from the grain. 相似文献
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10.
Brian J. Briscoe Enrico Pelillo Sujeet K. Sinha 《Polymer Engineering and Science》1996,36(24):2996-3005
This paper presents results obtained from the scratching of an ultrahigh molecular weight polyethylene (UHMWPE) and a polycarbonate (PC). The data are used to obtain various surface mechanical properties such as the hardness and also the prevailing deformation mechanisms. Scratch results are reported for the case of rigid conical indenters for various tip included angles, bulk temperatures, scratch velocities, and applied normal loads. Scanning electron microscopy (SEM) and laser profilometry data are used to study the surface deformation and damage mechanisms, and to assess the topography of the surfaces after scratching. Deformation maps are provided for these polymers under different experimental conditions, which describe the various deformation characteristics. In general, these polymers show both increasing and decreasing trends for the scratch hardness values with variation of cone angle, (4qW/ηd2; where W is the normal load, d the width of the residual scratch, and q is a characteristic contact parameter, which ranges between 1 and 2). The scratch velocity, which governs the imposed strain rate, imparts an increasing effect on the hardness values, whereas a higher bulk temperature of the material decreases the scratch hardness. The measured responses of the surface properties of these polymers are shown to greatly depend upon the kind of deformation mechanism prevalent during the scratching and associated material removal processes. 相似文献