Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications

Hermetic sealing of microelectromechanical system sensors is indispensable to ensure their reliable operation and also to provide protection during fabrication. This work proposes two prospective candidates for hermetic sealing for rugged environment applications, i.e., Al-Ge and Pt-In. Al-Ge was chosen due to its compatibility with complementary metal–oxide–semiconductor technology. Pt-In possesses the highest remelting temperature among all the solder systems, which is desired for high-temperature applications in both the energy and aerospace industries. The various bonding parameters for Al-Ge eutectic bonding and Pt-In transient liquid-phase (TLP) bonding have been optimized, and their influence on the bond quality is reported. Optimization of bonding parameters has been carried out with the objective of ensuring void-free bonds. A new configuration for stacking Al-Ge thin films has been demonstrated to tackle the issue of loss of Ge prior to bonding, since native Ge oxides are soluble in deionized water. The impact of solid-state aging prior to Al-Ge eutectic bonding has been investigated. The method of tailoring the phases in the Pt-In joint is also discussed. The prospects and constraints of eutectic and TLP bonding from the hermeticity perspective are discussed in detail. Furthermore, changes in the microstructure under aging at 300°C up to 500 h and the resulting influence on the mechanical properties are presented. The overall finding of this work is that Al-Ge can achieve better mechanical and hermetic performance for high-temperature applications.     

Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics

High-temperature electronics will facilitate deeper drilling, accessing harder-to-reach fossil fuels in oil and gas industry. A key requirement is reliability under harsh conditions for a minimum continuous operating time of 500?h at 300°C. Eutectic solder alloys are generally favored due to their excellent fatigue resistance. Performance of Au-Ge and Au-Si eutectic solder alloys at 300°C up to 500?h has been evaluated. Nanoindentation results confirm the loss of strength of Au-Ge and Au-Si eutectic solder alloys during thermal aging at 300°C, as a result of grain coarsening. However, the pace at which the Au-Ge eutectic alloy loses its strength is much slower when compared with Au-Si eutectic alloy. The interfacial reactions between these eutectic solder alloys and the underbump metallization (UBM), i.e., electroless nickel immersion gold (ENIG) UBM and Cu/Au UBM, have been extensively studied. Spalling of Au₃Cu intermetallic compound is observed at the interface between Au-Ge eutectic solder and the Cu/Au UBM, when aged at 300°C for 500?h, while the consumption of ENIG UBM is nominal. Unlike the Au-Si solder joint, hot ball shear testing at high temperature confirmed that the Au-Ge joint on ENIG UBM, when aged at 300°C for 500?h, could still comply with the minimum qualifying bump shear strength based on the UBM dimension used in this work. Thus, it has been determined that, among these two binary eutectic alloys, Au-Ge eutectic alloy could fulfill the minimum requirement specified by the oil and gas exploration industry.     

Dopant profile and gate geometric effects on polysilicon gatedepletion in scaled MOS

Polysilicon depletion effects show a strong gate length dependence according to experimental p-channel MOS capacitance-voltage (C-V) data. The effect can be influenced not only by gate geometries, but also by dopant profiles in poly-gates. These effects have been modeled and verified using device simulation. Nonuniform dopant distributions in the vertical and lateral direction in the poly-gate cause additional potential drops. The potential drop in the poly-gate becomes critical as the gate geometry is scaled down due to edge and corner depletions resulting from fringing electric fields     

Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging

Ultrahigh-vacuum conditions can be achieved by employing porous absorbent materials such as Ti, Zr, Ta, and Yt. Commercial getters are primarily Zr-based, since Zr possesses the best adsorption characteristics. Titanium is not considered as a candidate, since adsorption of gases by Ti is significantly reduced due to oxidation and other contamination. In the present work, it is demonstrated that the adsorption property of Ti can be substantially enhanced and benchmarked against other Zr-based commercial getters by employing a sacrificial layer such as Ni over Ti, and also by using other surface engineering techniques. It has been confirmed that, in addition to the activation temperature, the vacuum level during getter activation also plays a pivotal role in influencing the adsorption characteristics of Ti. It has been determined that the getter life could be significantly improved by the reversible adsorption characteristic of H₂ gas, facilitating regeneration cycles.     

