Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Use of radial forces for fault detection in tapping

A model-based method for fault detection in tapping based on torque and radial forces is proposed. The method allows the identification of faults typical of a tapping operation including axial misalignment, tap runout, tooth breakage both singly and together. The validation experiments have been run on aluminum 356 workpieces for different combinations of process faults. Results have shown that the model predictions are in good agreement with the experimental radial force and torque signals under various fault conditions.     

A new approach to study organic solar cell using Lambert W-function

Organic photovoltaic solar cells bear an important potential of development in the search for low-cost modules for the production of domestic electricity. One of the main differences between inorganic and organic solar cells is that photo-excitation in these materials does not automatically lead to the generation of free charge carriers, but to bind electron–hole pairs (exciton) with a binding energy of about 0.4 eV. Till now various numerical methods using approximations have been reported to study different aspects of organic solar cells. For the first time an accurate method using Lambert W-function is presented to study different parameters of organic solar cells.     

Neural networks for contract bridge bidding

The objective of this study is to explore the possibility of capturing the reasoning process used in bidding a hand in a bridge game by an artificial neural network. We show that a multilayer feedforward neural network can be trained to learn to make an opening bid with a new hand. The game of bridge, like many other games used in artificial intelligence, can easily be represented in a machine. But, unlike most games used in artificial intelligence, bridge uses subtle reasoning over and above the agreed conventional system, to make a bid from the pattern of a given hand. Although it is difficult for a player to spell out the precise reasoning process he uses, we find that a neural network can indeed capture it. We demonstrate the results for the case of one-level opening bids, and discuss the need for a hierarchical architecture to deal with bids at all levels.     

下一代SONET/SDH对网络部署的冲击

面对电信业的低迷,运营商和设备制造商都捏紧了钱袋,想方设法少花钱多办事。这就意味着,必须改进现有传输网(见图1),使话音和数据传输效率更高。从网络部署的角度来看,运营商需要:用一些有效的方法,将多协议数据转换到SONET/SDH信道上;用一种灵活的带宽适应机制,使SONET/SDH信道大小与在其中传输的数据的需求相一致;用一种机制,灵活并以理想的动态方式改变整个SONET/SDH网络的信道带宽。这就要求集成电路供应商提供有助于在SONET/SDH上有效传输数据的芯片。虽然现在有多种SONET/SDH信息包(PoS)产品,但是它们的转换效率都太…     

Sodium silicate as a coke inhibitor during naphtha pyrolysis

Rates of coke formation during steam pyrolysis of naphtha have been investigated in a jet-stirred reactor both for sodium silicate coated and uncoated Inconel 600 surfaces in the temperature range of 1078–1108 K. Coke formation rates were significantly reduced on sodium silicate coated plates due to the passivation of the metal surface. However, the coking rates gradually increased with successive decokings of the coated surface.     

Stability and throughput analysis of unslotted CDMA‐ALOHA with finite number of users and code sharing

We consider a system comprising a finite number of nodes, with infinite packet buffers, that use unslotted ALOHA with Code Division Multiple Access (CDMA) to share a channel for transmitting packetised data. We propose a simple model for packet transmission and retransmission at each node, and show that saturation throughput in this model yields a sufficient condition for the stability of the packet buffers; we interpret this as the capacity of the access method. We calculate and compare the capacities of CDMA‐ALOHA (with and without code sharing) and TDMA‐ALOHA; we also consider carrier sensing and collision detection versions of these protocols. In each case, saturation throughput can be obtained via analysis of a continuous time Markov chain. Our results show how saturation throughput degrades with code‐sharing. Finally, we also present some simulation results for mean packet delay. Our work is motivated by optical CDMA in which “chips” can be optically generated, and hence the achievable chip rate can exceed the achievable TDMA bit rate which is limited by electronics. Code sharing may be useful in the optical CDMA context as it reduces the number of optical correlators at the receivers. Our throughput results help to quantify by how much the CDMA chip rate should exceed the TDMA bit rate so that CDMA‐ALOHA yields better capacity than TDMA‐ALOHA. This revised version was published online in June 2006 with corrections to the Cover Date.