艾叶精油化学成分研究

本文用水蒸气蒸馏法提取了不同产地艾叶精油,采用GC-MS技术分析了艾叶精油的化学成分。结果不同产地艾叶精油的质量收率为0.29%～0.56%,都含有特征成分:α-蒎烯、β-蒎烯、α-松油烯、γ-松油烯、桉叶素、蒿酮、蒿醇、2-环己烯-1-醇、樟脑、龙脑、4-松油醇、反式-石竹烯、丁子香酚。其中具有药效作用的成分有桉叶素(14.32%～26.12%,质量百分数,下同),樟脑(3.66%～14.97%)、龙脑(0.51%～10.53%)、甘菊环(0.00%～23.95%)等,有毒成分侧柏酮含量为0.32%～3.62%。     

Multipoint scanning dual‐detection confocal microscopy for fast 3D volumetric measurement

We propose a multipoint scanning dual‐detection confocal microscopy (MS‐DDCM) system for fast 3D volumetric measurements. Unlike conventional confocal microscopy, MS‐DDCM can accomplish surface profiling without axial scanning. Also, to rapidly obtain 2D images, the MS‐DDCM employs a multipoint scanning technique, with a digital micromirror device used to produce arrays of effective pinholes, which are then scanned. The MS‐DDCM is composed of two CCDs: one collects the conjugate images and the other collects nonconjugate images. The ratio of the axial response curves, measured by the two detectors, provides a linear relationship between the height of the sample surface and the ratio of the intensity signals. Furthermore, the difference between the two images results in enhanced contrast. The normalising effect of the MS‐DDCM provides accurate sample heights, even when the reflectance distribution of the surface varies. Experimental results confirmed that the MS‐DDCM achieved high‐speed surface profiling with improved image contrast capability.     

Relation between etching profile and voltage–current shape of sintered SiC etching by atmospheric pressure plasma

Sintered silicon carbide (SiC) was etched by a dielectric barrier discharge source. A high voltage bipolar pulse was used with helium gas for the plasma generation. One stable filament plasma was generated and could be used for SiC etching. As the processing gas (NF₃) mixing rate increased, the width and depth of the etching profile became narrower and deeper. The differentiated V–Q Lissajous method was used for measuring the capacitances (C_eq) of the electrode after the plasma turned on. The width of the etching profile was proportional to C_eq. As the current peak value I_smx of the substrate current increased, the volume removal rate of SiC increased. The etch depth was proportional to the ratio of I_smx to C_eq. Additionally, because of the different characteristics of the plasma disks on SiC substrate by the voltage polarity, the etching profile was unstable. However, in high NF₃ mixing process, the etching profile became stable and deeper.     

Numerical Modeling of a Spar Platform Tethered by a Mooring Cable

Virtual simulation is an economical and efficient method in mechanical system design. Numerical modeling of a spar platform, tethered by a mooring cable with a spherical joint is developed for the dyna...     

A Study of the Heat Transfer Characteristics of an FC-72(C6F14) Two-Phase Closed Thermosyphon with Helical Grooves on the Inner Surface

This study is a fundamental work performed to obtain basic information about designing two-phase closed thermosyphons with a working fluid of FC-72 (C₆F₁₄). FC-72 is a kind of alternative refrigerant designed to be chemically safe and more environmentally friendly than any other conventional CFC refrigerants.

To obtain experimental data on operational performances of a FC-72 two-phase closed thermosyphon, an experimental model was designed and manufactured with a micro fin groove copper tube with an outside diameter of 22.2 mm for its container, on which a series of operational performance tests were conducted. Its maximum capacity of heat transport rate was designed to be about 300–400 W. The focus was given to investigate the effects of such parameters as micro fin grooves and fill charge ratios on operational performances of the FC-72 two-phase closed thermosyphon. The experimental data on phase change heat transfer coefficients and heat transport limitations were compared with some corresponding correlations, and a couple of measures that would help to predict operational performances were suggested with some physical explanations.