Cyanate Ester-Based Encapsulation Material for High-Temperature Applications

Cyanate ester resin-based composite materials have been proposed as potential encapsulants for high-temperature applications. The objective of this study is to develop a cyanate ester-based encapsulant, which can also serve as a flip-chip underfill as well as for traditional encapsulation. Two different materials, quartz and alumina fillers, have been studied. The impact of shapes and sizes of the fillers on the overall thermomechanical properties has been investigated. The adhesion strengths of the materials to the ceramic substrate, Kovar lid, and silicon die have also been characterized. The modulus of the resin and the shape of the fillers play a pivotal role in minimizing thermal stress, generated by coefficient of thermal expansion mismatches. Smaller filler particles were found to have better adhesion to the cyanate ester resin. The high-temperature performance of the cyanate ester-based encapsulants was evaluated by thermal aging at 300°C for up to 500 h.     

Graphene oxide reinforced polyvinyl alcohol/polyethylene glycol blend composites as high-performance dielectric material

Novel flexible dielectric composites composed of polyvinyl alcohol (PVA), polyethylene glycol (PEG), and graphene oxide (GO) with high dielectric constant and low dielectric loss have been developed using facile and eco-friendly colloidal processing technique. The structure and morphology of the PVA/PEG/GO composites were evaluated using Fourier transform infrared spectroscopy (FTIR), Raman spectroscopy, UV-vis spectroscopy (UV-vis), X-ray diffraction (XRD), scanning electron microscopy (SEM), and atomic force microscopy (AFM). The dielectric behavior of PVA/PEG/GO composites was investigated in the wide range of frequencies from 50 Hz to 20 MHz and temperature in the range 40 to 150 °C using impedance spectroscopy. The dielectric constant for PVA and PVA/PEG (50/50) blend film was found to be 10.71 (50 Hz, 150 °C) and 31.22 (50 Hz, 150 °C), respectively. The dielectric constant for PVA/PEG/GO composite with 3 wt% GO was found to be 644.39 (50 Hz, 150 °C) which is 60 times greater than the dielectric constant of PVA and 20 times greater than the dielectric constant of PVA/PEG (50/50) blend film. The PVA/PEG/GO composites not only show high dielectric constant but also show low dielectric loss which is highly attractive for practical applications. These findings underline the possibilities of using PVA/PEG/GO composites as a flexible dielectric material for high-performance energy storage applications such as embedded capacitors.     

Optimal temperature policies for catalytic transport reactors under periodic operation

The influence of inlet gas concentration cycling on the optimal temperature policy of catalytic transport reactors is studied theoretically. The model considered is based on plug flow of gas and catalyst particles with negligible interand intra-particle diffusional resistances and concentration dependent deactivation kinetics. To utilise the concentration of the reactant and the activity of the deactivating catalyst fully a proper temperature sequence along the reactor is needed. Thus, a general optimal temperature policy using the continuous minimum principle is derived for the reactor under periodic operation. The model equations are solved analytically for gas concentration, activity and temperature profiles. Resonance behaviour (maximum in conversion with pulse width) is obtained using the optimal temperature policy for certain sets of parameters. The effects of activation energy groups, reaction and deactivation constant groups and inlet temperature on the optimal temperature policy under periodic operation are evaluated. In all cases an improvement in conversion with the optimal temperature policy under periodic operation over that with an isothermal policy under periodic operation is obtained. A suboptimal policy, comprising constant temperature over different reactor sections, which is useful for implementation purposes is also discussed.     

Effect of graft copolymerization of mixtures of acrylamide and methyl methacrylate on mechanical properties of jute fibers of different compositions

The role of persulfate-induced graft copolymerization of mixtures of acrylamide and methyl methacrylate at 50°C in modifying mechanical properties of jute fibers of different compositions was studied in a limited aqueous system following a pretreatment technique. Results obtained indicate that such a process admits a good scope for modification of mechanical properties of jute fiber depending on degree of grafting achieved and compositional variations of (1) the feed monomer mixture and (2) the multiconstituent jute itself, consequent to selective removal of lignin and hemicellulose to different extents from the fiber. Low to moderate removal of hemicellulose is more effective than a similar degree of removal of lignin from jute in rendering the fiber more amenable to vinyl grafting using the mixed monomer system without being adversely affected with respect to tensile properties. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 1139–1147, 1998     

Modelling of abrasive particle energy in water jet machining

A phenomenological model of the three-phase flow inside an abrasive water jet machining cutting head has been developed. Several improvements over previously presented models such as taking into account the abrasive particle size distribution, and the effect of breakage of particles on the energy flux have been made. The model has been validated using an extensive set of experimental data with wide variations in cutting-head geometry, operating pressure, and abrasive mass flow rates. The cross-sectional averaged abrasive particle velocity at the exit of the focussing tube has been predicted with good accuracy over the whole range of experiments. In particular, the Pearson correlation between the model and the experimental results is found to be more than 95%, implying the utility of this model in design.