Interfacial microstructure and mechanical properties of Ti3SiC2 ceramic and TC11 alloy joint diffusion bonded with a Cu interlayer

Reliable joints of Ti₃SiC₂ ceramic and TC11 alloy were diffusion bonded with a 50 μm thick Cu interlayer. The typical interfacial structure of the diffusion boned joint, which was dependent on the interdiffusion and chemical reactions between Al, Si and Ti atoms from the base materials and Cu interlayer, was TC11/α-Ti + β-Ti + Ti₂Cu + TiCu/Ti₅Si₄ + TiSiCu/Cu(s, s)/Ti₃SiC₂. The influence of bonding temperature and time on the interfacial structure and mechanical properties of Ti₃SiC₂/Cu/TC11 joint was analyzed. With the increase of bonding temperature and time, the joint shear strength was gradually increased due to enhanced atomic diffusion. However, the thickness of Ti₅Si₄ and TiSiCu layers with high microhardness increased for a long holding time, resulting in the reduction of bonding strength. The maximum shear strength of 251 ± 6 MPa was obtained for the joint diffusion bonded at 850 °C for 60 min, and fracture primarily occurred at the diffusion layer adjacent to the Ti₃SiC₂ substrate. This work provided an economical and convenient solution for broadening the engineering application of Ti₃SiC₂ ceramic.     

One-Dimensional Deep Convolutional Neural Network for Mineral Classification from Raman Spectroscopy

Neural Processing Letters - Raman spectroscopy is often used for the composition determination and rapid classification of materials because it can reflect the molecular information of materials....     

Fractional order battery modelling methodologies for electric vehicle applications: Recent advances and perspectives

Science China Technological Sciences - Accurate modelling of lithium ion batteries is crucial for battery management in electric vehicles. Recent studies have revealed the fractional order nature...     

A review on ultrasonic spot welding of copper alloys

As a solid state joining process, ultrasonic spot welding has been proven to be a promising technique for joining copper alloys. However, challenges still remain in employing ultrasonic spot welding to join copper alloys. This article comprehensively reviews the current state of ultrasonic spot welding of copper alloys with a number of critical issues including materials flow, plastic deformation, temperature distribution, vibration, relative motion, vertical displacement, interface friction coefficient, online monitoring technique, coupled with the macrostructure and microstructure, the mechanical properties and electrical conductivity. In addition, the future trends in this field are provided.     

快速切换(SMED)在空调制造厂的研究与应用

在目前市场需求呈现规模扩张和品类个性化的冲击下,制造业面对的竞争压力愈发明显.且随着新时代自动化、信息化、大数据智能化等先进制造特征的兴起,更加促使制造业向转型升级不断进军.以空调制造业的控制器版块为例,从制约此单位效率的SMT车间切换浪费为切入点,在SMED快速换模的理念基础上,通过使用IE分析工具对切换流程进行研究,提炼出一套多模组固定料站切换模型,同时结合自动化、信息化等智能制造技术引进,完成SMT车间人力投入减少35人,日均产出点数提升18.29％,设备运行率提升15.46％,综合成本降低110.6万元/年的效益.成功推广应用至电子物料拣选版块,并开发信息化看板,夯实应用效益,再次证实"多模组固定料站"快速切换模型是典型小、多、高生产模式,具有可行性的解决方案.