管理史对MBA的边际效用

近年来 ,我国MBA的社会评价不高 ,其根本原因是MBA毕业生不能满足市场要求。本文通过分析管理史的功能 ,得出学习管理史对MBA的边际效用大 ,MBA培养方案中有必要增设管理史类的课程。     

Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy

This study investigates the effect of the composite addition of Al and Cu on the microstructure, physical properties, wettability, and corrosion properties of Sn–20Bi solder alloy. Scanning electron microscopy and X-ray diffraction were used to identify the microstructure morphology and composition. The spreading area and contact angle of the Sn–20Bi–x (x?=?0, 0.1 wt% Al, 0.5 wt% Cu, and 0.1 wt% Al–0.5 wt% Cu) alloys on Cu substrates were used to measure the wettability of solder alloys. The results indicate that the alloy with 0.1 wt% Al produces the largest dendrite and the composite addition of 0.1 wt% Al and 0.5 wt% Cu formed Cu₆Sn₅ and CuAl₂ intermetallic compounds in the alloy structure. And the electrical conductivity of Sn–20Bi–0.1Al is the best, which reaches 5.32 MS/m. The spread area of the solder alloy is reduced by the addition of 0.1 wt% Al and 0.5 wt% Cu, which is 80.7 mm². The corrosion products of Sn–20Bi–x solder alloys are mainly lamellar Sn₃O(OH)₂Cl₂ and the corrosion resistance of 0.1 wt% Al solder alloy alone is the best. The overall corrosion resistance of Sn–20Bi–0.1Al–0.5Cu is weakened and the corrosion of solder alloy is not uniform.

     

Effect of Ni and TiO2 particle addition on the wettability and interfacial reaction of Sn20Bi lead-free solder

Journal of Materials Science: Materials in Electronics - In this paper, the powder samples are mechanically ball-milled by powder metallurgy, cold pressed and shaped, then melted, and finally, the...